JPS63118236U - - Google Patents
Info
- Publication number
- JPS63118236U JPS63118236U JP815587U JP815587U JPS63118236U JP S63118236 U JPS63118236 U JP S63118236U JP 815587 U JP815587 U JP 815587U JP 815587 U JP815587 U JP 815587U JP S63118236 U JPS63118236 U JP S63118236U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- outer end
- leads
- lead frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP815587U JPS63118236U (hu) | 1987-01-23 | 1987-01-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP815587U JPS63118236U (hu) | 1987-01-23 | 1987-01-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63118236U true JPS63118236U (hu) | 1988-07-30 |
Family
ID=30792273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP815587U Pending JPS63118236U (hu) | 1987-01-23 | 1987-01-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63118236U (hu) |
-
1987
- 1987-01-23 JP JP815587U patent/JPS63118236U/ja active Pending