JPS63117075A - Electrically conductive paste composition - Google Patents

Abstract

PURPOSE:To provide the title compsn. which has excellent low-temperature dryness, solderability and adhesion and can form a coating film in a short time, containing an ether compd., a heat-resistant thermoplastic resin soluble in said other compd. and an electrically conductive filler. CONSTITUTION:300-3,500pts.wt. ether compd. (A) having a b.p. of lower than 180 deg.C (e.g., tetrahydrofuran, diethylene glycol dimethyl ether) is blended with 100pts.wt. thermoplastic resin (B) which is soluble in component A, such as an arom. polyamide (a) of formula I [wherein R1, R2, R3 and R4 are each R5, a lower alkoxy or halogen; X is O, S, SO2 or a group of formula II, III, IV or V (wherein R5 and R6 are each H or a lower alkyl); Ar is not less than 70mol% of m-phenylene, not more than 30mol% of p-phenylene, diphenylene ether etc.], an arom. polyether amide imide (b) of formula VI or a polyimide (a) composed of a repeating unit of formula VII (wherein X<-> is a bivalent residue obtd. by removing NH2 groups of an arom. diamine; Y is a tetravalent group obtd. by removing COOH groups of an aliph. or alicyclic tetracarboxylic acid) and 300-3,500pts.wt. electrically conductive filler (C) such as highly electrically conductive metallic powder (e.g., Ag, Cu, Ni, etc.).

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a conductive paste composition using a heat-resistant thermoplastic resin.

(Prior Art) Recently, in electronic devices, various attempts have been made to simplify the process and downsize the devices by soldering them together using conductive paste. For example, in tantalum solid electrolytic capacitors, attempts have been made to incorporate a conductive paste into a circuit by applying a conductive paste to a carbon layer and soldering the applied layer to the carbon layer.

There are two types of tantalum solid electrolytic capacitors: dip type capacitors and chip type capacitors. FIG. 1 shows a schematic diagram showing the structure of a dip dip mental solid electrolytic capacitor, and FIG. 2 shows a schematic diagram showing the structure of a chip-type tantalum solid electrolytic capacitor.

A tantalum solid electrolytic capacitor is as follows. In other words, there is a pellet formed by integrally molding mental metal powder with a tantalum wire that becomes the anode lead wire 1, and then sintering it at high temperature (1650 to 2000°C) in a high vacuum.
The anode pellet 2 thus formed is oxidized in an electrolyte solution such as phosphoric acid to form a dielectric film 3. The tantalum wire is electrically welded to a non-magnetic anode metal terminal. Furthermore, after immersing this pellet in a manganese nitrate solution or the like, the pellet is thermally decomposed in an air bath furnace at 200 to 400°C to form a manganese dioxide semiconductor 4 on the dielectric film 3. This process of creating a manganese dioxide semiconductor is usually repeated several times.

Next, conductive carbon is further deposited on the semiconductor 4.

The above manganese dioxide semiconductor is coated with a suspension solution, etc. The carbon layer 5 is formed by releasing and drying.

Further, a conductive layer 6 is formed by applying a conductive silver paste onto the carbon layer 5 or by forming a layer of the paste on the carbon by dipping and drying and fixing it. A cathode lead wire 7 is fixed to this with solder 8. Such tantalum solid electrolytic capacitors are often used in resin molds. Such a device is the dip type shown in FIG. Furthermore, a chip type device uses metal caps 9 and 10 instead of lead wires.

Conductive pastes are also used in semiconductor devices and the like.

Examples of conductive paste include epoxy resin-based silver paste using epoxy resin as a binder and polyimide resin-based silver paste using thermosetting polyimide as a binder material, but both require a high temperature and long curing process. In order to.

Poor productivity. Also, the binder resin is brittle.

Since the silver content cannot be increased, the electrical connection between the base material layer and the silver powder is poor, the electrical characteristics are impaired, and the soldering properties are also poor.

Attempts have also been made to use silver pastes using thermoplastic resins such as silver, cellulose, or acrylic resins as binders, but they all have low heat resistance and mechanical strength, and the resin sometimes deteriorates during soldering. Because the silver content could not be increased, there were reliability problems such as poor electrical properties.

In response to these, a proposal has been made regarding a conductive paste composition using a heat-resistant thermoplastic resin as a binder material (Japanese Unexamined Patent Publication No. 60-44533).

(Problems to be Solved by the Invention) The conductive paste composition disclosed in JP-A-60-44533 contains high-boiling point organic solvents such as N,N-dimethylacetamide and N-methylpyrrolidone. Because a nitrogen-based polar solvent is used.

Requires high temperature and long drying process. For example, in tantalum solid electrolytic capacitors.

The binder in the carbon layer is attacked by these nitrogen-containing polar solvents, causing poor carbon adhesion and deterioration of the electrical characteristics of the device.

The present invention solves these problems and provides a conductive paste composition that has excellent drying properties at low temperatures and excellent soldering properties.

(Another means to solve the problem) The present invention provides an ether compound with a boiling point of less than 180°C.
3500 parts by weight, 100 parts by weight of a heat-resistant thermoplastic resin soluble in the ether compound, and 300 to 350 parts by weight of a conductive filler.
0 parts by weight of the conductive paste composition.

Examples of the ether compound having a boiling point of less than 180°C used in the present invention include tetrahydrofuran, dioxane, 1,2-dimethoxyethane, diethylene glycol dimethyl ether, and the like. These may be used alone or in combination.

In consideration of boiling point, solubility, and cost, tetrahydrofuran, dioxane, and diethylene glycol dimethyl ether are preferably used.

