JPS63121226A - Piezo-electric relay switching matrix - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

BACKGROUND OF THE INVENTION The present invention relates to piezoelectric relays, and more particularly to piezoelectric relays configured as matrix switches.

Traditionally, matrix switches, particularly communication matrix switches, are typically implemented using electromagnetic relays. After many years of improving the design of electromagnetic relays,
Efficiency has increased and physical size has decreased. Nevertheless, such relays have the disadvantage of being relatively complex and expensive to manufacture. The relay's actuation coil requires many turns of very thin wire. Although the coil resistance is low, it consumes significant power and generates heat. When stages of electromagnetic relays are incorporated into a matrix switch configuration, the power consumption and heat generation are significant. This is especially true if the relay is held in operation by continuously energizing the coil. Others include sophisticated mechanisms to releasably hold the relay in an activated state. Furthermore, in large switching matrices, the number of interconnecting wires between relays becomes very large, which increases manufacturing complexity and cost.

Recent improvements in piezoceramic materials have made piezoelectric relays an attractive alternative to electromagnetic relays. Piezoelectric relay drive elements can be manufactured in bulk from many different polycrystalline ceramic materials such as barium titanate, lead zirconate titanate, lead metaniobate, etc., and can be precast and fired into various desired shapes, such as rectangular sheets. be done.

Piezoelectric relays have very low operating power, are kept in the active state without the need for external action with minimal power consumption, and do not draw current while in the rest state. As a result, piezoelectric relays generate very little heat. Piezoelectric relays can be implemented with a much smaller physical size and require fewer and significantly simpler components compared to electromagnetic relays of the same rating. The electrical properties of piezoelectric drive elements are essentially capacitive and, unlike electromagnetic relays, they are not affected by stray magnetic fields.

A principal object of the present invention is to provide an improved matrix switch.

Another object is to provide an improved matrix switch that has particular and limited application in the telecommunications field.

Another object is to provide a matrix switch of the above characteristics utilizing piezoelectric switch actuating elements.

Another object is to provide a piezoelectric relay switching matrix that utilizes an array of piezoelectric relays that are efficiently constructed in a compact matrix assembly.

A further object is to provide a piezoelectric relay switching matrix of the above nature that is easy to manufacture in bulk using printed circuit wiring techniques.

Another object is to provide a piezoelectric relay switching Φ matrix of the above characteristics which is achieved without crossover of the printed circuit wiring between the matrix switches.

The objective is to provide a piezoelectric relay switching matrix of the above characteristics with a minimum number of switch terminals.

Another object is to provide a piezoelectric relay switching matrix of the above characteristics that is efficient in design, easy to manufacture, compact in size, and reliable in operation over long periods of time.

Other objects of the invention will become apparent from the following description.

SUMMARY OF THE INVENTION In accordance with the present invention, a piezoelectric relay-switching matrix is provided having a planar array of individually actuatable bimorph drive elements commonly cantilevered within a housing. At least one movable contact is provided adjacent the free end of each drive element, the movable contact being held in a spaced relationship with at least one associated fixed contact. The fixed contacts are provided on the wall of the housing or on a support member that commonly mounts the drive elements. When the selected drive element is electrically actuated,
The drive element deflects to bring its movable contacts into electrical contact engagement with the associated fixed contacts. This switching operation may be single-throw or double-throw. In the latter case, each drive element is configured to selectively deflect in either direction to engage either one of the associated fixed contacts.

Each movable contact may be in the form of a shorting bar engageable with a pair of closely spaced stationary contacts. To wire the switching matrix, its row and column conductors are provided on both sides of the member in printed circuit form with appropriate electrical connections to the various relay contacts.

The multi-level planar layout of these conductors is made such that there is no wiring crossover, so there is no need to use multi-layer printing techniques.

Accordingly, the present invention has features, arrangements of parts, and combinations of elements in Structure 2 as described in the structure exemplified below, and the scope of the invention is indicated in the claims.

In order that the features and objects of the present invention may be better understood,
A detailed description will be given below with reference to the accompanying drawings.

The same reference numerals are used for corresponding components throughout the several figures.

