JPS63136365U - - Google Patents
Info
- Publication number
- JPS63136365U JPS63136365U JP2743987U JP2743987U JPS63136365U JP S63136365 U JPS63136365 U JP S63136365U JP 2743987 U JP2743987 U JP 2743987U JP 2743987 U JP2743987 U JP 2743987U JP S63136365 U JPS63136365 U JP S63136365U
- Authority
- JP
- Japan
- Prior art keywords
- hill
- concave
- solder
- display device
- led display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2743987U JPS63136365U (US06818201-20041116-C00086.png) | 1987-02-27 | 1987-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2743987U JPS63136365U (US06818201-20041116-C00086.png) | 1987-02-27 | 1987-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136365U true JPS63136365U (US06818201-20041116-C00086.png) | 1988-09-07 |
Family
ID=30829468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2743987U Pending JPS63136365U (US06818201-20041116-C00086.png) | 1987-02-27 | 1987-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136365U (US06818201-20041116-C00086.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001291905A (ja) * | 2000-04-11 | 2001-10-19 | Nichia Chem Ind Ltd | 光半導体素子 |
| JP2011044752A (ja) * | 2010-12-02 | 2011-03-03 | Nichia Corp | 光半導体素子の製造方法 |
-
1987
- 1987-02-27 JP JP2743987U patent/JPS63136365U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001291905A (ja) * | 2000-04-11 | 2001-10-19 | Nichia Chem Ind Ltd | 光半導体素子 |
| JP4677653B2 (ja) * | 2000-04-11 | 2011-04-27 | 日亜化学工業株式会社 | 光半導体素子 |
| JP2011044752A (ja) * | 2010-12-02 | 2011-03-03 | Nichia Corp | 光半導体素子の製造方法 |