If the boiling point is 180° C. or higher, the film forming properties at low temperatures, which is the object of the present invention, will be impaired.

In addition, nitrogen-containing polar solvents such as N,N-dimethylacetamide and N-methylpyrrolidone are good solvents for the heat-resistant thermoplastic resin of the present invention, but their polarity is too strong and they cannot be used as a coating base for the conductive paste. Agent 1, for example, attacks the binder of the carbon layer, impairing the reliability of the device.

The heat-resistant thermoplastic resin used in the present invention is one that is soluble in the ether compound. The resin is.

It is preferable that the glass transition point is 150°C or higher.

If the glass transition point is too low, the resin will melt during soldering or be susceptible to thermal changes. It is particularly preferable that the glass transition point is 180°C or higher.

In the present invention, soluble in the ether compound means that the resin completely dissolves at room temperature when 95% by weight of the compound and 5% by weight of the resin are mixed.

The heat-resistant thermoplastic resin used in the present invention includes aromatic polyamide and aromatic polyamide-imide.

There are aromatic polyesterimides, polyimides, aromatic polyesters, aromatic polyethers, etc., and at least one of these is used.

Specific examples of the heat-resistant thermoplastic resin are as follows.

(a) General formula (in formula 9, I Rlt R2+ Rs and R4
represents hydrogen, X is 10, S, C, S (h.

R8 and R6 represent hydrogen or a lower alkyl group.

These may be the same or different.
A first combination in which 0 mole percent or more is m-phenylene group and 30 mole percent or less is p-phenylene group, diphenylene ether group, or diphenylene sulfone group, or
FLzRz+Rs and R4 represent a lower alkyl group, a lower alkoxy group, or a halogen group, and these may be the same or different.

-X- is 10, S, C, 80z-9 R5 and R6 represent hydrogen or a lower alkyl group.

These may be the same or different.<+Ar is 9m-phenylene group, p-phenylene a, diphenylene ether group or diphenylene sulfone group, or IRI e R41R3 and R4 are hydrogen, lower alkyl group , a lower alkoxy group or... rogane vapor, and these may be the same or different <-X- is-
represents C-, where R5 and R6 represent a trifluoromethyl group or a phenyl group, which may be the same or different.

Ar is *m-phenylene group, p-phenylene group.

An aromatic polyether amide resin, which is a type of aromatic polyamide resin, and has a repeating unit represented by a third combination that is a diphenylene ether group or a diphenylene sulfone group.

Here, the above Ar is 7 for the first combination.
It is essential that 0 molar width or more be m-phenylene groups. When the proportion of m-phenylene groups is less than 70 molar width, it tends to become insoluble in the ether compound. Ar is part 9
It is preferable that m-phenylene groups have a molar width of 0 or more, and it is particularly preferable that m-phenylene groups have a molar width of 10,000 molar width or more.

The aromatic polyetheramide resin has the general formula (3) (
However, in formula 9, r Rt t R4* FLs * R4
and X is.

Obtained by reacting an aromatic diamine represented by the general formula (same as in the case of Il) with an aromatic dicarboxylic acid or a derivative thereof by a solution polymerization method, a method disclosed in JP-A-52-23198. .

Examples of the aromatic diamines mentioned above include 1, for example, Z2-bis(4
-(4-aminophenoxy)phenyl]propane, bis(:4-(4-aminophenoxy)phenylcomethane,
2-bisC3,5-dimethyl-4-(4-aminophenoxy)phenyl]propane, 2,2-bis[3-methyl-4-(4-aminophenoxy)phenyl]propane, z2-bis[3, 5-dibromo-4-(4-aminophenoxy)phenylpropa'+ Z2-bis[4-(
4-aminophenoxy)phenyl:] -1,1,1,
3, & 3-hexafluoropropane, etc., and one or more of these may be used.

Examples of aromatic dicarboxylic acids or derivatives thereof include terephthalic acid, isophthalic acid, diphenylene ether dicarboxylic acid '61R+7 phenyl sulfone dicarboxylic acid, and civalides thereof.

However, in the case of the first combination in the proviso in the general formula m, the aromatic dicarboxylic acid or the aromatic dicarboxylic acid is used in an amount of 90 moles, more preferably substantially 100 moles. As other aromatic dicarboxylic acids or derivatives thereof, terephthalic acid, diphenyl ether dicarboxylic acid, diphenylsulfone dicarboxylic acid, or their civalides are used.

In addition, in the synthesis of the aromatic polyetheramide resin, in addition to the above-mentioned aromatic diamines, other aromatic diamines such as 9m-phenylene diamine and p-phenylene diamine, aliphatic diamines such as hexamethylene diamine, etc. Diamines and silicone diamines may be the same or different as long as they do not limit the purpose of the present invention.<+ p is an integer of 1 or more). R is preferably an alkylene group having 1 to 5 carbon atoms, a phenylene group, or an alkyl-substituted phenylene group, and R1 and Rt are preferably an alkyl group having 1 to 5 carbon atoms, a phenyl group, or an alkyl-substituted phenyl group. Specifically.

1' side ζ white CHs CHs CH3CH3 CH3CHs CaHs C6H3 CHs CHs CHs　　　C, Hs　　CH3 Compounds such as

(b) General formula fI[l ・・・・・・・・・(Ill Aromatic polyether amide imide resin having a compound unit.

Derivatives such as Ride etc. 9 For example, Japanese Patent Publication No. 42-15637
Publication No. 49-4077.

