JPS63119236A - Applying method of resist - Google Patents

Abstract

PURPOSE:To form a uniform resist film without the irregularities of application by dropping a resist onto a substrate, turning a substrate base plate while starting exhaust in a vessel and stopping the revolution and exhaust of the substrate base plate at a time when the whole surface of the substrate is coated uniformly with the resist. CONSTITUTION:A fixed quantity of a resist liquid 3 is dropped to an silicon substrate 2 placed and fixed onto a substrate base plate 1. The fixed quantity of the resist liquid 3 dripped at a central point on the silicon substrate 2 is not affected by displacement and concentrically spreads around the central point of the silicon substrate 2, and dryness is also made lower than when there is an exhaust flow on the surface of the substrate. The substrate base plate 1 is turned at high speed by a motor 9 while an on-off valve 11 is opened by a controller 12, and a gas generated from a solvent for the resist liquid and resist balls scattered are exhausted. The base plate 1 is rotated for a fixed time, thus forming a uniform resist film having no application irregularity on the silicon substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to an improvement in a resist coating method for coating a resist on a substrate.

(bl Background of the technology) It is well known that when forming semiconductor devices such as IC-LSI, a micro U≠ rich resist film pattern using photolithography is used in the process of forming a micro pattern. be.

(c) Conventional technology and problems For example, conventional resist coating involves dropping a resist solution onto a semiconductor element formation substrate such as silicon (Si) and uniformly applying the resist solution onto the substrate to form a resist film. The method will be explained using FIG.

In the figure, a Si substrate 2 is fixed on a substrate mounting table 1 having a chuck mechanism, and a resist solution 3 is dropped onto the substrate 2 by a resist dropping nozzle 4 using high-pressure nitrogen or the like. There is metal around the board mounting table 1.
The upper surface of the container 5 is provided with a lid 6 having a hole through which the dripping nozzle 4 passes, and the lower part of the container 5 is provided with an exhaust hole 7. It is connected to an exhaust duct (not shown) and is constantly exhausted.

By rotating the substrate mounting table 1 at high speed by the motor 9Vc, the dropped resist solution 3 on the substrate 2 is spread to a uniform thickness and is evenly applied onto the substrate 2. At this time, the resist solution 3t--To prevent the gas generated by the dissolved solvent and the resist balls of the resist solution 3 that are scattered when the substrate mounting table 1 is rotated from being spread or scattered to other locations, The container 5 and the lid 6 constitute an exhaust chamber 10 to prevent the resist balls from re-adhering to the substrate, and the resist balls are exhausted through an exhaust system from an exhaust hole 7 provided at the bottom of the container 5.

However, if the exhaust system is too strong,
When dropping the resist liquid, the resist liquid 3 does not spread concentrically with the substrate 2, and the surface of the resist liquid 3 on the substrate 2 becomes dry during the dropping of the resist liquid, causing uneven coating. The resist solution at the tip of the printer dries, resulting in uneven coating or dust.

(d) Object of the Invention An object of the present invention is to provide a resist coating method that solves the above problems and can form a uniform resist film on a substrate without uneven coating.

(e) Structure of the Invention In order to achieve the above object, a resist is dropped onto the substrate while the substrate mounting table on which the substrate is placed is stopped, and after the dropping, the substrate mounting table is rotated and at the same time the resist in the container is To provide a resist coating method, which starts evacuation and stops rotation of a substrate mounting table and evacuation when the resist coats the entire surface of the substrate evenly.

G) Embodiments of the Invention Examples of the present invention will be described below with reference to the drawings.

FIG. 2 is a schematic configuration diagram of a resist coating apparatus for explaining one embodiment of the present invention, and the same parts as in the previous example are given the same reference numerals.

As is clear from the figure, the device according to this embodiment differs from the conventional one in that, for example, an electromagnetic opening/closing pulp 11 is provided in the middle of a connecting pipe 8 forming a part of the exhaust system, and a control device 12 controls the exhaust chamber 10. The addition of a function to adjust the exhaust flow from the atmosphere makes it possible to perform exhaust only while the substrate mounting table 1 is rotating after dropping the resist.

For example, a silicon substrate 2 is mounted and fixed on a substrate mounting table 1, and a predetermined amount of resist liquid 3 is dropped onto the silicon substrate 2 through a resist liquid dropping nozzle 4 provided on the center point of the silicon substrate 2. .

In this case, the on-off valve 11 is closed and the atmosphere in the exhaust chamber 10 is stationary, so that a predetermined amount of resist liquid 3 dropped onto the center point on the silicon substrate 2 is not affected by the exhaust flow. The surface of the resist liquid 3 that spreads in a circular manner around the center point of the silicon substrate 2 and spreads on the silicon substrate 2 can be made less dry than when there is an exhaust flow. Next, the substrate mounting table 1 is rotated at high speed by the motor 10, and at the same time, the opening/closing valve 1 is opened by the control device 12 to exhaust gas generated from the solvent of the resist solution and scattered resist balls. After rotating for a predetermined period of time to form a uniform resist film on the silicon substrate 2, the rotation is stopped and at the same time, the opening/closing valve 12 is closed by the control device 12. In this way, by exhausting the air only from the start of rotation to the time it stops, the drying of the resist (1) at the tip of the nozzle 4 for dropping the reed resist is significantly reduced compared to conventional equipment that exhausts the air all the time, and the occurrence of uneven coating and dust is reduced. .

Of course, if necessary, the exhaust flow blocking mechanism may be a weaker exhaust mechanism.

(g) Effects of the Invention According to the resist coating method of the present invention, the resist liquid is not affected by the exhaust flow when it is dropped onto the substrate, so a uniform resist film with no uneven coating can be formed on the substrate. This has a great effect on improving yield and quality.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a resist coating apparatus for explaining a conventional technique, and FIG. 2 is a schematic configuration diagram of the apparatus for explaining a resist coating method of the present invention. In the figure, 1 is a substrate mounting table, 2 is a substrate, 3 is a resist liquid, 4 is a resist liquid dripping nozzle, 7 is an exhaust hole, 8 is a connecting pipe, 10 exhaust chambers, 11 is an electromagnetic opening/closing pulp, and J2 is a control device. shows. Figure 1↓ Figure 2 number

Claims (1)

[Scope of Claim] A resist coating method in an apparatus equipped with a resist dripping nozzle, a rotating substrate mounting table, and an exhaust system for exhausting the inside of a container housing the tip of the nozzle and the substrate mounting table, comprising: Drop the resist onto the substrate while the substrate mounting table is stopped, rotate the substrate mounting table after dropping, and at the same time begin to exhaust the inside of the container. When the entire surface of the substrate is evenly covered with resist, remove the resist from the substrate mounting table. A resist coating method characterized by stopping the rotation and exhaust of the.