DETAILED DESCRIPTION OF THE INVENTION In the embodiment of the invention illustrated in FIGS. 1 and 2, a piezoelectric relay switching matrix, generally designated 20, comprises a planar monolithic array having a plurality of individual bimorph drive elements 24. Contains 22. The drive element array is preferably a comb-like structure with a common central spine 26, with each drive element extending in a parallel distribution from either side of the spine like a comb. As shown in FIG.
8 along the spine section 26. Therefore,
Each bimorph drive element 24 is cantilevered and its free end is evenly spaced between the upper wall 32 and the lower wall 34 of the housing. Each drive element has a pair of piezoelectric ceramic plates 36 and 38, which are coupled to each other in a sandwich manner with an intermediate surface electrode 40 commonly disposed between them. . This intermediate surface electrode is common to all drive elements 24. Piezoelectric ceramic plate 36
The exposed upper surface of the piezoelectric ceramic plate 38 is covered with a conductive metal constituting an electrode 42, and the exposed lower surface of the piezoelectric ceramic plate 38 is similarly provided with an electrode as shown at 44. These plates are formed from well-known piezoceramic materials such as lead zirconate titanate (PZT), and the surface electrodes are formed by deposits of a suitable metal such as nickel or silver.

As shown in FIG. 2, an integrated circuit package 46 is mounted on the spine 24 and separate output leads are connected to each electrode 40, 42 and 44 of each drive element 24. In response to the selection signal, the integrated circuit applies an actuation voltage between one or the other of the piezoelectric ceramic plates 36, 38 of the selected drive element or elements to achieve the direction indicated by the arrow 48.
flexing upwardly as shown at a or downwardly as shown by arrow 48b. Mechanisms that operate to deflect cantilevered piezoceramic bimorph bending elements, such as drive element 24, are well known in the art.

Still referring to FIG. 2, adjacent the six free ends of each drive element are provided a pair of oppositely oriented movable contacts 50 and 52, which movable contacts 50 and 52 are commonly connected by an interconnecting stud 54. It is connected to the. Separate fixed contacts 56 are provided on the lower surface of the upper wall 32 of the housing in opposing relation to each upper movable contact 50 with a gap therebetween.
Further, individual fixed contacts 58 are provided on the upper surface of the lower wall 34 of the housing in opposing relation to each movable contact 52 with a gap therebetween.

Therefore, when the selected drive element 28 is deflected upwardly,
Its movable contact 50 engages an opposing stationary contact 56, and when the selected drive element is deflected downward, its movable contact 52 engages an opposing stationary contact 58. Contact engagement remains as long as one of the piezoelectric ceramic plates 36, 38 remains charged. In the unactuated rest state, the drive element has movable contacts 50 and 52 connected to fixed contacts 56 and 58, as shown in FIG.
each in an essentially uniformly spaced relationship with respect to each other. Each drive element 24, together with its associated movable contact 50.52 and fixed contact 56.58, constitutes a single-pole, double-throw piezoelectric relay.

The fixed and movable contact wiring of a switching matrix 20 using 18 double-throw (i.e., upwardly and downwardly deflecting) drive elements 24 to form a 6.times.6 matrix is shown in FIG. Codes R1 to R6 are 6
The row conductors are shown, and the symbols C1 to C6 are the six column conductors. As shown in FIG. 2, column conductors CI, C2 and C3 are printed circuit conductor lines provided on the upper surface of the lower wall 34 of the housing to the left of the pedestal 28, and column conductors C4,
C5 and C6 (printed circuit conductor lines provided on the upper surface of the lower wall 34 on the right side of the i-base 28).

These column conductors are shown in dash-dotted lines in FIG. As shown in FIG. 1, the column conductor C1 has a lead wire 60 (
2) to the movable contacts 50 and 52 of the three lower left drive elements 24.

Column conductor C2 is connected via leads to the movable contacts of the middle three drive elements extending to the left from the spine 26, and column conductor C3 is connected to the movable contacts of the top three drive elements on the left. be done. Column conductors C4, C5 and C6 are each connected to the first
As shown in the figure, it is connected to the movable contacts of the three driving elements 24 on the upper right, the three driving elements 24 in the middle on the right, and the three driving elements 24 on the lower right.

