JPS63129602A - Laser trimmer - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a laser trimming device, and more particularly to a laser trimming device that uses laser light to adjust the resistance value, frequency, voltage, etc. of electronic components such as hybrid TCs and chip components.

Prior Art Conventionally, in laser trimming 5Ae, a workpiece is attracted or clamped onto a moving table and transported to a predetermined laser beam irradiation area, and when the moving table stops in that area, a probe is attached to a measurement terminal of the workpiece. It descends to the position and makes contact, after which laser trimming is performed.

After the laser trimming process is completed, the probe is raised, the moving table is returned to its origin, and the workpiece is replaced with the next workpiece.

In such conventional laser trimming equipment, the workpiece is mounted on a moving table, moved to the laser beam irradiation area, and after the laser trimming process is completed, the moving table is returned to its original position and the workpiece is replaced. Therefore, the laser trimming process cannot be performed while the movable table is moving, which has the disadvantage of reducing productivity.

When the moving table is of a turntable type, it takes about 0.5 to 1 second to change the workpiece, and the ratio of this change time to the laser trimming processing time is not small. Particularly when the number of elements to be trimmed on one substrate is small, the ratio of down time of laser trimming processing (time of moving the moving table and time of changing workpieces) to the operating time of laser trimming becomes large. I end up.

Furthermore, if the moving table is an XY table, it takes a considerable amount of time to take out a trimmed substrate at the origin of the XY table and load the next substrate. Generally speaking, laser trimming equipment handles substrates stored in cartridges, which requires a badge processing (processing of substrates to be subjected to the same process all at once) to be incorporated into the production line.

OBJECTS OF THE INVENTION The present invention has been made to eliminate the drawbacks of the conventional devices as described above, and an object of the present invention is to provide a laser trimming device that can shorten the downtime of laser trimming processing and increase productivity.

Composition of the Invention A laser trimming device according to the present invention is a laser trimming device having a probe for measuring the voltage of a workpiece, and an irradiation means for irradiating the workpiece with a laser beam, the laser trimming device having a plurality of a transport means for continuously transporting the workpiece at a constant speed; and a movement control means for reciprocating the probe and the laser beam in accordance with the movement speed of the transport means in the four laser beam processing sections. is provided, and laser trimming of the workpiece is sequentially and continuously performed in the processing section.

Embodiment Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing a trimming operation according to an embodiment of the present invention, and FIG. 2 is a side view showing a trimming operation according to an embodiment of the present invention. In these figures, the element to be trimmed 1 is fixed on a parts handler (not shown) and is moving in the direction of the arrow at a constant speed v1.

When the element to be trimmed 1 reaches the trimming start position a, the probe 4 contacts the electrode 2 and starts measuring the element to be trimmed 1, and starts irradiating the element with a laser beam (not shown). At this time, the probe 4 moves at the same moving speed v1 as the element to be trimmed 1 while being in contact with the electrode 2, and continuously measures the element to be trimmed 1. The scanning speed of the laser beam may be the speed obtained by adding the moving speed v1 to the trimming speed when the element to be trimmed 1 is in a stationary state.

When the trimming process using the laser beam is completed, the probe 4 rises at the trimming end position d and returns to the trimming start position a. By making the moving speed v2 at this time faster than the moving speed ■1 of the element to be trimmed 1,
The productivity of trimming processing can be improved. The probe 4 contacts the next element to be trimmed 1 at the trimming start position Ma and starts measurement.

Next, for example, when the element 1 to be trimmed is in a stationary state, the scanning direction of the laser beam is changed by 90 degrees during trimming, and when performing a trimming process called cutting, as shown in FIG. The trajectory 3 of the laser beam is oblique to the direction of travel (the element 1 to be trimmed moves from the trimming start position a to the trimming processing position [b]).

The laser beam moves between the laser beam irradiation points B, C, and D before reaching the trimming end position fad via C. By moving the laser beam in an oblique direction, the trimming process of the element 1 to be trimmed is a process that is bent at a right angle from the middle.

Furthermore, by using a plurality of sets of bu-ops 4, one set can be used to perform measurements during the trimming process, and the other set can be used to perform operations such as returning to the trimming start position a and measuring the trimmed element 1 before trimming. It is also possible to perform preparatory operations for trimming such as measuring initial values, and this method can further improve the productivity of trimming.

In this way, the element to be trimmed 1 is conveyed continuously at a constant speed, and the probe 4 and the laser beam are reciprocated according to the moving speed of the element to be trimmed 1, thereby transferring the element to be trimmed 1. By performing the laser trimming process sequentially and continuously, it is possible to incorporate the laser trimming process into a continuous production line, and the downtime of the laser trimming process can be shortened. can improve productivity.

DETAILED DESCRIPTION OF THE INVENTION According to the present invention, the workpiece is conveyed sequentially at a constant speed, and the probe and the laser beam are moved back and forth according to the moving speed of the workpiece in the laser beam machining section. By sequentially and continuously performing laser trimming of the workpiece while moving it, the downtime of laser trimming can be shortened and the productivity of laser trimming can be improved. There is.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a trimming operation according to an embodiment of the present invention, and FIG. 2 is a side view without showing a trimming operation according to an embodiment of the present invention. Explanation of symbols of main parts 1... Element to be trimmed 2... Electrode 4... Probe

Claims (1)

[Claims] A laser trimming device having a probe for measuring the voltage of a workpiece and an irradiation means for irradiating the workpiece with laser light, the apparatus continuously conveying a plurality of workpieces one after another at a constant speed. and a movement control means for reciprocating the probe and the laser beam in accordance with the moving speed of the conveying means in the processing section using the laser beam, and moving the probe and the laser beam back and forth in the processing section using the laser beam. A laser trimming device characterized in that trimming processing is performed sequentially and continuously.