JPS63131170U - - Google Patents
Info
- Publication number
- JPS63131170U JPS63131170U JP2238987U JP2238987U JPS63131170U JP S63131170 U JPS63131170 U JP S63131170U JP 2238987 U JP2238987 U JP 2238987U JP 2238987 U JP2238987 U JP 2238987U JP S63131170 U JPS63131170 U JP S63131170U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductive layer
- layer
- bonding layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987022389U JPH0636601Y2 (ja) | 1987-02-18 | 1987-02-18 | 回路基板 |
| US07/285,373 US5119272A (en) | 1986-07-21 | 1988-12-16 | Circuit board and method of producing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987022389U JPH0636601Y2 (ja) | 1987-02-18 | 1987-02-18 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63131170U true JPS63131170U (US20030199744A1-20031023-C00003.png) | 1988-08-26 |
| JPH0636601Y2 JPH0636601Y2 (ja) | 1994-09-21 |
Family
ID=30819725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987022389U Expired - Lifetime JPH0636601Y2 (ja) | 1986-07-21 | 1987-02-18 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636601Y2 (US20030199744A1-20031023-C00003.png) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117573A (ja) * | 1974-08-02 | 1976-02-12 | Kyoto Ceramic | Denshikairoyoseramitsukusukibanno seizoho |
| JPS51151781A (en) * | 1975-06-20 | 1976-12-27 | Matsushita Electric Works Ltd | Process for manufacturing laminated boards for chemical plating |
| JPS56125890A (en) * | 1980-03-07 | 1981-10-02 | Tokyo Shibaura Electric Co | Method of producing printed circuit board |
| JPS5769269U (US20030199744A1-20031023-C00003.png) * | 1980-10-13 | 1982-04-26 | ||
| JPS60214594A (ja) * | 1984-04-11 | 1985-10-26 | 松下電器産業株式会社 | 印刷配線板の製造方法 |
| JPS61121389A (ja) * | 1984-11-16 | 1986-06-09 | 松下電器産業株式会社 | セラミツク配線板 |
-
1987
- 1987-02-18 JP JP1987022389U patent/JPH0636601Y2/ja not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117573A (ja) * | 1974-08-02 | 1976-02-12 | Kyoto Ceramic | Denshikairoyoseramitsukusukibanno seizoho |
| JPS51151781A (en) * | 1975-06-20 | 1976-12-27 | Matsushita Electric Works Ltd | Process for manufacturing laminated boards for chemical plating |
| JPS56125890A (en) * | 1980-03-07 | 1981-10-02 | Tokyo Shibaura Electric Co | Method of producing printed circuit board |
| JPS5769269U (US20030199744A1-20031023-C00003.png) * | 1980-10-13 | 1982-04-26 | ||
| JPS60214594A (ja) * | 1984-04-11 | 1985-10-26 | 松下電器産業株式会社 | 印刷配線板の製造方法 |
| JPS61121389A (ja) * | 1984-11-16 | 1986-06-09 | 松下電器産業株式会社 | セラミツク配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0636601Y2 (ja) | 1994-09-21 |
