JPS63134247A - Ink jet head and manufacture thereof - Google Patents

Abstract

PURPOSE:To enhance printing quality, by providing a metallic film on an insulating substrate, coating the metallic film with a resist at parts other than a part for providing a partition wall, providing the partition wall by plating with a metal, then removing the resist, and joining the resultant assembly to a nozzle plate into a body. CONSTITUTION:A substrate is provided with a plurality of heat generating resistors 12, selection electrodes 13 and a common electrode 14 for supplying electrical signals to the resistors 12, and an insulating protective film 15 for protecting these components. A partition wall 18 is provided on the insulating substrate in a body, so that it is unnecessary to position the substrate 11 and a partition wall plate relative to each other. Therefore, it is necessary only to position the partition wall 18 (substrate 11) and a nozzle plate 17 relative to each other, and high positional accuracy can be obtained. Further, a metallic film 16 is provided on the entire surface of the substrate, so that a favorable heat-releasing property is obtained. Thus, printing quality is enhanced, and printing speed is enhanced due to the favorable heat-releasting effect.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an inkjet head and a method for manufacturing the same.

[Conventional technology]

FIG. 2 shows an exploded perspective view of a conventional inkjet head.

In the figure, 1 is a substrate made of an electrically insulating material such as glass or ceramic, and 6 is a nozzle plate made of a material such as stainless steel, in which nozzle holes 7 for ink ejection are formed. 8 is a bonding film having adhesive properties for bonding the substrate 1 and the nozzle &6;
is a partition plate that is joined to the nozzle 6 and partitions each nozzle hole 7.

A heat generating resistor 2 is formed on the substrate 1, and arbitrary electric energy is applied to the heat generating resistor 21 according to the record information through the selection book 41j3, so that thermal energy is generated. The ink near the surface of the heat generating resistor 2 of the ink liquid (not shown) which is constantly in the groove in the ink chamber 4 receives thermal energy from the heat generating resistor 2 and is heated, generating bubbles. Due to the pressure of the nuclear bubbles, ink is ejected from the nozzle hole 7 facing the heating resistor 2, and no recording is made on the recording paper (not shown) according to the recording status. Ink is replenished into the chamber 4 through an ink supply port 5.

[Problem that the invention seeks to solve]

However, in such an inkjet head, the substrate 1, the nozzle plate 6, and the partition plate 9 are all formed as separate members; Positioning is required between 9.

Incidentally, in such an inkjet head, the pitch between each heating resistor 2 or between each nozzle hole 7 must be 0.125 W or less, and in other words, the pitch must be 0.125 W or less in order to obtain stability in the flight of ink droplets. 1) To obtain printing quality (high positional accuracy is required; however, in the past, it was necessary to repeatedly align the substrate and the partition plate, and also the partition plate and the nozzle plate)
The disadvantage was that it was difficult to obtain high accuracy.

The present invention has been made in view of these problems, and an object of the present invention is to provide an inkjet head that only needs to be aligned once and has excellent printing quality because it can accurately achieve positional accuracy. .

[Means for solving problems]

In order to achieve the above object, the inkjet head of the present invention includes a plurality of heating resistors, a selection electrode and a common electrode for supplying electrical signals to the heating resistors, and a plurality of heating resistors and a common electrode. After forming a metal film on the insulating substrate on which the selective electrode and common electrode have been formed, a resist is applied to protect the selected electrode and the common electrode.
) After forming partition walls by metal plating, the resist is removed, and the insulating substrate from which the resist 1 has been removed is joined to a nozzle plate in which several nozzle holes through which ink is ejected are formed. It is characterized by becoming

[Effect]

The measures described above operate as follows.

Since the partition wall is integrally formed with the heating resistor on the wiring board, there is no need to align the board and the partition plate.
Therefore, accurate accuracy can be achieved simply by aligning the partition wall (substrate) and the nozzle plate. Historically, a metal film is formed on the entire substrate surface, which also has the effect of good heat dissipation.

〔Example〕

An embodiment of the present invention will be described below.

FIG. 1 is a structural sectional view of an inkjet head according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram illustrating the manufacturing process of the substrate portion thereof.

