JPS63121455U - - Google Patents
Info
- Publication number
- JPS63121455U JPS63121455U JP1287887U JP1287887U JPS63121455U JP S63121455 U JPS63121455 U JP S63121455U JP 1287887 U JP1287887 U JP 1287887U JP 1287887 U JP1287887 U JP 1287887U JP S63121455 U JPS63121455 U JP S63121455U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- package
- lead
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1287887U JPS63121455U (fr) | 1987-02-02 | 1987-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1287887U JPS63121455U (fr) | 1987-02-02 | 1987-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63121455U true JPS63121455U (fr) | 1988-08-05 |
Family
ID=30801420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1287887U Pending JPS63121455U (fr) | 1987-02-02 | 1987-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63121455U (fr) |
-
1987
- 1987-02-02 JP JP1287887U patent/JPS63121455U/ja active Pending