Row conductors R2, R4, R6 are shown in solid lines and are formed as serpentine printed circuit conductor lines on the top or exterior surface of the top wall 32 of the housing. It will be appreciated that these row conductors may be printed on the inner surface of the top wall 32 of the housing. Row conductors R1, R3 and R5, shown in dotted lines, are printed in a serpentine pattern on the lower or outer surface of the lower wall 34 of the housing. As shown, the row conductor R1 is connected to the first row conductor R1, counting from the bottom of FIG. Sixth and seventh left and right drive elements 24
It is connected to a fixed contact 58 associated with the. Row conductor R
2 is a stud 59 penetrating the upper wall 32 of the housing.
b to fixed contacts 56 associated with the same first, sixth and seventh left and right pairs of drive elements. Similarly, row conductors R3 and R4 are connected to the second . 5th and 8th
Fixed contacts 58 associated with the second left and right pair of drive elements 24
and 56, respectively, and the row conductors R5 and R6 are connected to the third . It is connected to fixed contacts 58 and 56 associated with the fourth and ninth left and right pairs of drive elements, respectively. The upper wall 32 of the housing supports a first plurality of terminals 55 electrically connected to fixed contacts 56, and the lower wall 34 of the housing supports a second plurality of terminals 57 electrically connected to fixed contacts 58. is supported. Only one terminal 55 and one terminal 57 are shown in FIG.

From the above description, it will be appreciated that any one column conductor can be connected to any one row conductor by selecting one drive element and actuating it appropriately.

For example, when the lower right drive element 24 is actuated and deflects downward, relay contacts 52.58 are engaged, connecting column conductor C6 to row conductor R1. At this time, column conductor C6
An input signal applied to the row conductor R1 is output to the row conductor R1, or vice versa. It will be appreciated that if multiple drive elements are actuated, an input signal provided to one row conductor (or column conductor) will be connected to a plurality of selected column conductors (or row conductors). The advantage of serpentine configuration of the row conductors is that no cross-overs occur and therefore there is no need for double-layer printed conductor wiring.

3 and 4, another embodiment of a piezoelectric relay switching ψ matrix 62 is shown.

This embodiment differs essentially from the matrix 20 of the embodiments of FIGS. 1 and 2 in that the movable contacts carried by the drive elements 24 are connected to the column conductors via leads 60 as described above. They are different in that they are not. In this embodiment, each drive element is provided with separate upper and lower movable contacts in the form of shorting rods 50a and 52a, respectively, as best shown in FIG. 52a are not electrically interconnected. Each upper shorting bar 50a can engage an associated pair of closely spaced fixed contacts 56a and 56b to establish a connection between the refixed contacts. Similarly, each lower shorting bar 52a can engage an associated pair of fixed contacts 58a and 58b to establish a connection between the refixed contacts. A pair of fixed contacts 56a, 56b are attached to the lower surface of the upper wall 32 of the housing, and a pair of fixed contacts 58a, 58
b is attached to the upper surface of the lower wall 34 of the housing. To form a relay switching matrix, the column conductors are connected to one fixed contact of a selected pair and the row conductors are connected to the other fixed contact of a selected pair. Housing L132 and 34 support terminals (not shown) similar to terminals 55, 57 (FIG. 2) for making electrical connections to the various fixed contacts.

FIG. 3 shows in dotted lines a comb-shaped planar integral array 22 having 18 drive elements 24 suitable for a 6.times.6 switching matrix. The row and column conductor layout shown in FIG. 3 is printed and wired on the underside of the top wall 32 of the housing and has six column conductors C1-C6 and only three row conductors, e.g. R1, R3 and R5. are doing. Also, the conductors of row conductors R1, R3 and R5 are connected to row conductor R2,
The same conductor layout is provided on the outer or lower surface of the lower wall 34 of the housing, except for use as R4 and R6. For this reason, for example, the upper wall 32 of the housing
The row conductor R1 printed above is the fixed contact 5 associated with the first left drive element 24 (again counting from the bottom of the figure).
6a and the fixed contacts 56b of the third, fifth, sixth, and eighth left drive elements, and the fixed contact 56a of the ninth left drive element. ing. The row conductor R2 printed on the lower surface of the lower wall 34 of the housing also connects the fixed contacts 58a associated with the first left drive element and the third, fifth, sixth and eighth left drive elements. It is connected to the fixed contact 58b of the drive element as well as to the fixed contact 58a of the ninth left fixed element.

