JPS63119239U - - Google Patents
Info
- Publication number
- JPS63119239U JPS63119239U JP1987011304U JP1130487U JPS63119239U JP S63119239 U JPS63119239 U JP S63119239U JP 1987011304 U JP1987011304 U JP 1987011304U JP 1130487 U JP1130487 U JP 1130487U JP S63119239 U JPS63119239 U JP S63119239U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire bonding
- identification display
- utility
- rear end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011304U JPH0510363Y2 (cg-RX-API-DMAC7.html) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987011304U JPH0510363Y2 (cg-RX-API-DMAC7.html) | 1987-01-28 | 1987-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119239U true JPS63119239U (cg-RX-API-DMAC7.html) | 1988-08-02 |
| JPH0510363Y2 JPH0510363Y2 (cg-RX-API-DMAC7.html) | 1993-03-15 |
Family
ID=30798396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987011304U Expired - Lifetime JPH0510363Y2 (cg-RX-API-DMAC7.html) | 1987-01-28 | 1987-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510363Y2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231006A (ja) * | 1994-02-16 | 1995-08-29 | Nec Corp | ワイヤボンディング装置 |
| JP2011502232A (ja) * | 2007-10-29 | 2011-01-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電磁弁用のプランジャ、および、電磁弁用のプランジャの識別方法 |
-
1987
- 1987-01-28 JP JP1987011304U patent/JPH0510363Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231006A (ja) * | 1994-02-16 | 1995-08-29 | Nec Corp | ワイヤボンディング装置 |
| JP2011502232A (ja) * | 2007-10-29 | 2011-01-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電磁弁用のプランジャ、および、電磁弁用のプランジャの識別方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510363Y2 (cg-RX-API-DMAC7.html) | 1993-03-15 |