JPS63127168U - - Google Patents
Info
- Publication number
- JPS63127168U JPS63127168U JP1919287U JP1919287U JPS63127168U JP S63127168 U JPS63127168 U JP S63127168U JP 1919287 U JP1919287 U JP 1919287U JP 1919287 U JP1919287 U JP 1919287U JP S63127168 U JPS63127168 U JP S63127168U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- flat package
- soldering
- treated
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1919287U JPS63127168U (ko) | 1987-02-12 | 1987-02-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1919287U JPS63127168U (ko) | 1987-02-12 | 1987-02-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63127168U true JPS63127168U (ko) | 1988-08-19 |
Family
ID=30813571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1919287U Pending JPS63127168U (ko) | 1987-02-12 | 1987-02-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63127168U (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04171854A (ja) * | 1990-11-05 | 1992-06-19 | Nec Kyushu Ltd | 半導体装置用リードフレーム |
-
1987
- 1987-02-12 JP JP1919287U patent/JPS63127168U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04171854A (ja) * | 1990-11-05 | 1992-06-19 | Nec Kyushu Ltd | 半導体装置用リードフレーム |