Row conductors R3 and R5 in one layout, and row conductors R4 and R6 in the other layout, are wired in a serpentine manner so as to be connected to the various fixed contacts shown in FIG. 3 without crossover. .

As mentioned above, the wiring of the column conductors Cl-C6 is connected to the upper wall 32.
Column conductors C1-C6 in the layout above are connected to a selected fixed contact of the fixed contact pairs 56a, 56b, whereas column conductors Cl-C6 in the layout on the lower wall 34 are connected to a fixed contact pair of fixed contact pairs 56a, 56b. The layout printed on the earth wall and bottom wall of the housing is the same, except that it is connected to a selected fixed contact among 58a, 58b. Although not shown, the corresponding column conductors of the two layouts are connected to the switching matrix 62.
Note that they are commonly connected outside the .

As shown in FIG. 3, the wired column conductor C1 printed on the top wall 32 is connected to the fixed contacts 56b associated with the first left and right drive elements 24, and
It is connected to the fixed contact 56a of the second right drive element. Further, the column conductor C1 of the layout on the lower wall 34 is connected to the fixed contacts 58b of the first left and right driving elements, and the fixed contacts 58b of the second right driving element.
connected to. Thus, for example, when the first right drive element is actuated and deflects upward, its shorting bar 50a is connected to the associated fixed contact 56a, as shown in FIG.
, 56b to connect column conductor C1 to row conductor R3. On the other hand, the first right driving element is bent downward,
If the associated contacts 58a, 58b are bridged by their shorting rods 52a, column conductor C1 is connected to row conductor R4.

Similarly, if the first left drive element is deflected upward, the column conductor C1 is connected to the row conductor R1, and if it is deflected downward, the column conductor C1 is connected to the row conductor R2. Ru. All other matrix switch points connecting any column conductor to any selected row conductor can be easily seen from FIG.

In the embodiments described above, each piezoelectric relay operates to connect a single column conductor to a single row conductor. In many communications applications, such as telephones, both sides of the line must be switched at the same time.

To this end, in FIGS. 5 and 6 the overall 64
The switching fist matrix embodiment shown in FIGS. 3 and 4 is a variation of the embodiment of FIGS. The row conductor pair is configured to connect to one row conductor pair. To this end, as shown in FIG. 5, the switching matrix 64 comprises a comb-shaped planar array 22 with piezoelectric drive elements 24 shown in dash-dot lines and mounted in the manner shown in FIG. . As shown in FIG. 6, the free end of each drive element includes a pair of electrically isolated upper shorting bars 66a and 66b and a pair of electrically isolated lower shorting bars 68.
a and 68b are provided. A pair of closely spaced stationary contacts 70a and 70b are attached to the inner surface of the upper wall 32 of the housing in opposing relation with a gap between each upper shorting bar 66a, and each upper shorting bar 66b A pair of closely spaced stationary contacts 72a and 72b are similarly mounted in spaced, opposing relationship. Similarly, fixed contact pairs 74a, 7
4b, 76a, and 76b are the shorting rods 6 of each drive element 24.
They are respectively attached to the inner surface (upper surface) of the lower wall 34 of the housing in opposed relation to 8a and 68b with a gap therebetween. In this configuration, when the drive element is deflected upward, its shorting bar 66a connects the fixed contact pair 70a, 70.
b, and the shorting rod 66b connects the fixed contact pair 72a.
, 72b. Similarly, when the drive element is deflected downward, its shorting bars 68a and 68b bridge fixed contact pairs 74a, 74b and 76a, 76b, respectively. As shown in FIG. 5, the column conductor pairs are connected to one of the eight pairs of fixed contacts associated with the selected drive element, such as fixed contacts 70a and 72a, and the row conductor pairs are connected to the selected drive element. It is connected to the other fixed contacts 70b and 72b of the two fixed contact pairs associated with the element.

Referring to FIG. 5, the row and column conductor pair layout shown here is printed on both sides of the top wall 32 of the housing and includes six row conductor pairs R1-T, R1 in a 6X6 switching matrix. -R to R6-T, R6-R
and three column conductor pairs, e.g. C-T, CI-R and C
3-T, C3-R and only C3-T, C3-R.

The same conductor layout is provided on both sides of the lower wall 34 of the housing, replacing the three column conductors mentioned above with the other three column conductor pairs C.
2-T, C2-R and C4-T.

It is configured as C4-R, C6-T, and C6-R. For purposes of illustration, the conductors shown in solid lines in FIG. 5 are printed on the outer surface (top surface) of the upper wall 32 (FIG. 6) of the housing, and the conductors shown in dashed lines are printed on the inside surface (bottom surface) of this top wall. I want to be thought of as someone who exists.

This same configuration also applies to the layout of the conductors printed on both sides of the lower wall 34 of the housing. The layout of the conductors on each side is done to avoid crossovers. This requires a number of conductor crossovers from one side of the wall to the opposite side, which is accomplished by plated holes or passages 7B. In some cases, these passageways are formed using conductive studs 80 at the fixed contacts, as shown in FIG.

In FIG. 5, the chip conductor CI-T of row 1 is connected to the top wall 32.
is connected to the fixed contact 72a associated with the eighth left drive element 24 and then connected to the eighth right drive element via a conductor 81 printed on the inner surface of the top wall 32. It is connected to the fixed contact 72a of the drive element and also transitions through a passage 78 to the upper surface of the top wall 32 to be connected to the fixed contact 72a of the second and fifth left drive elements. These fixed contacts connect to the second via stud 80 and conductor 81.
It is commonly connected to the corresponding fixed contacts of the th and 5th right drive elements. The ring conductor CI-R of row 1 extends on the inner surface of the top wall 32 and is connected to the fixed contacts 70a of the second, fifth and eighth left drive elements;
Then, the second, fifth and eighth
It is connected to the fixed contact 70a of the right drive element. The tip and ring conductors C2-T and C2-R of row 2 are connected to the lower wall 3 of the housing in the same manner as above for connection to fixed contacts 74a and 76a of the same drive element as above.
Note that it is arranged on both sides of 4.

Further, referring to FIG. 5, the row 1 chip conductor R1-T
extends on the inner surface of the top wall 32 and is connected to the fixed contacts 72a of the ninth left and right drive elements 24, and then via studs 80 and jumpers 82a printed on the top surface of the top wall 32. Fixed contact 72 of the eighth left drive element
connected to b. Similarly, ring conductor R of row 1
1-R extends on the inner surface of the top wall 32 and connects to the fixed contacts 70a of the ninth left and right drive elements, and then connects the stud 80 and the jumper 82b printed on the top surface of the top wall 32. Fixed contact 7 of the 8th left drive element through
2b. 21, the tip and ring conductors R1-T and R1-R of row 1 are also provided on both sides of the bottom wall 34 for the ninth left and right drive elements and the eighth left drive element. Note that they are similarly connected to corresponding fixed contacts 76a and 76b.

From the above description, for example, when the eighth left drive element is bent upward, its shorting bar 66a bridges the associated fixed contacts 7Qa, 70b, and the shorting bar 66
It will be appreciated that b bridges the associated fixed contacts 72a, 72b. As a result, column 1 tip and ring conductors CI-T and CI-R are connected to row 1 tip and ring conductors R1-T and R1-R, respectively. On the other hand, if the eighth left driving element is deflected downward,
Row 2 tip and ring conductors C2-T and C2-R
are the tip and ring conductors R1-T and R1- of row 1
Connected to R. All other matrix switch points connecting the tip and ring conductor pairs of any column to the tip and ring conductor pairs of any selected row are the fifth
It can be easily understood from the figure. It will be seen that in each case a single drive element is actuated to connect a single column conductor pair to an associated single row conductor pair.

The printed circuit layout of row and column conductors is formed on the four readily available walls of the housing without crossover on either wall.

