JPS63121431U - - Google Patents
Info
- Publication number
- JPS63121431U JPS63121431U JP1294287U JP1294287U JPS63121431U JP S63121431 U JPS63121431 U JP S63121431U JP 1294287 U JP1294287 U JP 1294287U JP 1294287 U JP1294287 U JP 1294287U JP S63121431 U JPS63121431 U JP S63121431U
- Authority
- JP
- Japan
- Prior art keywords
- thermocouple
- tube
- sic
- vertical furnaces
- protection tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002791 soaking Methods 0.000 claims description 2
Landscapes
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
Description
第1図は本考案熱電対の取付け構造の一実施例
を示す簡略断面図、第2図a,bは本考案におけ
る熱電対の例を示す簡略断面図、第3図a,bは
それぞれ第2図a示の本考案における熱電対の使
用例を示す斜視図及びその簡略断面図、第4図は
従来熱電対の取付け構造の一例を示す簡略断面図
、第5図は第4図で使用する熱電対の一例を示す
断面図である。 2……熱電対、6……均熱管、7……反応管、
11……ヒータベース、13……SiC製保護管
、14……L字型の熱電対固定金具。
を示す簡略断面図、第2図a,bは本考案におけ
る熱電対の例を示す簡略断面図、第3図a,bは
それぞれ第2図a示の本考案における熱電対の使
用例を示す斜視図及びその簡略断面図、第4図は
従来熱電対の取付け構造の一例を示す簡略断面図
、第5図は第4図で使用する熱電対の一例を示す
断面図である。 2……熱電対、6……均熱管、7……反応管、
11……ヒータベース、13……SiC製保護管
、14……L字型の熱電対固定金具。
Claims (1)
- 縦型炉に使用される熱電対において、熱電対2
の保護管13をSiC製とし、このSiC製保護
管13を使用した熱電対2を均熱管6と反応管7
との間に挿入配置する縦型炉用熱電対の取付け構
造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987012942U JPH075631Y2 (ja) | 1987-01-30 | 1987-01-30 | 縦型炉 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987012942U JPH075631Y2 (ja) | 1987-01-30 | 1987-01-30 | 縦型炉 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63121431U true JPS63121431U (ja) | 1988-08-05 |
JPH075631Y2 JPH075631Y2 (ja) | 1995-02-08 |
Family
ID=30801542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987012942U Expired - Lifetime JPH075631Y2 (ja) | 1987-01-30 | 1987-01-30 | 縦型炉 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH075631Y2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002082524A1 (fr) * | 2001-03-30 | 2002-10-17 | Tokyo Electron Limited | Dispositif de traitement thermique |
JP2004311712A (ja) * | 2003-04-07 | 2004-11-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2012172871A (ja) * | 2011-02-18 | 2012-09-10 | Tokyo Electron Ltd | 熱処理装置および熱処理装置の温度測定方法 |
TWI511203B (zh) * | 2012-09-25 | 2015-12-01 | Hitachi Int Electric Inc | A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56110648U (ja) * | 1980-01-29 | 1981-08-27 | ||
JPS5878424A (ja) * | 1981-11-05 | 1983-05-12 | Toshiba Ceramics Co Ltd | 半導体拡散炉用マザ−ボ−ト |
JPS61241916A (ja) * | 1985-04-18 | 1986-10-28 | Deisuko Saiyaa Japan:Kk | 半導体熱処理装置 |
JPS62272525A (ja) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | 熱処理装置 |
-
1987
- 1987-01-30 JP JP1987012942U patent/JPH075631Y2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56110648U (ja) * | 1980-01-29 | 1981-08-27 | ||
JPS5878424A (ja) * | 1981-11-05 | 1983-05-12 | Toshiba Ceramics Co Ltd | 半導体拡散炉用マザ−ボ−ト |
JPS61241916A (ja) * | 1985-04-18 | 1986-10-28 | Deisuko Saiyaa Japan:Kk | 半導体熱処理装置 |
JPS62272525A (ja) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | 熱処理装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002082524A1 (fr) * | 2001-03-30 | 2002-10-17 | Tokyo Electron Limited | Dispositif de traitement thermique |
JP2004311712A (ja) * | 2003-04-07 | 2004-11-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2012172871A (ja) * | 2011-02-18 | 2012-09-10 | Tokyo Electron Ltd | 熱処理装置および熱処理装置の温度測定方法 |
TWI511203B (zh) * | 2012-09-25 | 2015-12-01 | Hitachi Int Electric Inc | A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method |
TWI562240B (ja) * | 2012-09-25 | 2016-12-11 | Hitachi Int Electric Inc | |
US10418293B2 (en) | 2012-09-25 | 2019-09-17 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support |
US11049742B2 (en) | 2012-09-25 | 2021-06-29 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support |
Also Published As
Publication number | Publication date |
---|---|
JPH075631Y2 (ja) | 1995-02-08 |