JPH01139363U - - Google Patents
Info
- Publication number
- JPH01139363U JPH01139363U JP3437488U JP3437488U JPH01139363U JP H01139363 U JPH01139363 U JP H01139363U JP 3437488 U JP3437488 U JP 3437488U JP 3437488 U JP3437488 U JP 3437488U JP H01139363 U JPH01139363 U JP H01139363U
- Authority
- JP
- Japan
- Prior art keywords
- band
- shaped conductor
- shaped
- lead wire
- elastic member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Cable Accessories (AREA)
Description
第１図は本考案のハンダレス接地用部材の実施
例を示す斜視図、第２図はそのケーブルへの取り
付け状態を示す斜視図、第３図と第４図はそれぞ
れ本考案のハンダレス接地用部材の別々の変形例
を示す斜視図、第５図は従来のハンダレス接地工
法を説明するケーブル端の斜視図である。
１……ケーブル、２……絶縁体、３……半導電
層、４……外部導体、５……シース、１０……接
地用リード線、１１……帯状導体、１２……帯状
弾性部材。
Fig. 1 is a perspective view showing an embodiment of the solderless grounding member of the present invention, Fig. 2 is a perspective view showing the state of attachment to a cable, and Figs. 3 and 4 are respectively the solderless grounding member of the present invention. FIG. 5 is a perspective view of a cable end illustrating a conventional solderless grounding method. DESCRIPTION OF SYMBOLS 1... Cable, 2... Insulator, 3... Semiconducting layer, 4... Outer conductor, 5... Sheath, 10... Grounding lead wire, 11... Band-shaped conductor, 12... Band-shaped elastic member.
Claims (1)
状導体と、この帯状導体の他端にその一端を固定
し、ぜんまい状に巻回された帯状弾性部材とから
成り、ケーブルの外部導体の外周に、前記帯状導
体を中心にして前記帯状弾性部材がこれと前記リ
ード線とを取り巻くように巻回されることを特徴
とするハンダレス接地用部材。 It consists of a flexible band-shaped conductor to which a grounding lead wire is connected and fixed to one end, and a band-shaped elastic member which is fixed to the other end of the band-shaped conductor and wound in a spiral shape. . A solderless grounding member, characterized in that the band-shaped elastic member is wound around the band-shaped conductor so as to surround the band-shaped conductor and the lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3437488U JPH0622935Y2 (en) | 1988-03-15 | 1988-03-15 | Solderless grounding member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3437488U JPH0622935Y2 (en) | 1988-03-15 | 1988-03-15 | Solderless grounding member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01139363U true JPH01139363U (en) | 1989-09-22 |
| JPH0622935Y2 JPH0622935Y2 (en) | 1994-06-15 |
Family
ID=31261085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3437488U Expired - Lifetime JPH0622935Y2 (en) | 1988-03-15 | 1988-03-15 | Solderless grounding member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622935Y2 (en) |
-
1988
- 1988-03-15 JP JP3437488U patent/JPH0622935Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622935Y2 (en) | 1994-06-15 |