JPS63128694A - Printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A component such as a large-scale integrated circuit with a large number of pins and a small pitch between terminals is mounted on a printed wiring board so that the terminal mounting hole of the component does not penetrate through the printed wiring board. This enables high-density mounting of electronic components.

[Industrial application field]

The present invention connects multi-bin components with small pinch between terminals between printed wiring boards.

In recent years, electronic components mounted on printed wiring boards that make up various electronic devices have become smaller, more highly integrated, and have more pins with less pinch between terminals to accommodate faster signal speeds. There is a strong demand for the development of printed wiring boards that allow high-density mounting of components.

[Conventional technology]

Figures 3 and 4 are diagrams explaining a conventional printed wiring board. Figure 3 is a cross-sectional perspective view of the main part for mounting components to the through hole, and Figure v4 is a perspective view of the main part for surface mounting to the conductor pattern. It is.

FIG. 3 shows a method for mounting a component 41 having a plurality of lead terminals 43 on a printed wiring board 40, in which a plurality of through holes 4'2 corresponding to the lead terminals 43 are formed in the printed wiring board 40. The lead terminal 43 of the component 41 is inserted into the through hole 42 and fixed with solder 44 (by solder dip or the like).

FIG. 4 shows a method for mounting a surface mount component 47 having a plurality of surface mount terminals 48 on a printed wiring board 40.
A conductor pattern 45 having via holes 46 corresponding to the surface mount terminals 48 is formed on the printed wiring board 40, and the surface mount terminals 48 of the surface mount component 47 are placed on the conductor pattern 45 and soldered. 44 (by solder reflow, etc.).

[Problem that the invention seeks to solve]

In the above-mentioned conventional printed wiring board, mounting components with lead terminals requires a through hole larger than the lead terminal diameter, and the conductor pattern for mounting surface mount components can be made smaller than the surface mount terminals for reliability reasons. In either case, there was a problem in that high-density packaging was hindered.

[Means for solving problems]

The present invention provides a printed wiring board that solves the above problems and enables high-density packaging.

That is, the problem is solved by making the printed wiring board so that the mounting holes for the component terminals of the components mounted on the printed wiring board do not penetrate through the printed wiring board.

[Function] The above printed wiring board is mounted using non-penetrating mounting holes, so all inner layers of the printed wiring board are provided with through holes (
Since components can be connected without providing through-holes, through-holes can be provided at a high density, and components can be mounted at a high density.

〔Example〕

FIGS. 1 and 2 are diagrams for explaining an embodiment of the present invention, in which FIG. F is a principle diagram showing a cross section of a main part, and FIG. 2 is a perspective cross-sectional view of a main part.

Figure 1 shows a multilayer (two layers in the drawing) printed wiring board 4.
A mounting hole 3 is formed that extends from the conductor pattern 5 to the inner layer conductor pattern 5' and does not penetrate the printed wiring board 4. The component terminal 2 of the component 1 is inserted into the mounting hole 3 and soldered 6 (by solder reflow, etc.). Secure with adhesive.

FIG. 2 shows a method for mounting a component l such as a large-scale integrated circuit having a plurality of component terminals 2 with a terminal pitch of 1.27a+m on a multilayer printed wiring board 4. The non-penetrating mounting hole 3 explained in FIG. 1 corresponding to the component terminal 2 of 1 is formed, and the component 1
Since the component terminals 2 are inserted and fixed with solder 6 (by solder reflow, etc.), wiring efficiency is improved.

In addition, in this example, the pitch between the terminals of the mounted components is 1 or 2.
Although a 7a+m large-scale integrated circuit has been described, the present invention is applicable not only to large-scale integrated circuits but also to other mounted components having a relatively small pitch between terminals.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, parts can be mounted in high density, and the device can be downsized.

It contributes to increasing signal speed and is extremely effective in improving characteristics.

[Brief explanation of the drawing]

1 and 2 are diagrams explaining one embodiment of the present invention, in which FIG. 1 is a principle diagram showing a cross section of the main part, FIG. 2 is a perspective cross-sectional view of the main part, and FIGS. 3 and 4. FIG. 3 is a cross-sectional perspective view of a main part in which components are mounted on a through hole, and FIG. 4 is a perspective view of a main part in surface mounting of a conductor pattern. In the figure, l, 41 are parts, 2 is a component terminal, 3 is a mounting hole, 4.40 is a printed wiring board, 5.45 is a conductor pattern, 5' is an inner layer conductor pattern, 6.44 is solder, 42
is a through hole, 43 is a lead terminal, 46 is a via hole, 47 is a surface mounting component, 48 is a surface 14Ptfrr
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Figure 4

Claims (1)

[Claims] Mounting hole (3) for component terminal (2) of component to be mounted (1)
A printed wiring board characterized in that it does not penetrate through the board.