JPS63121431U - - Google Patents
Info
- Publication number
- JPS63121431U JPS63121431U JP1294287U JP1294287U JPS63121431U JP S63121431 U JPS63121431 U JP S63121431U JP 1294287 U JP1294287 U JP 1294287U JP 1294287 U JP1294287 U JP 1294287U JP S63121431 U JPS63121431 U JP S63121431U
- Authority
- JP
- Japan
- Prior art keywords
- thermocouple
- tube
- sic
- vertical furnaces
- protection tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002791 soaking Methods 0.000 claims description 2
Landscapes
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987012942U JPH075631Y2 (ja) | 1987-01-30 | 1987-01-30 | 縦型炉 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987012942U JPH075631Y2 (ja) | 1987-01-30 | 1987-01-30 | 縦型炉 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63121431U true JPS63121431U (US06373033-20020416-M00071.png) | 1988-08-05 |
JPH075631Y2 JPH075631Y2 (ja) | 1995-02-08 |
Family
ID=30801542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987012942U Expired - Lifetime JPH075631Y2 (ja) | 1987-01-30 | 1987-01-30 | 縦型炉 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH075631Y2 (US06373033-20020416-M00071.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002082524A1 (fr) * | 2001-03-30 | 2002-10-17 | Tokyo Electron Limited | Dispositif de traitement thermique |
JP2004311712A (ja) * | 2003-04-07 | 2004-11-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2012172871A (ja) * | 2011-02-18 | 2012-09-10 | Tokyo Electron Ltd | 熱処理装置および熱処理装置の温度測定方法 |
TWI511203B (zh) * | 2012-09-25 | 2015-12-01 | Hitachi Int Electric Inc | A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56110648U (US06373033-20020416-M00071.png) * | 1980-01-29 | 1981-08-27 | ||
JPS5878424A (ja) * | 1981-11-05 | 1983-05-12 | Toshiba Ceramics Co Ltd | 半導体拡散炉用マザ−ボ−ト |
JPS61241916A (ja) * | 1985-04-18 | 1986-10-28 | Deisuko Saiyaa Japan:Kk | 半導体熱処理装置 |
JPS62272525A (ja) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | 熱処理装置 |
-
1987
- 1987-01-30 JP JP1987012942U patent/JPH075631Y2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56110648U (US06373033-20020416-M00071.png) * | 1980-01-29 | 1981-08-27 | ||
JPS5878424A (ja) * | 1981-11-05 | 1983-05-12 | Toshiba Ceramics Co Ltd | 半導体拡散炉用マザ−ボ−ト |
JPS61241916A (ja) * | 1985-04-18 | 1986-10-28 | Deisuko Saiyaa Japan:Kk | 半導体熱処理装置 |
JPS62272525A (ja) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | 熱処理装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002082524A1 (fr) * | 2001-03-30 | 2002-10-17 | Tokyo Electron Limited | Dispositif de traitement thermique |
JP2004311712A (ja) * | 2003-04-07 | 2004-11-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2012172871A (ja) * | 2011-02-18 | 2012-09-10 | Tokyo Electron Ltd | 熱処理装置および熱処理装置の温度測定方法 |
TWI511203B (zh) * | 2012-09-25 | 2015-12-01 | Hitachi Int Electric Inc | A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method |
TWI562240B (US06373033-20020416-M00071.png) * | 2012-09-25 | 2016-12-11 | Hitachi Int Electric Inc | |
US10418293B2 (en) | 2012-09-25 | 2019-09-17 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support |
US11049742B2 (en) | 2012-09-25 | 2021-06-29 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support |
Also Published As
Publication number | Publication date |
---|---|
JPH075631Y2 (ja) | 1995-02-08 |