JPS63122669U - - Google Patents
Info
- Publication number
- JPS63122669U JPS63122669U JP1260387U JP1260387U JPS63122669U JP S63122669 U JPS63122669 U JP S63122669U JP 1260387 U JP1260387 U JP 1260387U JP 1260387 U JP1260387 U JP 1260387U JP S63122669 U JPS63122669 U JP S63122669U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- stamp
- component mounting
- pin
- stamp pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260387U JPS63122669U (it) | 1987-01-29 | 1987-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1260387U JPS63122669U (it) | 1987-01-29 | 1987-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63122669U true JPS63122669U (it) | 1988-08-09 |
Family
ID=30800887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1260387U Pending JPS63122669U (it) | 1987-01-29 | 1987-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122669U (it) |
-
1987
- 1987-01-29 JP JP1260387U patent/JPS63122669U/ja active Pending
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