FIG. 7 shows a preferred free end configuration for the drive element 24 where the movable contact is in the form of a shorting bar.

Switching matrix 62 of FIGS. 3 and 4
For a single pole piezoceramic relay in
The free end of each drive element 24 is bifurcated by a shallow slot 140 to define a pair of independent relatively flexible fingers 142a, 142b. Conductor pad 1
44a are deposited on the faces of the fingers adjacent their free ends and conductors 144b formed along the slots 140.
are commonly and integrally connected. A button-like contact 146 is mounted or plated on the pad 144a to electrically connect with the pad. A surface electrode 42 terminates before pad 144a and interconnect conductor 144b. It will be appreciated that this shorting bar configuration is also aligned and formed on the lower surface of drive element 24.

With this construction, the fingers 142a and 142b are able to flex independently of each other and are therefore sensitive to slight differences in relative height and slight torsion of the drive element that may occur when the drive element flexes. Regardless, it is possible to ensure electrical contact with the opposing pair of fixed contacts, for example, fixed contacts 56a and 56b in FIG.

Switching matrix 64 of FIGS. 5 and 6
In the case of the bipolar piezoelectric relay structure in FIG.

The multi-pole slot 140 is shown in FIG. 7 and as described above.
It is divided into two parts by. Pad 144 a1
The formation of interconnects 144b and button-like contacts 146 are similarly formed in multiple poles as shown. The advantages derived from this structure have been described above.

It will be understood from the above description that the above objectives have been achieved. The embodiments shown in the accompanying drawings are merely illustrative, and various changes may be made to the configuration described above without departing from the scope of the invention.

[Brief explanation of the drawing]

FIG. 1 is a schematic top view of a piezoelectric relay switching matrix constructed in accordance with one embodiment of the present invention. 2 is a side view of a portion of the switching matrix of FIG. 1; FIG. FIG. 3 is a schematic plan view of a piezoelectric relay switching matrix constructed in accordance with another embodiment of the present invention. 4 is a side view of a portion of the switching matrix of FIG. 3; FIG. FIG. 5 is a schematic plan view of a piezoelectric relay switching matrix constructed in accordance with another embodiment of the present invention. 6 is a side view of a portion of the switching matrix of FIG. 5; FIG. FIG. 7 is a partial perspective view of the movable contact end of a bimorph drive element applicable to the switching matrix embodiments of FIGS. 3 and 5; FIG. [Explanation of main symbols] 20...Piezoelectric relay φ switching matrix,
22... Piezoelectric relay array, 24... Drive element, 2
6... Spine portion, 28... Stand, 30... Housing, 32... Earthen wall of housing, 34... Lower wall of housing, 46... Integrated circuit package, 50.52...
...Movable contact, 56.58...Fixed contact.

Claims (1)

