JPS63119544A - Probing card - Google Patents

Abstract

PURPOSE:To perform the measurement of an object under test with high accuracy, by the constitution wherein a circuit board, to which probes are attached, can be rotated in a plane. CONSTITUTION:Probes 5 are attached to a first circuit board 2. A second substrate 3 is connected to an inspecting circuit for measurement, which is electrically connected to said first substrate 2. A mechanism which can rotate said first board 2 is provided. For example, the first doughnut type circuit board 2 is constituted so that it can be rotated in the direction of theta by the maximum value of + or -3 deg. by the screwing action, which is obtained by rotating a screw 9 that is engaged with a rotary shaft 8. The screw 9 is rotated with an electric motor 7. The rotary shaft 8 can be extended and contracted. Thus the arranging pattern of the tips of the probes 5, which are attached to a probing card 1, and the arranging pattern of the electrode pads of a semiconductor chips are adjusted so that the patterns face to each other. The patterns are connected and their position alignment becomes easy. Thus the object under test can be measured highly accurately.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe card.

(Prior Art) A probe card is known, for example, from Japanese Patent Publication No. 59-3581, and is attached to a probe device, such as a half-centered wafer flow bar.

Since the probe card and the tester are wired by bringing the probe needle attached to the probe card into contact with the electrode part of the semiconductor element, conduction can be established between the semiconductor element and the tester. With the tester in contact with the electrode part of the semiconductor element, a test signal is output from the tester and applied to the input electrode of the semiconductor element, and the electrical signal generated at the output electrode is compared with the signal expected by the tester to determine whether the semiconductor element It is used to determine the quality of the element.

(Problems to be Solved by the Invention) When measuring with a conventional wafer prober, when the electrode arrangement pattern of the wafer placed on the mounting table and the arrangement pattern of the probe needle tips attached to the probe card are opposed to each other, The positional deviation on the plane, that is, the deviation in the θ direction, is corrected by rotating the insert ring that holds the probe card.

However, when making measurements with the test head installed above the prober housing, the wiring from the pin electronics port of the measurement test board including the driver/comparator installed inside the test head to the probe card must be rotated around the insert ring. Since it is necessary to rotate the insert ring, the wiring is long so that there is a little leeway and the wiring does not break even when the insert ring is rotated. From this, it was found that as shown in FIG. 3, the wiring from the pin electronics port (20) to the probe card (21) was approximately 120 m long, which would impede high-precision measurement. The present invention has been made to improve the above-mentioned problems, and provides a probe card that enables highly accurate measurements when a test head is installed in a probe device using this probe card.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a first circuit board to which a probe needle is attached, and a second circuit board connected to a measuring test circuit electrically connected between the first circuit board. The present invention provides a probe card comprising a substrate and a mechanism capable of rotating the first substrate.

(Function) The first board to which the probe needle is attached, the second board connected to the measurement inspection circuit electrically connected between the first circuit board, and the first board can be rotated. The probe card equipped with this mechanism makes it possible to measure the object to be measured with high precision.

(Example) Next, an example in which the probe card of the present invention is applied to a probe card for a semiconductor wafer prober will be described with reference to the drawings.

This probe card ■ is attached to, for example, a semiconductor wafer prober, and the probe needle (
A test installed above the prober housing is used to test the electrical performance of each semiconductor chip by sequentially contacting the object to be measured, such as a wafer, with a large number of electrode pads of regularly formed semiconductor chips in units of multiple chips. The measurement is performed using a tester configured in the head (10) or probe device.

Next, the configuration of this probe card (■) consists of a first donut-shaped circuit board (■) with a diameter of, for example, 100 m and a probe needle (■) attached to the center, and a second donut-shaped circuit board (■) surrounding this first donut-shaped circuit board (■). Donut-shaped circuit board ■Diameter, e.g. 200m
The first donut-shaped circuit board (2) is pivotally attached to the second donut-shaped circuit board (2) so as to be rotatable in the θ direction. The wiring on this second donut-shaped circuit board (2) is connected to a tester so that various electrical performances can be measured. The wiring on the first donut-shaped circuit board (2) is connected to each probe needle (2), respectively. At the shortest distance between the outer periphery of the wiring on this No. 1 donut-shaped circuit board (■) and the wiring on the second donut-shaped circuit board (■), use a wire (A), for example, a vinyl-coated AQ wire with a thickness of 5ffi, to loosen it slightly. It is electrically connected from the probe needle ■ to the tester.

Next, the rotation of the first donut-shaped circuit board (2) in the zero direction will be explained.

The second donut-shaped circuit board (■) is attached to the prober housing (
(not shown) is held and fixed by an insert ring (18) attached to the insert ring (18). The first donut-shaped circuit board above■
The screw ■ engaged with the rotating shaft (C) is rotated by the rotation of the electric motor ■, and is configured to be rotatable in the 0 direction by a maximum of ±3'', for example, by the screwing action.The rotating shaft ■ can be extended and contracted. be.

Here, a teaching operation for executing an automatic process in probe measurement using this probe card (2) will be explained.

A wafer 0 on which semiconductor chips are regularly arranged is placed on a measurement stage (16), and the wafer 0 is positioned with respect to the XY drive of the propper. After this, the measurement stage (
16) is set at a position opposite to the probe card (2), and the measurement stage (16) is then zipped up to align the probe needle (2) attached to the probe card (2) with the pad of the chip. This is the X-Y
The drive is operated by a joystick and the joystick that controls the motor ■ for controlling the rotation of the first donut-shaped circuit board ■ rotates it in the θ direction, and the tip of the probe needle ■ attached to the probe card ■. The arrangement pattern of the semiconductor chip and the electrode pad arrangement pattern of the semiconductor chip are adjusted so as to face each other, and are connected and aligned. This positioning can be performed by adjusting the tip arrangement of the probe needle 0 and the arrangement of the electrode pads using a TV camera or a monitoring optical system. This operation is performed so that all chips formed on wafer 0 can be measured, and the teaching operation is completed.

The above positioning can be automatically corrected by calculating the contact state between the electrical loss pad and the probe needle (2). Next, the test head (10) is installed on the wafer prober equipped with the probe card (■), and the test head (
10) and the probe card (υ) will be explained with reference to FIG.

The test head (10) has a predetermined voltage and
Output current/signal, or output voltage/current/signal from device.
A board for inputting signals, such as a pin electronics port (11), is configured, and wires (13) L, from the electronics port (11) to the performance port (12) are connected to the pogo pin (13) from the performance port (12) to the probe card. 14). The probe card ■ is held by the insert ring (18).

The wiring from the pin electronics port (11) shown above to the probe card is reduced to about 501 lines.

〔Effect of the invention〕

As explained above, according to the present invention, since the circuit board to which the probe needle is attached is configured to be rotatable within a plane, it is possible to measure the object to be measured with high precision.

[Brief explanation of the drawing]

Fig. 1 is a diagram of a probe card for explaining one embodiment of the present invention, Fig. 2 is an explanatory diagram of the state in which the probe card of Fig. 1 is attached to a semiconductor wafer prober, and Fig. 3 is a diagram of a conventional probe card attached to a semiconductor wafer prober. It is a figure attached to a wafer blower. 1...Probe card

Claims (1)

[Claims] a first circuit board to which a probe needle is attached; a second board electrically connected between the first circuit board and connected to a measurement inspection circuit; and a mechanism capable of rotating the first board. A probe card characterized by comprising: