JPS63122669U - - Google Patents
Info
- Publication number
- JPS63122669U JPS63122669U JP1987012603U JP1260387U JPS63122669U JP S63122669 U JPS63122669 U JP S63122669U JP 1987012603 U JP1987012603 U JP 1987012603U JP 1260387 U JP1260387 U JP 1260387U JP S63122669 U JPS63122669 U JP S63122669U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- stamp
- component mounting
- pin
- stamp pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987012603U JPS63122669U (enExample) | 1987-01-29 | 1987-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987012603U JPS63122669U (enExample) | 1987-01-29 | 1987-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63122669U true JPS63122669U (enExample) | 1988-08-09 |
Family
ID=30800887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987012603U Pending JPS63122669U (enExample) | 1987-01-29 | 1987-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122669U (enExample) |
-
1987
- 1987-01-29 JP JP1987012603U patent/JPS63122669U/ja active Pending