Solution polycondensation method shown in Japanese Patent Publication No. 40-8910,
Acid chloride method, direct polycondensation method, melt polycondensation method, etc. Other aromatic diamines such as nylene diamine, p-] dinylene diamine,
Aliphatic diamines such as hexamethylene diamine and silicone diamines similar to those mentioned above may be used to the extent that the objects of the present invention are not limited.

(C) General formula (II [) ...... (III) (However, in formula 9, * Rt and R- are lower alkyl groups, and these may be the same or different. < , R 'z
represents a lower alkyl group or halogen +m*m and m'
represents the number of substituents of + a/1t T%'2 and F(s, respectively, and is an integer of 0 or 1 to 4, and when m e m' and m' are each 2 or more, multiple R1, R
'2 and R'3 may be the same or different.

They may be the same or different, where R4 and RS are hydrogen, a lower alkyl group, or a trifluoromethyl group.

or a phenyl group, even if they are the same.

May be different. ) Aromatic polyamideimide resin having a repeating unit represented by:

This resin has the general formula FB) (where + rn+ m's rnZ R'l + R
An aromatic diamine represented by '2 + R'3 and X' are the same as above) and a derivative such as trimellitic anhydride or its monochloride can be synthesized by a method similar to the above synthesis method.

As the aromatic diamine represented by the above general formula (B), H
, 1,3-bis(3-aminophenoxy)benzene, 1
．． 3-bis(4-aminophenoxy)benzene, 1.4
-bis(4-aminophenoxy)benzene, 4.4'-
(:1,3-phenylenebis(1-methylethylidene)
[bisaniline, 4.4'-[: 1.4-)nyrelenepis(1-methylethylidene)]hisaniline, 3
．． Examples include 3'-(1,3-)nyrelenebis(1-methylethylidene)]bisaniline.

Further, as in (b) above, other aromatic diamines and/or aliphatic diamines and silicone diamines can be used in combination as diamine components within a range that does not impede the object of the present invention.

(al general formula bond) (However, in formula 9, + R'l I R'! HR- and R- represent a lower alkyl group, a lower alkoxy group, or a halogen, which may be the same or different, and X(
V is an aromatic polyamide-imide resin having a repeating unit represented by the general formula (, nVC is the same).

(However, HR'l v R'2 g Rs l R'4
The aromatic diamine represented by (and

Examples of the aromatic diamine represented by the above general formula (C) include 4,4'-diamino-&3:s, s'-tetramethyldiphenylmethane, 4,4'-diamino-3,3,
'5.5'-tetraethyldiphenylmethane, 4.4'
-Diamino-&&'5.5'-butramethyldiphenyl ether.

4.47-Diamitwo 3.3. '5.5'-Tetraethyldiphenyl ether, Su2-[44-diamino-&&
'a5'-tetramethyldiphenyl]propane and the like. Further, as in (b) above, other aromatic diamines, aliphatic diamines, and silicone diamines can be used in combination as the diamine component within a range that does not impede the object of the present invention.

(e) General formula (■) (Vl (However, in formula 9 + Rt * R2+ FL3+ R4
and X is.

General formula (same as engineering, and R7;/ , ,, ;;
Andni-ha.

R1, R2, Rs and R4 are the same groups, X' is the same group as X, and + Rt l R2+ Rs
1 R41RWIRz , R3 and R4 may be the same or different; x and X' may be the same or different; an aromatic polyether ester imide resin having a repeating unit represented by

(However, in formula 9, Rr + Rz * R3 + R
4 and X are the same as above) can be synthesized by the solution polycondensation method disclosed in JP-A-60-49030.

Examples of the aromatic tetracarboxylic dianhydride represented by the general formula (D) include 2,2-bis(p-1 trimellitoxyphenyl)propanihydride, 2,2-his(p-trimellitoxyphenyl), and 2.2-his(p-trimeritoxyphenyl). &5-dimethylphenyl)propanihydride, bis(p-trimellitoxyphenyl)sulfone dianhydride, bis(p-trimellitoxyphenyl)ketone dianhydride, and the like. As the diamine component, other aromatic diamines, aliphatic diamines, and silicone diamines described in (al) can be used in combination to the extent that the object of the present invention is not hindered.

(f) General formula (■l (However, in formula 9, (indicates the valence residue)
A polyimide resin having a repeating unit represented by the formula and soluble in Gier's ether compound is selectively used.

This polyimide can be synthesized by a solution polycondensation method disclosed in JP-A-60-49030 using an aliphatic tetracarbo/acid dianhydride or an alicyclic tetracarboxylic dianhydride and an aromatic diamine.

As the aliphatic tetracarboxylic dianhydride, butanetetracarboxylic dianhydride can be mentioned. As an alicyclic tetracarboxylic dianhydride.

Cyclobutanetetracarboxylic dianhydride, cyclopentenetetracarboxylic dianhydride, 5,5'-thiobis(norbornane-2,3-dicarboxylic anhydride).

S, 5'-methylene dithiobis(norbornane-2,3
-dicarboxylic anhydride), 5,5'-ethylenedithiobis(norbornane-2,3-dicarboxylic anhydride).

5.5'-Propylenedithiobis(norbornanose 3)
-dicarboxylic anhydride), 5,5'-sulfonylbis(
norbornane-Z3-dicarboxylic acid anhydride).

5.5'-methylenedisulfonylbis(norbornane-
2,3-dicarboxylic anhydride), 5,5'-ethylenedisulfonylbisC norbornane-2,3-dicarboxylic anhydride), 5,5'-propylenedisulfonylbis(
norbornane-2,3-dicarboxylic anhydride).

