JPS63131160U - - Google Patents
Info
- Publication number
- JPS63131160U JPS63131160U JP2251087U JP2251087U JPS63131160U JP S63131160 U JPS63131160 U JP S63131160U JP 2251087 U JP2251087 U JP 2251087U JP 2251087 U JP2251087 U JP 2251087U JP S63131160 U JPS63131160 U JP S63131160U
- Authority
- JP
- Japan
- Prior art keywords
- dividing line
- divided
- board
- dividing
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2251087U JPS63131160U (zh) | 1987-02-17 | 1987-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2251087U JPS63131160U (zh) | 1987-02-17 | 1987-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131160U true JPS63131160U (zh) | 1988-08-26 |
Family
ID=30819963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2251087U Pending JPS63131160U (zh) | 1987-02-17 | 1987-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131160U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015195272A (ja) * | 2014-03-31 | 2015-11-05 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
-
1987
- 1987-02-17 JP JP2251087U patent/JPS63131160U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015195272A (ja) * | 2014-03-31 | 2015-11-05 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |