JPS63138750A - Prealignment device for semiconductor die bonding device - Google Patents

Abstract

PURPOSE:To miniaturize a mechanism section, and to make a prealignment device easily to correspond to the dimensional change of a pellet by using a linear pulse motor as a driving source, introducing an elastic member into a guide frame between a linearly movable arm and a pre-alignment pawl and detecting the displacement of the elastic member. CONSTITUTION:A pre-alignment device has two pairs of linear pulse motors 22, which are arranged at mutually opposite positions and disposed at positions where lines tying these linear pulse motors 22 mutually cross at right angles, two pairs of linearly movable arms 23 driven in the central direction by each linear pulse motor 22 and guide frames 24 mounted on respective linearly movable arm 23. Compression springs 26 as elastic members, one ends of which are connected at the end sections of the linearly movable arms 23 in the guide frames 24, alignment pawls 25 being engaged with other ends of the compression springs 26 and having base sections 25a shifting in the guide frames 24, and detectors 27 detecting the displacement of the compression springs 26 are set up. Accordingly, a mechanism is compacted, and the pre-alignment device can be made to correspond to the dimensional change of a pellet easily.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a prealignment device for a semiconductor die bonding device.

(Prior Art) A semiconductor die bonding apparatus is an apparatus for bonding a pellet to a predetermined position of a lead frame, a substrate, etc., and basically has a configuration as shown in FIG. That is, a first transport device 4 transports the pellets from the tray 1 storing the pellets (chinbu) to the pre-alignment mechanism section 2, and a second transport device 4 transports the pellets from the pre-alignment mechanism section 2 to the bonding position of the substrate 3. It consists of a transport device 5.

The pre-alignment mechanism section 2 in such a semiconductor die bonding apparatus corrects the posture of the pellet conveyed from the tray 1.

The configuration of this pre-alignment mechanism section will be explained below.

FIG. 6 is a perspective view of the pre-alignment mechanism, and FIG. 7 is a sectional view taken along the line ■--■ in FIG. 6.

In the figure, 11 is a pellet, 12 is an alignment claw, 13 is an alignment stage, 14 is a cam, 15 is a cam follower, and 16 is a through hole.

Here, when the pellet 11 is on the pellet stage 13, the pellet 11 is sucked through the through hole 16.

Two sets of alignment claws 12 are arranged on the alignment stage so as to be perpendicular to each other, and the alignment claws 12 are configured to be capable of forward and backward linear movement via a cam follower 15 by rotation of the cam 14. Note that examples of this type of technology include, for example, Utility Model Application Publication No. 60-2834 and Japanese Patent Application Publication No. 61-115331.

Next, the operation of the pre-alignment mechanism will be explained with reference to FIG.

First, the pellet 11 carried by the conveying device 4 from the tray 1 (FIG. 5) is placed on the pre-alignment mechanism section 2, and the pellet 11 is attracted to the alignment stage 13 through the through hole 16.

Next, the motor of the pre-alignment mechanism section 2 rotates, and the cam follower 15 is displaced by the rotation of the cam 14 linked thereto, and each alignment pawl 12 linked to the tip of the cam follower 15 moves forward. Then, the collet of the conveying device 5 descends to the surface of the pellet in which the posture of the pellet 11 is corrected, that is, the alignment claw 12 is in contact with the pellet 11, and the pellet is Adsorb 11. At this time, the vacuum system that is sucking the pellet 11 of the alignment stage 13 is turned off. Then, the pre-alignment pawl 12 retreats, the collet rises, and the pellet 11 is carried to the substrate 3, which is the bonding position, and is bonded.

(Problems to be Solved by the Invention) As mentioned above, in order to correct the posture of the pellet, it is necessary to accurately determine the amount of movement of the alignment claw. Since the amount of movement of the pawl is determined by the shape (outline curve) of the cam 14, the amount of movement of this alignment pawl cannot be made large. Therefore, there was a limit to the size of pellets that could be pre-aligned. In other words, it was not possible to flexibly adapt to changes in the dimensions of the pellet, and there was no versatility. Further, as shown in FIGS. 6 and 7, the space occupied by the component parts is quite large. Furthermore, when attempting to perform highly accurate positioning using this mechanism, there is a problem in that the series of drive mechanisms including the motor and cam become larger.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a pre-alignment device for a semiconductor die bonding device that eliminates the above-mentioned problems, has a compact mechanism, and can easily accommodate changes in pellet dimensions with high precision.

(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a pre-alignment device for a semiconductor die bonding device in which the devices are arranged at positions facing each other, and the lines connecting them are orthogonal to each other. two pairs of linear pulse motors arranged at different positions, two pairs of linear movement arms driven toward the center by each linear pulse motor, a guide frame provided on each linear movement arm, and a A compression spring as an elastic member that locks one end to the end of the linear movement arm, an alignment claw that is locked to the other end of the compression spring and has a base that moves within the guide frame, and displacement of the compression spring. A detection device is provided for detecting.

(Function) According to the present invention, as configured as described above, a linear movement arm driven by a linear pulse motor can be linked via a compression spring to the alignment claw that corrects the position of the pellet, and the alignment claw The amount of movement can be set digitally. Further, the displacement of the compression spring is detected by the detection device, and the fact that the alignment claw is pressed against the pellet is detected by a simple mechanism, so that the operation can be automatically controlled.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of a pre-alignment device of a semiconductor die bonding device showing an embodiment of the present invention, FIG. 2 is a cutaway top view showing the main parts of the pre-alignment device, and FIG.
The figure is an explanatory diagram of the operation of the prealignment device.

