JPS6311907Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor conversion device comprising a plurality of semiconductor stacks (hereinafter referred to as stacks).

2. Description of the Related Art In recent years, semiconductor conversion devices (hereinafter referred to as "devices") have tended to have larger capacities, and as a result, devices have also become larger and larger, and due to restrictions such as installation space, there is a demand for devices to be simpler and more compact.

Generally, when configuring a device by arranging a large number of stacks in parallel in the vertical or horizontal direction, the input/output conductors connected to the stacks and the members for attaching and supporting the stacks are constructed from separate members. . For this reason, the increase in the number of structural members requires a large space, resulting in an unnecessary increase in the size of the device.

FIG. 1 is a diagram showing an example of the configuration of a conventional semiconductor conversion device. In this figure, 1 is a flat stack including a large number of flat semiconductor elements 2, cooling fins 3 for dissipating heat generated by the elements 2, and input/output terminals. Consists of 4a, 4b, etc. Since the stack is outside the scope of the present invention, a detailed explanation will be omitted here. Reference numeral 5 denotes pillars for mounting and supporting the stack 1 described above, which are arranged in parallel to face each other on both sides of the stack 1 and fixed to the main body frame 6. A large number of the stacks 1 are vertically housed and mounted on this support 5 by means of mounting legs 7. Further, input/output conductors 8a and 8b are installed at positions offset from the stack 1 and extend in the stacking direction of a large number of stacks, and are connected to the input/output terminals 4a and 4b of each stack 1 by connection conductors 9a and 9b.
connected to.

In conventional devices configured in this way, a large amount of space is required to regulate the insulation distance between the input/output conductors and each stack and main frame, as well as between the input/output conductors, and to eliminate the influence of electromagnetic force. This led to an unnecessary increase in the size of the device.

In view of the above, the purpose of the present invention is to eliminate the above-mentioned disadvantages and provide a simple and compact semiconductor conversion device by using both an input/output conductor and a support for accommodating a large number of stacks. It is something.

The configuration of the present invention will be explained below based on the drawings. FIG. 2 shows an embodiment of the apparatus of the present invention, and shows the same configuration as that of FIG. 1. The pillars 5 and input/output conductors 8a, 8 shown in FIG.
Supports 10a and 10b, which also have the same functions as the main body frame 6, extend through an insulator 12 and are connected to the input/output terminals 4a and 4b of each stack 1 through connection conductors 11a and 11b. The stack 1 is also supported by mounting legs 7 on columns 10a, 10b.

As described above, by combining the pillars for storing and supporting the stack with input/output conductors, the number of component parts can be reduced, and the space required by the electromagnetic force and insulation distance between each member can be reduced. Therefore, it is possible to provide a compact semiconductor conversion device.

FIG. 3 shows another embodiment in which stacks are arranged horizontally in parallel, and the same numbers as in FIG. 2 are the same components. Here, the mounting feet 7 may be omitted if they are also used for the input/output terminals 4a, 4b (or the connecting conductors 11a, 11b) of the stack 1. As described above, according to the present invention, the number of component parts can be reduced, the space regulated by electromagnetic force or insulation distance can be prevented from increasing in size, and the device can be simplified and compact.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a conventional semiconductor conversion device, Figure 2 is a perspective view of a conventional semiconductor conversion device;
The figure is a perspective view showing one embodiment of the present invention, and FIG. 3 is a perspective view showing another embodiment of the present invention. 1... Rectifier stack, 2... Flat semiconductor element,
3... Cooling fins, 4a, 4b... Input/output terminals,
5... Support column, 6... Body frame, 7... Mounting foot, 8a, 8b... Input/output conductor, 9a, 9b...
Connection conductor, 10a, 10b... Support, 11a, 1
1b... Connection conductor.

Claims (1)

[Scope of utility model registration request] In a semiconductor converter device configured by combining a plurality of stacks each consisting of a semiconductor element, a cooling fin, etc., a support is provided which serves as an input/output conductor to the stack and also provides mounting support for the stack, and the stack is attached to the support and the stack is mounted. 1. A semiconductor conversion device comprising an input/output terminal of the support column electrically connected to the input/output terminal of the support.