Claims: 1. (a) Each piezoelectric relay comprises at least one elongated drive element having a fixed end and an opposite free end, the drive element being disposed adjacent to the free end thereof; (b) first means for cantilevering said drive element adjacent a fixed end of said drive element; c) second means for mounting a fixed contact of each said relay in spaced relation to a movable contact of said each relay; and (d) connected to a contact of a selected one of said relays. a plurality of first and second conductors, at least the first conductor being deposited on the second means as a printed circuit conductor, and at least the first conductor of the selected one of the relays; When actuating the drive element, the fixed and movable contacts of the one relay engage to connect one of the first conductors to one of the second conductors; Features a piezoelectric switching matrix. 2. The piezoelectric switching matrix of claim 1, wherein said drive element of said array of piezoelectric relays is formed as a unitary structure of piezoceramic material. 3. The unitary structure is a comb-shaped structure having a common spine, and the driving elements extend parallel to each other at intervals from the common spine, and the spine is fixed to the first means. A piezoelectric switching matrix according to claim 2. 4. The piezoelectric switching matrix of claim 3, wherein said drive elements extend in opposite directions from opposite sides of said spine. 5. A piezoelectric switching device according to claim 3, further comprising an integrated circuit mounted on the spine for actuating a drive element of a selected one of the relays.
matrix. 6. A piezoelectric switching matrix according to claim 1, wherein said array of piezoelectric relays is surrounded by a housing, said second means being constituted by a wall of said housing. 7. Each said relay has first and second fixed contacts mounted by said second means on either side of said movable contact, and the drive element of each said relay causes its movable contacts to be connected to said first and second fixed contacts. 2. A piezoelectric switching matrix according to claim 1, wherein the piezoelectric switching matrix is selectively actuated to engage either one of the fixed contacts of the piezoelectric switching matrix. 8. The array of piezoelectric relays is surrounded by a housing, and the second means for mounting the first and second fixed contacts of each relay are constituted by opposite walls of the housing. A piezoelectric switching matrix according to claim 7. 9. The first conductor is connected to the first and second fixed contacts of a selected one of the relays, and the second conductor is connected to the movable contact of the selected one of the relays. 9. A piezoelectric switching matrix according to claim 8, connected to a piezoelectric switching matrix according to claim 8. 10. The piezoelectric switching matrix of claim 9, wherein said first conductors are arranged on opposite wall surfaces of said housing so as to avoid crossover. 11. The piezoelectric switching matrix of claim 10, wherein an integrated circuit is mounted within the housing for actuating a selected one of the piezoelectric relays. 12. (a) each piezoelectric relay comprises an elongate drive element having a fixed end and an opposite free end, at least one elongate drive element mounted adjacent to the free end of the drive element;
one movable contact, and at least one pair of first and second movable contacts;
(b) first means for cantilevering said drive element adjacent said fixed end of said drive element; (c) of each of said relays; (d) second means for mounting the first and second fixed contacts of the pair in a spaced side-by-side relationship with each other and in a spaced relationship with the movable contacts of each of the relays; (e) a plurality of first conductors connected to the first fixed contact of the selected one of the relays; and (e) a plurality of first conductors connected to the second fixed contact of the selected one of the relays. a second conductor of a selected one of said relays, said first and second conductors being deposited as printed circuit conductors on a surface of said second means; When actuated, the movable contact of the one relay shorts its first and second fixed contacts so that one of the first conductors connects to one of the second conductors. A piezoelectric switching matrix characterized in that: 13. The piezoelectric switching matrix of claim 12, wherein the drive elements of the array of piezoelectric relays are formed as a unitary structure of piezoceramic material. 14. The unitary structure is a comb-shaped structure having a common spine, and the driving elements extend parallel to each other and spaced apart from the common spine, and the spine is fixed to the first means. 14. A piezoelectric switching matrix according to claim 13. 15. The piezoelectric switching matrix of claim 14, wherein said drive elements extend in opposite directions from opposite sides of said spine. 16. The piezoelectric switching matrix of claim 15, wherein an integrated circuit is mounted on the spine for actuating a drive element of a selected one of the piezoelectric relays. 17. A piezoelectric switching matrix according to claim 12, wherein said array of piezoelectric relays is surrounded by a housing, and said second means is constituted by a wall of said housing. 18, each of said relays being mounted by said second means with first and second movable contacts electrically isolated and mounted adjacent a free end of said drive element; a first pair of said first and second fixed contacts which are shorted at said first movable contact when the element is actuated; 13. A piezoelectric switching matrix as claimed in claim 12, including a second pair of said first and second fixed contacts which are shorted at said second movable contact when the piezoelectric switching matrix is switched. 19. the array of relays is surrounded by a housing;