In the figure, 20 is a small-diameter disk-shaped alignment stage;
1 is a pellet to be aligned; 22 is a pair of linear pulse motors (LPM) arranged facing each other on the X and Y axes; 23 is a linear movement arm driven by each linear pulse motor; 24 is a linear movement arm thereof; A guide frame driven together with the linear moving arm, 25 an alignment claw, 25a a base of the alignment claw, 26
27 is a sensor as a detection device; 27 is a sensor as a detection device; 27 is a sensor as a detection device; A detection part of the sensor is provided inside the guide frame 24, and 27b is a detected object of the sensor, which is provided at the base 25a of the alignment claw. As this detection device, various sensors such as a gap sensor, a proximity switch, etc. can be used. In this case, it is possible to set the sensitive area appropriately and to operate when the base portion 25a of the alignment claw is displaced beyond a set distance (set value).

Next, the operation of this pre-alignment device will be explained using FIG. 3.

First, a linear pulse motor (LPM) is applied to the pellet 21 placed casually on the alignment stage 20.
22 does not operate, the linear moving arm 23 is in a retracted state, as shown in FIG. 3(a), and the alignment claw 25 is at the farthest position 1lf (
However, this position can be arbitrarily set using the linear pulse motor 22.

Next, when a sensor or the like detects that the pellet 21 is on the alignment stage 2o, it is temporarily fixed on the alignment stage 20 by vacuum suction. Then, the linear pulse motor 22 is driven, and the alignment claw 25 assembled on the guide frame 24 moves forward toward the pellet 21, and as shown in FIG. 3(b), the pushed out alignment claw 25 pellet 21
comes into contact with.

Further, when the linear pulse motors 22 on both sides advance the alignment claws 25 and press the pellet 21, the compression spring 26 is compressed and displaced as shown in FIG. 3(c). In other words, the base 2 of the alignment claw 25
5a retreats into the guide frame 24. Then, the second
As shown in the figure, the detected object 27b of the sensor is displaced relative to its detection section 27a and outputs a detection signal.

This output signal immediately stops the driving of the linear pulse motor 22, and the alignment claw 25 suddenly stops. Such operations are performed on the X and Y axes, and the position of the pellet 21 is corrected by the alignment claws 25 in four directions, and the alignment is completed.

In the above embodiment, a compression spring is provided between the linear movement arm and the alignment claw, but the present invention is not limited to this. It may also be an elastic member.

Furthermore, the operation of this pre-alignment device will be explained along the flowchart of FIG. 4.

■Place the bellet on the alignment stage.

■Check whether the pellet is on the alignment stage using a sensor. As a result, if there are no pellets, wait for pellet supply.

■If the pellet is on the alignment stage, adsorb the pellet onto the alignment stage.

■When the pellet is adsorbed onto the alignment stage,
Drive each linear pulse motor.

■Each alignment claw moves forward.

■Opposing alignment claws come into contact with the pellets and press the pellets against each other.

■The elastic member in the guide frame is displaced.

(2) Determine whether the displacements of the elastic members in the opposing guide frames both exceed a set value. If the displacement of the elastic member is less than the set value, return to step (3).

(2) If both the displacements of the elastic members exceed the set values, the detection device operates.

The opposing linear pulse motor is stopped by the operation of the 0 detection device.

■The alignment claw stops.

■The pellet is fixed from all sides and aligned.

As described in detail above, even if the dimensions of the pellet change, it can be appropriately handled.

Further, by using a linear pulse motor as a drive source, a pre-alignment mechanism that can digitally set the position of the linearly moving arm can be obtained.

Furthermore, the alignment stage and its surrounding mechanisms can be simplified and downsized.

Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, a linear pulse motor is used as the drive source of the pre-alignment mechanism, and the inside of the guide frame between the linearly moving arm and the pre-alignment claw is Since an elastic member is inserted in and the displacement of the elastic member can be detected, (1) the pre-alignment mechanism can be made more compact;

(2) Even if the pellet dimensions are changed, the pellet clamping dimensions can be set digitally and can be set in a short time.

(3) A more accurate alignment device can be obtained than pre-alignment using a cam mechanism.

(4) It is possible to detect with a simple mechanism that the alignment claw is pressed against the pellet from both sides, and to automatically control the operation.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a pre-alignment device of a semiconductor die bonding device showing an embodiment of the present invention, FIG. 2 is a cutaway top view of the main parts of the pre-alignment device, and FIG. 3 is an explanation of the operation of the pre-alignment device. 4 is an operation flowchart of the pre-alignment device, FIG. 5 is a schematic diagram of the semiconductor die bonding device, FIG. 6 is a perspective view of the conventional pre-alignment (114) section, and FIG.
It is a sectional view taken along the line ■-■ in the figure. 20... Alignment stage, 21... Pellet, 22... Linear pulse motor (LPM), 23...
・Linear movement arm, 24...Guide frame, 25・
... Alignment claw, 25a... Base of alignment claw, 26... Compression spring, 27... Detection device.

Claims (1)

[Scope of Claims] (a) two pairs of linear pulse motors arranged at positions facing each other and at positions where lines connecting them are orthogonal to each other; (b) each linear pulse motor is driven in the central direction (c) a guide frame provided on each linearly moving arm; (d) an elastic member having one end locked to an end of the linearly moving arm within the guide frame; , (e) an alignment claw having a base that is locked to the other end of the elastic member and moves within the guide frame; and (f) a detection device that detects displacement of the elastic member. Pre-alignment equipment for semiconductor die bonding equipment.