&5,6-dolycarboxy-2-carboxymethylnorbornane 2:3.5:6 dianhydride, sumi-5-tricarboxycyclopentyl acetic anhydride, and the like. Examples of aromatic diamines include diaminodiphenyl ether, diaminodiphenylmethane, diaminodiphenyl sulfone, 2.
2-diaminodiphenylpropane, diaminobenzophenone, 1.3-bis(4-aminophenoxy)benzene, 1.3-bis(3-aminophenoxy)benzene, 1
．． 4-bis(4-aminophenoxy)benzene, 4.4
'-di(4-aminophenoxy)diphenylsulfone.

2.27-bisC4-(4-aminophenoxy)phenyl]propane, 2.2'-bisC4-(4-aminophenoxy)phenyl)-1,1,1,3,&3-hexafluoropropane, etc. There is. In addition, as the diamine component, other aliphatic diamines and silicone diamines described in the above fa) can be used in combination without limiting the purpose of the present invention.

(However, in formula 9 + Rt + R2+ Rs + R4
and Xba.

An aromatic polyester having a repeating unit which is the same as in the case of general formula (I), and +A'r represents a p-phenylene group, 1m-phenylene group, a diphenylene ether group or a diphenylene sulfone group) Resins that are soluble in the ether compound are selectively used.

This aromatic polyester has the general formula fE) (in the formula v R1
+R2+Rs+R4 and
It is synthesized by an interfacial polycondensation method or a method using a phase transfer catalyst as disclosed in Japanese Patent No. 187022 and the like.

Here, the aromatic diol represented by the general formula (E) includes 4,4'-dihydroxy-&, 3's, 5'-
Tetramethyldiphenyl-2,2-propane, 4.4'
-dihydroxy-3,3,'5.5'-tetramethyldiphenylmethane, 4,4-dihydroxy-3,3,5
, 5-tetramethylbenzophenone, etc. Examples of the aromatic dicarboxylic acid cybaride include terephthalic acid dichloride, isophthalic acid dichloride, diphenyl ether dicarboxylic acid dichloride, diphenylsulfone dicarboxylic acid chloride, and the like.

(hl General formula ■ (However, in formula 9 + Rt l R2+ R3HR4+
An aromatic polyether resin having a repeating unit represented by R1+ R2*R'3 g RS+ where X and Ru.

This resin is composed of an aromatic cybaride represented by the general formula tF) (where X is the same as above, and X represents chlorine, bromine, fluorine, etc.) and a general formula (Gl (however, 2 For example, 9 ml of an alkali metal salt of an aromatic diol represented by R'! + R- and X'' are the same as above).
Journal of Polymer Science (J, Polym, Sci.
) Bart A-1 (Part A-1) Volume 5 No. 23
It can be obtained by reaction using the solution polycondensation method shown on page 75 (1967). Here, examples of the aromatic cibaride represented by the above general formula (E) include 4.4-cyclodiphenylsulfone, 4.4-difluorodiphenylsulfone, 4.4-dichlorodiphenylsulfine, 4.
4-difluorodiphenyl sulfine, 4.4-dichlorodiphenyl ketone, 4.4-difluorodiphenyl ketone, etc., and one or more of these are used, especially 4-difluorodiphenyl sulfine.
．． 4-dichlorodiphenylsulfone is preferably used. The aromatic diol represented by the general formula (Fl) is 2, for example, 4°4'-dihydroxydiphenyl-Z2-propane.

4.4'-dihydroxydiphenylmethane, 4.4-dihydroxydiphenylsulfone, 4,4-dihydroxybenzophenone, 4.4-dihydroxydiphenylethane, 4.4'-dihydroxydiphenylcyclohexane, 4.4-dihydroxydiphenyl-22'- butane,
4.4'-dihydroxy-3,3,5,5-tetramethylbiphenyl, 4.4'-dihydroxy-λ3, '5.
5'-tetramethyldiphenyl-Z2-propane, 4.
4'-dihydroxy-λ35.5'-tetramethyldiphenylmethane, 4.4'-dihydroxy-3,&'5.
Examples include 5'-tetramethyldiphenylsulfone, and one or more of these may be used, particularly 4°4'-dihydroxydiphenyl-2,2-7'ropane.

4.4'-dihydroxy-&, s'-tetramethyldiphenyl-2,2-propa/ is preferably used.

As the alkali metal of the alkali metal salt, Na, Ni, etc. are used.

In addition to the resins exemplified above, resins having two or more types of repeating units of the general formulas +1+ to (2) in the molecule can be used.

The heat-resistant thermoplastic resin exemplified above has a reduced viscosity (0
, 2g/d/dimethylformamide solution.

30℃) is 0.2 to 4.0 dl! /g is preferred, and 0.2 to 3.0 dl/H is particularly preferred.

The most dangerous one is 0.2-2d17g.

The conductive filler used in the present invention is *A
Although highly conductive metal powder such as g9 Cu+Nt can be used, Ag powder is particularly preferably used.

Each of the materials described above contains 300 to 3,500 parts by weight of a solvent and 30 parts by weight of a conductive filler to 100 parts by weight of a heat-resistant thermoplastic resin.
It is used by blending it in a range of 0 to 3,500 parts by weight. If the solvent is less than 300 parts by weight, the solid content will be high, making it difficult to maintain a uniform thickness on the coated surface;
If it exceeds 0 parts by weight, the viscosity will be low, making it difficult to disperse the conductive filler. If the amount of the conductive filler is less than 300 parts by weight, the conductivity decreases, and if it exceeds 3,500 parts by weight, coating becomes difficult. The optimum blending ratio of these can be selected depending on the type of heat-resistant thermoplastic resin used, but preferably, 6 parts by weight of the solvent should be mixed with 100 parts by weight of the heat-resistant thermoplastic resin.
00-3400 parts by weight.