As shown in the figure, a selection electrode 13 and a common IE pole 14 are formed on an electrically insulating substrate 11 made of glass or ceramic, etc., for supplying power to a heating resistor 12 and a nuclear heating resistor 12. An insulating dove 15 is formed to protect the resistor 12, the selection 3, and the common electrode 14 from chemical and mechanical damage caused by a recording medium (not shown).
has been done. Furthermore, a substrate 11 is formed on the upper surface of the insulation layer 5.
A composite film 16 is formed over the entire surface l, and partition walls 18 are formed on this metal film 16 so as to separate the heating resistors 124 individually. And this gap Q & l
On B, a nozzle plate 17 is folded and integrated with the substrate 11 so that the respective nozzle holes 17a face the heating resistor 12.

Next, a method for manufacturing an inkjet head according to the present invention will be explained with reference to FIG.

First, the heating resistor 12, the selection electrode 13, the common electrode 143, and the insulating protective layer 15 are formed on the substrate 11 by a thin film process and a photolithography process. These forming methods are common methods for manufacturing thermal heads, and are nothing new. Next, a metal film 16 made of, for example, nickel is formed on the entire surface of the substrate 11 by plating. A dry film resist is then laminated onto this metal film 16. At this time, it is desirable that the thickness of the resist 19 be approximately 120% of the height of the partition wall 18. This resist 19 is selectively cured by irradiating it with ultraviolet rays using a predetermined mask to form a resist 19. After the development and hardening treatment, electroplating is performed to deposit metal only on the portions 19a where the twist resist 19 is not applied. Thereafter, the resist 19 is removed by etching using a suitable solvent. In this way, partition walls 18 are formed on substrate 11.

Further, the nozzle plate 17 is usually formed by electroforming or etching a thin metal plate.

Then, the substrate 11 and the nozzle plate 17 formed as described above are bonded and integrated using an adhesive film or the like in a conventional manner to manufacture an inkjet head.

〔Effect of the invention〕

As described above, in the inkjet head of the present invention, by forming a metal film on the insulating film on the upper surface of the substrate, the heat dissipation effect is improved and printing speed is increased.

Furthermore, in order to integrally form partition walls on an insulating substrate.

Positioning with the nozzle plate only needs to be done once, improving positional accuracy and resulting in improved printing quality.

[Brief explanation of the drawing]

Figure 8g1 is a structural sectional view showing an embodiment of the inkjet head of the present invention, Figure 2 is a diagram showing the manufacturing process of the substrate part of the inkjet head shown in Figure 1, and Figure 3 is an exploded view of the conventional inkjet head. FIG. 11... Substrate 12... Heating resistor 13... Selection electrode 14... Common electrode 15... Insulating protective layer 16... Metal coating 17... Nozzle plate 18... Partition wall 19. ...Resist'! 41 Illustration rate 2 Bacteria (a) (b) (c) 1 day

Claims (2)

[Claims] (1) An insulating substrate, a plurality of heating resistors formed on the substrate, a selection electrode and a common electrode that supply electrical signals to the heating resistors, and these heating resistors and selection electrodes. - An insulating protective layer that protects the common electrode, a metal film formed on the insulating protective layer, a partition wall formed on the metal film, and a nozzle hole for ejecting ink droplets onto the partition wall are connected to the heating resistor. 1. An inkjet head comprising: a nozzle plate installed to face the substrate, and having an outer circumferential portion integrally bonded to the substrate. (2) Multiple heating resistors on an insulating substrate, a selection electrode and a common electrode that supply electrical signals to the heating resistors, and insulation protection to protect the heating resistors, selection electrode, and common electrode. After forming the layer, a metal film is formed on the insulating substrate, and a resist is further applied onto the metal film except for the desired partition forming portions, partitions made of metal are formed, and then the resist is coated. After removing the resist by etching, the insulating substrate from which the resist has been removed is connected to a nozzle plate having a plurality of nozzle holes from which ink droplets are ejected, so that the heating resistor and the nozzle holes face each other. A method of manufacturing an inkjet head characterized by integrally bonding.