JPS63124759U - - Google Patents
Info
- Publication number
- JPS63124759U JPS63124759U JP1730387U JP1730387U JPS63124759U JP S63124759 U JPS63124759 U JP S63124759U JP 1730387 U JP1730387 U JP 1730387U JP 1730387 U JP1730387 U JP 1730387U JP S63124759 U JPS63124759 U JP S63124759U
- Authority
- JP
- Japan
- Prior art keywords
- parallel
- leads
- semiconductor device
- chip
- adhesive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004840 adhesive resin Substances 0.000 claims description 2
- 229920006223 adhesive resin Polymers 0.000 claims description 2
- 230000001808 coupling effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1730387U JPS63124759U (US07534539-20090519-C00280.png) | 1987-02-09 | 1987-02-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1730387U JPS63124759U (US07534539-20090519-C00280.png) | 1987-02-09 | 1987-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63124759U true JPS63124759U (US07534539-20090519-C00280.png) | 1988-08-15 |
Family
ID=30809937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1730387U Pending JPS63124759U (US07534539-20090519-C00280.png) | 1987-02-09 | 1987-02-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63124759U (US07534539-20090519-C00280.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03126233A (ja) * | 1989-10-02 | 1991-05-29 | Advanced Micro Devices Inc | プラスチックでカプセル封じされた集積回路のパッケージおよびそれをつくる方法 |
US6111308A (en) * | 1991-06-05 | 2000-08-29 | Advanced Micro Devices, Inc. | Ground plane for plastic encapsulated integrated circuit die packages |
JP6319525B1 (ja) * | 2017-05-26 | 2018-05-09 | 三菱電機株式会社 | 半導体装置 |
-
1987
- 1987-02-09 JP JP1730387U patent/JPS63124759U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03126233A (ja) * | 1989-10-02 | 1991-05-29 | Advanced Micro Devices Inc | プラスチックでカプセル封じされた集積回路のパッケージおよびそれをつくる方法 |
US6111308A (en) * | 1991-06-05 | 2000-08-29 | Advanced Micro Devices, Inc. | Ground plane for plastic encapsulated integrated circuit die packages |
JP6319525B1 (ja) * | 2017-05-26 | 2018-05-09 | 三菱電機株式会社 | 半導体装置 |
WO2018216219A1 (ja) * | 2017-05-26 | 2018-11-29 | 三菱電機株式会社 | 半導体装置 |
US10923444B1 (en) | 2017-05-26 | 2021-02-16 | Mitsubishi Electric Corporation | Semiconductor device |