JPS63124759U - - Google Patents

Info

Publication number
JPS63124759U
JPS63124759U JP1730387U JP1730387U JPS63124759U JP S63124759 U JPS63124759 U JP S63124759U JP 1730387 U JP1730387 U JP 1730387U JP 1730387 U JP1730387 U JP 1730387U JP S63124759 U JPS63124759 U JP S63124759U
Authority
JP
Japan
Prior art keywords
parallel
leads
semiconductor device
chip
adhesive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1730387U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1730387U priority Critical patent/JPS63124759U/ja
Publication of JPS63124759U publication Critical patent/JPS63124759U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1730387U 1987-02-09 1987-02-09 Pending JPS63124759U (US07534539-20090519-C00280.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1730387U JPS63124759U (US07534539-20090519-C00280.png) 1987-02-09 1987-02-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1730387U JPS63124759U (US07534539-20090519-C00280.png) 1987-02-09 1987-02-09

Publications (1)

Publication Number Publication Date
JPS63124759U true JPS63124759U (US07534539-20090519-C00280.png) 1988-08-15

Family

ID=30809937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1730387U Pending JPS63124759U (US07534539-20090519-C00280.png) 1987-02-09 1987-02-09

Country Status (1)

Country Link
JP (1) JPS63124759U (US07534539-20090519-C00280.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126233A (ja) * 1989-10-02 1991-05-29 Advanced Micro Devices Inc プラスチックでカプセル封じされた集積回路のパッケージおよびそれをつくる方法
US6111308A (en) * 1991-06-05 2000-08-29 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JP6319525B1 (ja) * 2017-05-26 2018-05-09 三菱電機株式会社 半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126233A (ja) * 1989-10-02 1991-05-29 Advanced Micro Devices Inc プラスチックでカプセル封じされた集積回路のパッケージおよびそれをつくる方法
US6111308A (en) * 1991-06-05 2000-08-29 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JP6319525B1 (ja) * 2017-05-26 2018-05-09 三菱電機株式会社 半導体装置
WO2018216219A1 (ja) * 2017-05-26 2018-11-29 三菱電機株式会社 半導体装置
US10923444B1 (en) 2017-05-26 2021-02-16 Mitsubishi Electric Corporation Semiconductor device

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