400-3400 parts by weight of conductive filler is used.

Further, in order to improve the dispersibility of the conductive filler and the adhesion to the base material, a coupling agent such as a silane type, titanate type, or aluminum chelate type may be added.

(Function) The conductive paste composition of the present invention is useful as a conductive adhesive, an electrode material, etc. for electronic components.

Since the conductive paste of the present invention is formed into a film by simply volatilizing the solvent after being applied to a base material, the film can be formed at a low temperature and in a short time. Furthermore, since the polarity of the solvent is not high, it does not attack the base material, and since the binder material has excellent heat resistance, it is possible to obtain a good element with excellent soldering properties. or.

The binder material is a heat-resistant thermoplastic resin and is heat-resistant.

Since it has excellent mechanical strength, the silver content can be increased. Therefore, the electrical connection between the underlying base material layer and the silver powder is good and the electrical characteristics are not impaired.

(Example) Next, the present invention will be explained with reference to Examples, but the present invention is not limited to these in any way.

Example 1 (1) Synthesis example of a heat-resistant thermoplastic resin having the following repeating unit In a four-loaf flask equipped with a stirrer, a nitrogen inlet tube, a thermometer, and a reflux tube, z2-bis[4-(4 -aminophenoxy)phenyl]propane s, zg (o, oz mol), triethylamine 4.449 (0,044 mol) t
Add 40 mJ of N-methylpyrrolidone and dissolve.

Keep the inside of the system at -10℃.

Isophthaloyl chloride 4.06g (0.02mol)
Add 10 mJ of a cyclohexanone solution containing .

At this time, the temperature within the system is controlled to -10 to -5°C. Since the viscosity of the reaction system becomes high, when the desired viscosity is reached, stirring is stopped, one reaction solution is poured into a large amount of methanol to isolate the polymer, and the polymer is dried at 180° C. under reduced pressure. Reduced viscosity (reduced viscosity: 0.
2g/dr dimethylformamide solution (30°C) was measured and found to be 0.82d//g. Tg is 203℃
Met.

This resin was also soluble in tetrahydrofuran and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin A obtained in (1) is dissolved in 2,500 parts by weight of diethylene glycol dimethyl ether, and 2,900 parts by weight of scaly Ag powder with an average particle size of z9μ is dissolved in this.
Parts by weight were added and kneaded for 2 hours in a mill to prepare a silver paste.

Example 2 (1) 2.2-bis[4-(4- aminophenoxy)phenyl]propane 8.29 (0.02 mol), triethylamine 2.229 (0.022 mol),
Add and dissolve 50 ml of N-methylpyrrolidone. Gold-106CK maintained in the system trimellitic anhydride chloride 4.2
19 (0.02 mol) is added. The temperature inside the system is -10~
Control at -5°C. The viscosity of the reaction system increases, so when the desired viscosity is reached, acetic anhydride 10.09. Pyridine 5
g was added thereto, and stirring was continued at 60°C for one day and night. The reaction solution was poured into a large amount of methanol to isolate the polymer, and the polymer was dried under reduced pressure at 180°C. The reduced viscosity of this polymer (resin 0.29/cR dimethylformamide solution, 30°C) is o, 73 dJ/
It was s.

Tg was 240°C. This resin was also soluble in tetrahydrofuran, dioxa/diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin B obtained in (1) is dissolved in 1500 parts by weight of dioxane, and 120 parts by weight of Ag powder is dissolved in this.
A silver paste was prepared by adding zero weight soybean and kneading it for 2 hours in a mill.

Example 3 (1) Synthesis example of heat-resistant thermoplastic resin C having the following two types of repeating units Z2-bis[4 -(4-aminophenoxy)phenyl]furopane 8.29 (0,02 mol), triethylamine 4.449 (0,044 mol),
Add and dissolve 50 ml of N-methylpyrrolidone. The system was maintained at -10°C, and 103 g of isophthaloyl chloride (
0.01 mol) and trimellitic anhydride chloride λ
Add 11 g (0.01 mol). The temperature inside the system is -10
Control at ~-5°C. The viscosity of the reaction system will increase, so when the desired viscosity is reached, add acetic anhydride, s, og, and pyridine 15G.
was added, and stirring was continued at 60°C for one day and night. Pour the reaction solution into a large amount of methanol to isolate the polymer.

Dry under reduced pressure at 180°C. The reduced viscosity of this polymer (resin 0.29/cR dimethylformamide, 30°C) is 1.
2dl! /s. Tg was 220°C. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin C obtained in (1) is dissolved in 1500 parts by weight of a mixed solvent of tetrahydrofuran/diethylene glycol dimethyl ether = 4/6 (weight ratio), and Ag01200 is dissolved in this. A silver paste was prepared by adding parts by weight, shaking for 10 hours, and performing ultrasonic dispersion for 10 hours.

Example 4 (1) Synthesis example of heat-resistant thermoplastic resin having the following repeating unit In a three-loaf flask equipped with a stirring device, a nitrogen inlet pipe, and two fractional distillation heads, 5.0449 (0,022 mol) of bisphenol A, Add 3.749 ml of 50% aqueous sodium hydroxide solution and 10 ml of toluene, and raise the temperature to 160°C.

The azeotrope of water and toluene is distilled out of the system. Add 6.318 g (0,022 mol) of dichlordiphenyl sulfone and 179 g of dimethyl sulfoxide. After reacting at 160°C for 1 hour, the 9 reaction mixture was poured into a large amount of methanol to isolate the polymer, which was dried under reduced pressure at 180°C. The reduced viscosity of the obtained polymer (resin 0.2 g/di dimethylformamide solution, 30°C) was 0.61 dI! /9. 'rg
was 190°C. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin D obtained in (1) was mixed with 4 parts by weight of dioxane/diethylene glycol and dimethyl ether.
Dissolved in 1700 parts by weight of a mixed solvent of /6 (weight ratio),
1500 parts by weight of Ag powder was added to this, and shaking was performed for 10 hours and ultrasonic dispersion was performed for 10 hours to prepare a silver paste.

Example 5 (1) Heat-resistant thermoplastic resin E having the following repeating unit
Synthesis Example In the synthesis example of heat-resistant thermoplastic resin B of Example 2, Ic 1 was substituted for 8.2 g (0.02 mol) of s2-bisC4-C4-aminophenoxy)phenyl]propy
．． 3-bis(3-aminophenoxy)benzene 5.84
A polymer was obtained in the same manner except that i (0.02 mol) was used. The reduced viscosity of this polymer (resin 0.29/d/dimethylformamide solution, 30°C) is 0.59 dj'/G
Met. 'rg was 192°C. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 8,100 parts by weight of the heat-resistant thermoplastic resin obtained in (1) was dissolved in 1,700 parts of dioxane, and 15 parts of Ag powder was dissolved in it.
Add 00 parts by weight and shake for 10 hours.

A silver paste was prepared by performing ultrasonic dispersion for 10 hours.

Example 6 (1) Heat-resistant thermoplastic resin F having the following repeating unit
Synthesis Example In the synthesis example of heat-resistant thermoplastic resin B of Example 2, 2
．． 2-bis(4-(4-aminophenoxy)phenyl)
4.4 instead of fropan 8.29 (0.02 mol)
A polymer was obtained in the same manner except that 6.29 (0.02 mol) of '-diamino-his, s'-tetra, ethyldiphenylmethane was used. Reduced viscosity of this polymer (resin 0.2 g/dI! dimethylformamide solution, 30°C
) was 0.80cR/9. Tg was 280°C. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 tt parts of the heat-resistant thermoplastic resin F obtained in (1) was dissolved in 1700 parts by weight of a mixed solvent of tetrahydrofuran/diethylene glycol dimethyl ether = 6/4 (weight ratio), and Ag powder was dissolved in this. 1,500 parts by weight was added and kneaded for 2 hours in a mill to prepare a silver paste.

Example 7 (1) Synthesis example of heat-resistant thermoplastic resin G having the following repeating unit 2.2-bis[4 -(4-aminophenoxy)phenyl]propane8.29 (0,0
2 mol) and 50 ml of N-methylpyrrolidone are added and dissolved. 11.529 (0.02 mol) of 2.2-bis(p-trimellitic diphenyl)propanihydride are added at room temperature. The reaction was allowed to proceed at room temperature for 3 hours, and further at 190° C. for 6 hours. The reaction solution was poured into a large amount of methanol to isolate the polymer, which was dried under reduced pressure at 180°C. Reduced viscosity (resin 0.2 g/dI! Dimethylformamide solution, 30°C
) was measured and found to be 0.69cR/9.

Tg was 214°C. This resin was also soluble in tetrahydrofuran and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin G obtained in (1) was dissolved in 1500 parts by weight of diethylene glycol dimethyl ether, 1200 parts by weight of Ag powder was added thereto, and the mixture was shaken. A silver paste was prepared by performing ultrasonic dispersion for 10 hours.

Example 8 (1) Heat-resistant thermoplastic resin H having the following repeating unit
Synthesis Example In the synthesis example of heat-resistant thermoplastic resin G of Example 7, 2
．． 2-bis(4-(4-aminophenoxy)phenyl)
Bis(
:4-(4-aminophenoxy)phenyl]sulfone 8
．． Other than making it 64g (0.02 mol).

Polymers were obtained in a similar manner. Reduced viscosity of this polymer (resin 0.2 g/dl! Dimethylformamide solution.

30°C) was 0.88 dl/9. Tg is 235℃
Met. This resin was also soluble in tetrahydrofuran and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin H obtained in (1) was dissolved in 1700 parts by weight of a mixed solvent of tetrahydrofuran/diethylene glycol dimethyl ether = 6/4 (weight ratio), and Ag 150 parts by weight of powder was added, followed by shaking for 10 hours and ultrasonic dispersion for 10 hours to prepare a silver paste.

Example 9 (1) Synthesis example of a heat-resistant thermoplastic resin having the following repeating unit.
Dihydroxydiphenyl-42-furin IZIg (o,
osmol), 0.39% of tetrabutylammonium chloride was added as a phase transfer catalyst, and 5-hydroxylated) IJ
Add and dissolve 100 g of aqueous solution.

Next, 5.08 g of terephthaloyl chloride (0,0
25 mol) toisophthaloyl chloride 5.089 (
0,025 mol) in methylene chloride solution 100c
Add c into the system with strong stirring. React for an additional hour at room temperature and discard the aqueous phase. After washing with a large amount of water, the reaction solution was poured into a large amount of methanol to isolate the polymer.

Dry under reduced pressure at 180°C.

The reduced viscosity (resin 0.26/dl! Dimethylformamide solution, 30°C) was measured and was 0.95 dl! /9. Tg was 203°C. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 1,100 parts by weight of the heat-resistant thermoplastic resin obtained in (1) was dissolved in 71,700 parts by weight of dioxa, and 150 parts by weight of Ag powder was dissolved in this.
Add 0 parts by weight and shake for 10 hours.

A silver paste was prepared by performing ultrasonic dispersion for 10 hours.

Example 10 (1) Heat-resistant thermoplastic resin J having the following repeating unit
Synthesis example Example 9 Synthesis example of heat-resistant thermoplastic resin material
4.4'-dihydroxydiphenyl-Z2-furan I
22-bis(4-hydroxyphenyl)-hexafluorofuropa instead of 1 g (0.05 mol) of Z:/16.
A polymer was obtained in the same manner except that 8 g (0.05 mol) was used. Reduced viscosity of this polymer (resin 0.29/c
R dimethylformamide solution.

30°C) was 0.77 dl/g. Tg is 190℃
Met. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin J obtained in (1) was dissolved in 1000 parts by weight of diethylene glycol dimethyl ether, 1000 parts by weight of Ag powder was added thereto, and the mixture was shaken for 10 hours. A silver paste was prepared by performing ultrasonic dispersion for 10 hours.

Example 11 (1) Synthesis example of heat-resistant thermoplastic resin having the following repeating unit Following the synthesis example of heat-resistant thermoplastic resin (■) of Example 9,
4.4'-dihydroxydiphenyl-2,2-butane 1
A similar method using 14.2 g (0.05 mol) of 4,4'-dihydroxy-33,'s,s-tetramethyldiphenyl-2,2-propane instead of 419 (0,05 mol). A polymer was obtained. Reduced viscosity of this polymer (0.2 g of a fat/d7 dimethylformamide solution,
30°C) is 1. It was ldr/9. Tg is 230'
It was C. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin K obtained in (1) is dissolved in 1000 parts by weight of dioxane, and 100 parts by weight of Ag powder is dissolved in this.
Add 0 parts by weight, shake for 10 hours, and perform ultrasonic dispersion for 1 hour.
This was carried out for 0 hours to prepare a silver paste.

Example 12 (1) Synthesis example of heat-resistant thermoplastic resin having the following two types of repeating units In the synthesis example of heat-resistant thermoplastic resin I of Example 9, 4
．． 4'-dihydroxydiphenyl-2,2-butane 11
4,4'-dihydroxy-a, 3', 5. instead of L1g (0,05 mol). 7.1 g (0,025 mol) of s'-tetramethyldiphenyl-2,2-propane and 7.65 g (0,025 mol) of 4,4'-dihydroxy-a,3: s,s'-tetramethyldiphenylsulfone.
A polymer was obtained in the same manner except that mol) was used. The reduced viscosity e (m fat 0.2 g/dl! dimethylformamide solution, 30°C) of this polymer was 0.59 d//g.

Tg was 259°C. This resin was also soluble in tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin L obtained in (1) is dissolved in 1000 parts by weight of a mixed solvent of tetrahydrofuran/diethylene glycol dimethyl ether = 6/4 (weight ratio), and Ag 1000 parts by weight of powder was added, and shaking was performed for 10 hours and ultrasonic dispersion was performed for 10 hours to prepare a silver paste.

Example 13 (1) Heat-resistant thermoplastic resin M having the following repeating unit
Synthesis Example In the synthesis example of the heat-resistant thermoplastic resin of Example 4, 4°4'-dihydroxy-3,3:5. A polymer was obtained in the same manner except that 6.248 g of s'-tetramethylphenyl-muc-propane was used. The reduced viscosity of this polymer (m fat 0.2
g/dt! Dimethylformamide solution.

(30°C) was 0.66 di/gte. Tg
&1217°C. This resin was also soluble in tetrahydro7rane, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin M obtained in (1) was dissolved in 1,700 parts by weight of diethylene glycol dimethyl ether, 1,500 parts by weight of Ag powder was added thereto, and the mixture was shaken for 10 hours. Ultrasonic dispersion was performed for 10 hours to prepare a silver paste.

Example 14 (1) Heat-resistant thermoplastic resin N having the following repeating unit
For example, 8.2 g (0.02 mol) of z2-bis(4-(4-aminophenoxy)phenyl)propane was converted into
10.36 g of 3-hexafluoropropane containing 1,3,
0.02 mol) K, isophthaloyl chloride 4.06
g (0.02 mol) of isophthaloyl chloride Z03
g (0.01 mol) and terephthaloyl chloride Z03
A polymer was obtained in the same manner except that a mixture of 0.01 g (0.01 mol) was used. Reduced viscosity of this polymer (resin 0.2 g/d
i dimethylformamide solution, 30°C) is 1.0 dl
! /g. Tg was 240°C. Moreover, this resin was soluble in tetrahydrofuran and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin N obtained in (1) was dissolved in 1,700 parts by weight of diethylene glycol dimethyl ether, 1,500 parts by weight of Ag powder was added thereto, and the mixture was shaken for 10 hours. A silver paste was prepared by performing ultrasonic dispersion for 10 hours.

Example 15 (1) Heat-resistant thermoplastic resin O having the following repeating unit
Synthesis Example In the synthesis example of heat-resistant thermoplastic resin G of Example 7, 2
．． Instead of 8.2 g (0.02, mol) of 2-bis(:4-(4-aminophenoxy)phenyl)propane,
2.2-bis[:4-(4-aminophenoxy)phenyl] -1,1,1,, a & 10.36 g (0.02 mol) of 3-hexafluoropropane was converted into λ2-bis(
p-trimeroxyphenyl)propanihydride 1
Polymer was produced in the same manner except that 7.88 g (0.02 mol) of 5.5'-sulfonylbis(norbornane-2,3-dicarboxylic anhydride) was used instead of 1.52 g (0.02 mol). I got it. The reduced viscosity of this polymer is 0.71d
It was J/g. Tgi was 11310°C. This resin was also soluble in tetrahydrofuran and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin obtained in (1) was dissolved in 1500 parts by weight of diethylene glycol dimethyl ether, 1200 parts by weight of Ag powder was added thereto, and the mixture was shaken for 10 minutes. After 10 hours of ultrasonic dispersion, a silver paste was prepared.

