JPS63127825U - - Google Patents
Info
- Publication number
- JPS63127825U JPS63127825U JP2028487U JP2028487U JPS63127825U JP S63127825 U JPS63127825 U JP S63127825U JP 2028487 U JP2028487 U JP 2028487U JP 2028487 U JP2028487 U JP 2028487U JP S63127825 U JPS63127825 U JP S63127825U
- Authority
- JP
- Japan
- Prior art keywords
- sample
- grinding
- ground
- analytical
- rotates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims description 9
- 239000000538 analytical sample Substances 0.000 claims description 4
Landscapes
- Sawing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020284U JPH0525773Y2 (en, 2012) | 1987-02-14 | 1987-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987020284U JPH0525773Y2 (en, 2012) | 1987-02-14 | 1987-02-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63127825U true JPS63127825U (en, 2012) | 1988-08-22 |
| JPH0525773Y2 JPH0525773Y2 (en, 2012) | 1993-06-29 |
Family
ID=30815656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987020284U Expired - Lifetime JPH0525773Y2 (en, 2012) | 1987-02-14 | 1987-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525773Y2 (en, 2012) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178659A (en) * | 1981-04-22 | 1982-11-02 | Hitachi Seiko Ltd | Grinding method of wafer |
-
1987
- 1987-02-14 JP JP1987020284U patent/JPH0525773Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178659A (en) * | 1981-04-22 | 1982-11-02 | Hitachi Seiko Ltd | Grinding method of wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525773Y2 (en, 2012) | 1993-06-29 |