JPS63132458A - Manufacturing equipment of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the collision between a clip and a device and the generation of flaws, by providing a pair of holding parts of a clip which pinches a case part and a cap part with flange parts facing each other, and providing the holding parts with a guide to expand the part between the flanges. CONSTITUTION:Holding parts 1a and 1b have spring property, whose center parts are bent in the form of a hair pin, and a pair is constituted by bending the respective open end sides in the form of a hair pin. A clip 1 is provided with the holding parts 1a and 1b. Flange parts 11a and 11b which protrude in the transversal direction of the holding parts 1a and 1b are arranged so as to face each other. The holding parts 1a and 1b of the clip 1 are expanded by a wedge type clip guide 2 extending in the form of a taper from a front edge 2a toward a rear edge 2b. After the clip 1 is advanced to the position where it pinches the case part 3 and the cap part 4 of a semiconductor device, the clip guide 2 is removed, and glass sealing is performed in which the case part 3 and the cap part 4 are pinched by the clip 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor manufacturing equipment, and particularly to a semiconductor manufacturing equipment in which a case portion and a cap portion of a semiconductor device are bonded and sealed with glass.

[Conventional technology]

Conventionally, this type of semiconductor manufacturing equipment expands the pair of gripping parts 1a and Ib of the clip 1 by applying a constant force F to the force point part of the clip 1 having spring properties, as shown in FIG. By moving the clip 1 to the pre-positioned positions of the case part 3 and the cap part 4 and removing the force F there, the case part 3 and the cap part 4 are brought into close contact and fixed by the grip parts la and Ib of the clip 1. Ta.

[Problem that the invention seeks to solve]

In the conventional semiconductor manufacturing equipment described above, as the clip 1 is used, the opening degree of the pair of gripping parts becomes insufficient due to the deterioration of the clip's spring properties, and the case part 3 or the cap part 4 and the clip 1
The drawback is that the case and cap may be scratched due to collision.

An object of the present invention is to provide a semiconductor manufacturing apparatus equipped with a clip that always opens to a constant opening degree regardless of deterioration of its spring properties.

[Means for solving problems]

The present invention provides a semiconductor manufacturing apparatus in which a case part and a cap part of a semiconductor device are fixed with a clip and the case part and the cap part are bonded and sealed with glass, and which has a spring property that holds the case part and the cap part together. A clip that is equipped with a pair of gripping parts, and each gripping part is provided with flanges facing each other, and a clip guide that enters between the flanges of the clip and expands the pair of gripping parts to a certain opening degree or more. This is a semiconductor manufacturing apparatus characterized by comprising:

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIGS. 1(a) and 1(b) are views showing a clip used in a semiconductor manufacturing apparatus for bonding and sealing a case part 3 and a cap part 4 of a semiconductor device with glass. Figure 1 (aL(b)
The clip 1 has a spring property, and one end thereof is bent into a hairpin shape to form a gripping portion 1b.
The other end is folded back and bent into a hairpin shape to form a gripping part 1a that pairs with the gripping part 1b, and the other end is further extended rearward.

This configuration is the same as the conventional one.The present invention is shown in FIG. 1(a).

As shown in (b), each gripping part 1a, lb of the clip 1
In addition, laterally protruding flanges 11a and llb are provided facing each other, respectively, and further as shown in FIGS. 2(a) and 2(b)
) is provided with a wedge-shaped clip guide 2 that tapers out from the front M2a toward the rear i2b.

In the embodiment, as shown in FIGS. 2(a) and 2(b), a force F is applied to the clip 1 to form a pair of gripping parts 1a, 1. b
are expanded, and the clip 1 is advanced toward the positioned case part 3 and cap part 4. If the opening amount of the clip 1 is insufficient, move the clip guide 2 to the flange 11a.
, llb and form a pair of gripping parts 1a, 1. Push it open so that the opening of b becomes a certain amount (clip guide thickness: t). After the clip is moved to the predetermined positions of the case part 3 and the cap part 4, the force F is removed and the case part 3 and the cap part 4 are held and fixed by the clip 1.

According to the present invention, when the opening amount of the clip 1 is insufficient, the wedge action of the clip guide 2 causes the pair of flanges 11 to
a, 1.1b is forcibly pushed open and the gripping part 1 is unpaired.
It becomes possible to maintain the opening degrees of a, ], and b above the set value.

〔Effect of the invention〕

As explained above, the present invention provides a clip with a pair of flanges, and a clip guide that enters between the pair of flanges and expands the clip mouth by more than a certain amount. This has the effect of eliminating collisions and scratches between the clip and the semiconductor device due to insufficient opening amount.

[Brief explanation of the drawing]

FIG. 1(a) is a plan view showing a clip used in the semiconductor manufacturing apparatus of the present invention, FIG. 1(b) is a front view, and FIG. 2(a) is a plan view showing a state in which the clip is expanded by a clip guide. (b) is a front view of the same, and FIG. 3 is an operational diagram of the conventional semiconductor manufacturing apparatus. 1... Clip 2... Clip guide 3... Case part 4... Cap part Ha
, 1lb-Tsubabe Patent Applicant Kyushu NEC Co., Ltd. Figure 1

Claims (1)

[Claims] (1) In semiconductor manufacturing equipment in which the case part and cap part of a semiconductor device are fixed with a clip and the case part and cap part are bonded and sealed with glass, a pair having spring properties that sandwich the case part and the cap part is used. a clip provided with a pair of gripping portions, each having a flange facing each other, and a clip guide that enters between the flange portions of the clip and expands the pair of gripping portions to a certain opening degree or more. A semiconductor manufacturing device characterized by comprising: