JPS63129920U - - Google Patents
Info
- Publication number
- JPS63129920U JPS63129920U JP2214287U JP2214287U JPS63129920U JP S63129920 U JPS63129920 U JP S63129920U JP 2214287 U JP2214287 U JP 2214287U JP 2214287 U JP2214287 U JP 2214287U JP S63129920 U JPS63129920 U JP S63129920U
- Authority
- JP
- Japan
- Prior art keywords
- braiding
- bundling
- wrapping
- ultra
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009954 braiding Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Description
第１図、第２図は本考案の一実施例を示すもの
であり、第１図は多心ケーブルの斜視図、第２図
は同ケーブルに用いられる被覆体の拡大図である
。また、第３図、第４図は本考案の他の実施例を
示すものでそれぞれ第１図、第２図に対応する図
である。
１，１Ａ…多心ケーブル、２…被覆対象（信号
線）、４，４Ａ…被覆体、４１，４１Ａ…束、４
２，４２Ａ…極細導線。
1 and 2 show an embodiment of the present invention, with FIG. 1 being a perspective view of a multi-core cable, and FIG. 2 being an enlarged view of a covering used for the cable. Further, FIGS. 3 and 4 show other embodiments of the present invention and correspond to FIGS. 1 and 2, respectively. 1, 1A...Multi-core cable, 2... Covering object (signal line), 4, 4A... Covering body, 41, 41A... Bundle, 4
2,42A...extremely thin conductor wire.
Claims (1)
象の周囲に巻くか編んで筒状にしたことを特徴と
する被覆体。 A covering body characterized by bundling a large number of ultra-fine conductive wires and wrapping or braiding this bundle around a long object to be covered to form a cylindrical shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2214287U JPS63129920U (en) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2214287U JPS63129920U (en) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63129920U true JPS63129920U (en) | 1988-08-25 |
Family
ID=30819245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2214287U Pending JPS63129920U (en) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63129920U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923111B2 (en) * | 1977-02-17 | 1984-05-30 | 富士通株式会社 | semiconductor equipment |
-
1987
- 1987-02-19 JP JP2214287U patent/JPS63129920U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923111B2 (en) * | 1977-02-17 | 1984-05-30 | 富士通株式会社 | semiconductor equipment |