19. A piezoelectric switching matrix according to claim 18, wherein said second means for mounting said first and second pairs of fixed contacts is constituted by at least one wall of said housing. 20. The piezoelectric switching matrix of claim 19, wherein said first and second pairs of stationary contacts are respectively mounted on opposite walls of said housing. 21. The first and second conductors are configured as a first and second conductor pair, and the first conductor pair is connected to the first and second fixed contacts of a selected one of the relays, respectively. the first fixed contacts of each of the pairs, and the second pair of conductors respectively connect the first fixed contacts of each of the first and second pairs of contacts of a selected one of the relays.
are connected to fixed contacts of the relays, thereby causing one of the first pair of conductors to connect to one of the second pair of conductors when a drive element of a selected one of the relays is actuated. A piezoelectric switching matrix according to claim 18 connected thereto. 22, each of said relays being electrically isolated and mounted adjacent a free end of said drive element;
a first set of first and second pairs consisting of third and fourth movable contacts and said first and second fixed contacts; and third and second pairs consisting of said first and second fixed contacts. a second set of four pairs of fixed contacts, wherein said first and second sets of fixed contact pairs are attached by said second means, and when said drive element is actuated in one direction, said first and second sets of fixed contact pairs are attached by said second means; first and second movable contacts respectively short-circuit the first and second fixed contacts of the first set of fixed contact pairs, and when the drive element is actuated in opposite directions, the third and 13. The piezoelectric switching matrix of claim 12, wherein each fourth movable contact shorts the first and second fixed contacts of the second set of fixed contact pairs. 23, said first and second conductors are configured as a first and second conductor pair, said first conductor pair being connected to said first and second set of selected ones of said relays, respectively; and the second conductor pair is connected to the first fixed contact of each of the fixed contact pairs of at least one set of the relays, and the second conductor pair is said second fixed contacts of said pair of fixed contacts of at least one of said sets, whereby when said actuating element of a selected one of said relays is actuated, said first pair of conductors; 23. The piezoelectric switching matrix of claim 22, wherein one of the conductors is connected to one of the second pair of conductors. 24, said array of piezoelectric relays being surrounded by a housing, said housing having a first wall mounting said first and second pairs of fixed contacts of said first set; 24. A piezoelectric switching matrix according to claim 23, further comprising an opposite second wall mounting a fourth fixed contact pair. 25. The first and second conductor pairs are arranged as non-intersecting printed circuit conductors on opposite sides of the first and second walls and have conductive transitions between the opposite sides of the walls. The piezoelectric switching device according to claim 24
matrix. 26. The piezoelectric switching matrix of claim 25, wherein the drive elements of said array of relays are formed as a unitary structure of piezoceramic material. 27. said unitary structure is a comb-shaped structure having a common spine, said drive elements extending parallel to each other and spaced apart from said common spine, said spine being connected to said first means; 27. A piezoelectric switching matrix according to claim 26, which is fixed. 28. The piezoelectric switching matrix of claim 27, wherein the drive elements extend in opposite directions from opposite sides of the spine. 29. The piezoelectric switching matrix of claim 28, wherein an integrated circuit is mounted on the spine for actuating a drive element of a selected one of the piezoelectric relays. 30. (a) an insulating substrate having a pedestal; and (b) each piezoelectric relay having a fixed end and an opposite free end, and a portion adjacent the fixed end being cantilevered on the pedestal; an elongated drive element, which is fixed in the formula
a piezoelectric relay comprising at least one movable contact mounted adjacent the free end of the drive element and at least one pair of first and second fixed contacts mounted on a surface of the substrate; (c) a first and second plurality of terminals; (d) individually connected from the first plurality of terminals to the first fixed contact of a selected one of the relays; (e) a plurality of second conductors individually connected from the second plurality of terminals to the second fixed contact of a selected one of the relays; the first and second conductors are deposited as printed circuit conductors on at least one side of the substrate, and when a drive element of a selected one of the relays is activated; wherein the movable contact of the one relay shorts its first and second fixed contacts so that one of the first plurality of terminals is connected to one of the second plurality of terminals. piezoelectric switching matrix. 31. The piezoelectric switching matrix of claim 30, wherein the drive elements of said array of relays are formed as a unitary structure of piezoceramic material. 32. The unitary structure is a comb-shaped structure having a common spine, and the driving elements extend parallel to each other at intervals from the common spine, and the spine is fixed to the platform. 32. A piezoelectric switching matrix according to claim 31. 33. The piezoelectric switching matrix of claim 32, wherein the drive elements extend in opposite directions from opposite sides of the spine. 34. The piezoelectric switching matrix of claim 31, wherein said first and second plurality of terminals are provided on said substrate. 35, an integrated circuit for actuating the drive element of a selected relay; and a second integrated circuit connected to the integrated circuit by printed circuit conductors arranged on at least one of the first and second sides of the substrate. 35. The piezoelectric switching matrix of claim 34, comprising a plurality of terminals of 3.