JPS63128727U - - Google Patents
Info
- Publication number
- JPS63128727U JPS63128727U JP1987021501U JP2150187U JPS63128727U JP S63128727 U JPS63128727 U JP S63128727U JP 1987021501 U JP1987021501 U JP 1987021501U JP 2150187 U JP2150187 U JP 2150187U JP S63128727 U JPS63128727 U JP S63128727U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- integrated circuit
- planar shape
- circuit chip
- base facing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
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- H10W72/07551—
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- H10W72/07554—
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- H10W72/50—
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- H10W72/5363—
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- H10W72/547—
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- H10W72/59—
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- H10W72/932—
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- H10W72/9445—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987021501U JPS63128727U (enExample) | 1987-02-16 | 1987-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987021501U JPS63128727U (enExample) | 1987-02-16 | 1987-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128727U true JPS63128727U (enExample) | 1988-08-23 |
Family
ID=30818006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987021501U Pending JPS63128727U (enExample) | 1987-02-16 | 1987-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128727U (enExample) |
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1987
- 1987-02-16 JP JP1987021501U patent/JPS63128727U/ja active Pending