JPS63140545U - - Google Patents
Info
- Publication number
- JPS63140545U JPS63140545U JP3188087U JP3188087U JPS63140545U JP S63140545 U JPS63140545 U JP S63140545U JP 3188087 U JP3188087 U JP 3188087U JP 3188087 U JP3188087 U JP 3188087U JP S63140545 U JPS63140545 U JP S63140545U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- heating element
- discharge device
- foil pattern
- element layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3188087U JPS63140545U (cs) | 1987-03-06 | 1987-03-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3188087U JPS63140545U (cs) | 1987-03-06 | 1987-03-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63140545U true JPS63140545U (cs) | 1988-09-16 |
Family
ID=30838023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3188087U Pending JPS63140545U (cs) | 1987-03-06 | 1987-03-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63140545U (cs) |
-
1987
- 1987-03-06 JP JP3188087U patent/JPS63140545U/ja active Pending
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