JPS63131521U - - Google Patents
Info
- Publication number
- JPS63131521U JPS63131521U JP2291187U JP2291187U JPS63131521U JP S63131521 U JPS63131521 U JP S63131521U JP 2291187 U JP2291187 U JP 2291187U JP 2291187 U JP2291187 U JP 2291187U JP S63131521 U JPS63131521 U JP S63131521U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- wiring
- embedding
- shows
- terminal protruding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Connection Or Junction Boxes (AREA)
Description
第1図は本考案の配線接続箱の例の構造を示す
部分断面図、第2〜4図は配線板組立体とモール
ド用金型との嵌合状態を示す部分断面図、(それ
ぞれaは嵌合前のモールド用金型と端子部分を示
し、bは嵌合したのち樹脂包埋してバリの発生状
況を示す。なお、第2図はモールド用金型の端子
嵌合孔が狭い場合、第3図はモールド用金型の端
子嵌合孔が広い場合、第4図は端子の基部を包囲
する座がある場合を示す。)、第5図は配線用基
板と配線用導体とから配線板組立体を組立てる工
程の説明図、第6図は配線板組立体を樹脂包埋用
モールド用金型内に装着した状態を示す断面図、
第7図は配線板包埋体を筐体内に収容して配線接
続箱を組立てる工程の説明図である。
A…配線用基板、A1…中間板、A2…絶縁板
、B…配線用導体、C…配線板組立体、D…間隙
保持用部材、E…モールド用金型、F…配線板包
埋体、G…筐体、a…導体貫通孔、b…端子、c
…隙間、d…バリ、e…間隙、f…包埋用樹脂、
g1…裏カバー、g2…表カバー、h…スペーサ
、l…面間距離、t…メス―メス型コネクタ端子
。
FIG. 1 is a partial sectional view showing the structure of an example of the wiring junction box of the present invention, and FIGS. 2 to 4 are partial sectional views showing the fitted state of the wiring board assembly and the molding die. Figure 2 shows the molding die and the terminal part before fitting, and b shows the occurrence of burrs after fitting and embedding in resin. Fig. 2 shows the case where the terminal fitting hole of the molding die is narrow. , Fig. 3 shows the case where the terminal fitting hole of the molding die is wide, Fig. 4 shows the case where there is a seat surrounding the base of the terminal.), Fig. 5 shows the case where the terminal fitting hole of the molding die is wide. An explanatory diagram of the process of assembling the wiring board assembly, FIG. 6 is a cross-sectional view showing the wiring board assembly mounted in a resin embedding mold;
FIG. 7 is an explanatory diagram of the process of assembling a wiring junction box by accommodating the wiring board embedding body in the casing. A...Wiring board, A1 ...Intermediate board, A2 ...Insulating plate, B...Wiring conductor, C...Wiring board assembly, D...Gap holding member, E...Mold die, F...Wiring board packaging Buried body, G... Housing, a... Conductor through hole, b... Terminal, c
...gap, d...burr, e...gap, f...embedding resin,
g1 ...back cover, g2 ...front cover, h...spacer, l...distance between surfaces, t...female-female connector terminal.
Claims (1)
に向つて突設されたコネクタ端子を除いて絶縁性
樹脂で包埋してなる配線板包埋体を絶縁性筐体内
に収容してなり、該配線板包埋体の端子突設面と
該筐体の内面とがスペーサによつて離隔されてい
ることを特徴とする配線接続箱。 A wiring board embedding body made by laminating a wiring board and a wiring conductor and embedding it in an insulating resin except for a connector terminal protruding outward is housed in an insulating casing. A wiring connection box characterized in that the terminal protruding surface of the wiring board embedded body and the inner surface of the housing are separated by a spacer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987022911U JPH0724898Y2 (en) | 1987-02-20 | 1987-02-20 | Wiring junction box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987022911U JPH0724898Y2 (en) | 1987-02-20 | 1987-02-20 | Wiring junction box |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63131521U true JPS63131521U (en) | 1988-08-29 |
JPH0724898Y2 JPH0724898Y2 (en) | 1995-06-05 |
Family
ID=30820744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987022911U Expired - Lifetime JPH0724898Y2 (en) | 1987-02-20 | 1987-02-20 | Wiring junction box |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0724898Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007158126A (en) * | 2005-12-06 | 2007-06-21 | Denso Corp | Electronic equipment and manufacturing method therefor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6016110A (en) * | 1983-07-05 | 1985-01-26 | 住友電気工業株式会社 | Device for mutually connecting wire ring harness |
JPS61129415U (en) * | 1985-01-31 | 1986-08-13 | ||
JPS61202955A (en) * | 1985-03-05 | 1986-09-08 | Mazda Motor Corp | Wiring device for automobile |
-
1987
- 1987-02-20 JP JP1987022911U patent/JPH0724898Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6016110A (en) * | 1983-07-05 | 1985-01-26 | 住友電気工業株式会社 | Device for mutually connecting wire ring harness |
JPS61129415U (en) * | 1985-01-31 | 1986-08-13 | ||
JPS61202955A (en) * | 1985-03-05 | 1986-09-08 | Mazda Motor Corp | Wiring device for automobile |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007158126A (en) * | 2005-12-06 | 2007-06-21 | Denso Corp | Electronic equipment and manufacturing method therefor |
JP4687430B2 (en) * | 2005-12-06 | 2011-05-25 | 株式会社デンソー | Electronic device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0724898Y2 (en) | 1995-06-05 |
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