Comparative Example 1 (1) Heat-resistant thermoplastic resin P having the following repeating unit
Synthesis Example Synthesis was performed in the same manner as in Example 1, except that terephthaloyl chloride was used in place of yn7-lyroyl chloride. The reduced viscosity is o, soa//g (0.2g/
dl N-methylpyrrolidone solution, 30°C).

Tg was 247°C. Furthermore, this resin was insoluble in tetrahydrofuran, dioxane, and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin P obtained in (1) was mixed with N-
Dissolve in 1500 parts by weight of methylpyrrolidone.

Add 1,200 parts by weight of KAg powder to this powder and boil it in the machine for 2 hours.
A silver paste was prepared by kneading for hours.

Comparative Example 2 (1) Synthesis example of heat-resistant thermoplastic resin Q having the following repeating unit In the synthesis example of heat-resistant thermoplastic resin A of Example 1, 4.06 g (0.02 mol) of isophthaloyl chloride Instead, terephthaloyl chloride Z03g (0,0
1 mol) and 2.03 g of isophthaloyl chloride (0,
A polymer was obtained in the same manner except that a mixture of 0.01 mol) was used. The reduced viscosity of this polymer (resin 0.2 g/di dimethylformamide solution, 30°C) is 0.80 d//gf
There were four. Tg was 230°C. Moreover, this resin was insoluble in any of tetrahydrofuran, dioxane and diethylene glycol dimethyl ether.

(2) Preparation of conductive paste composition 100 parts by weight of the heat-resistant thermoplastic resin Q obtained in (1) was added to N-
It was dissolved in 2,500 parts by weight of a mixed solution of methyl-2-pyrrolidone/butyl cellosolve acetate = 4/6 (weight ratio), 2,900 parts by weight of Ag powder was added thereto, and the mixture was kneaded in a mill for 2 hours to form a silver paste. Created.

The conductive paste compositions obtained in Examples and Comparative Examples were removed to a depth of 50 μm from the coating of the cured product, and the results are shown in Table 1.

In addition, a chip-type tantalum solid electrolytic capacitor without an electrode layer was immersed in the above silver paste (K).

After pulling it up, it was dried while rotating once to form a film 1'. The drying temperature was 70 DEG C. - 30 molecules. After drying, spraying was carried out at 130 DEG C. for 30 minutes in the Examples and 160 DEG C. for 130 minutes in the Comparative Examples, and the thickness of the coating layer was 50 .mu.m.

Next, this was immersed in a melted solder (temperature 260°C) containing 2% Ag and having a eutectic point of 183°C for 10 seconds to form a solder layer. The test was conducted. These results are shown in Table 2.

Table 1 Drying time 8 *Time required for drying at 130°C until the residual solvent becomes 1 tfL-1 vs. cured product Table 2 Solderability and adhesiveness (effects of the invention) The conductive paste composition according to the present invention has the following properties: It has good soldering properties, and since a low boiling point solvent is used, a film can be formed at low temperatures and in a short time, and has excellent adhesive properties.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the structure of a D-type tantalum solid electrolytic capacitor, and FIG. 2 is a schematic diagram showing the structure of a chimp-type tantalum solid electrolytic capacitor. Explanation of symbols 1... Anode lead wire 2... Anode pellet 3.
...Dielectric film 4...Manganese dioxide semiconductor 5...Carbon 6...Conductive layer 7...Anode lead wire 8...Nonda agent Patent attorney Kunihiko Wakabayashi, '/' No. 1 Figure ■ z Figure

Claims (1)

[Claims] 1. Ether compound with a boiling point of less than 180°C 300-350°C
0 parts by weight, 100 parts by weight of a heat-resistant thermoplastic resin soluble in the ether compound, and 300 to 3,500 parts by weight of a conductive filler. 2. The conductive paste composition according to claim 1, wherein the heat-resistant thermoplastic resin is a thermoplastic resin having a glass transition point of 150° C. or higher. 3. Claim 1, wherein the heat-resistant thermoplastic resin is at least one resin selected from the group consisting of aromatic polyamide, aromatic polyamideimide, aromatic polyesterimide, polyimide, aromatic polyester, and aromatic polyether. The conductive paste composition according to item 1 or 2. 4. Aromatic polyamide has the general formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼……(I) (However, in the formula, R_1, R_2, R_3 and R_4
represents hydrogen,
There are tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼
or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, where R_5 and R_6 represent hydrogen or lower alkyl groups, which may be the same or different, and Ar is 70 mol% or more of m -phenylene group, and a combination in which 30 mol% or less is a p-phenylene group, diphenylene ether group, or diphenylene sulfone group, or R
_1, R_2, R_3 and R_4 are lower alkyl groups,
Represents a lower alkoxy group or halogen, which may be the same or different, and -X- represents -O-, -S-, ▲
There are mathematical formulas, chemical formulas, tables, etc. ▼, -SO_2-, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ or ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ In, R_5 and R_6 represent hydrogen or a lower alkyl group, which may be the same or different, and Ar is a m-phenylene group, p-phenylene group, diphenylene ether group or diphenylene sulfone group. combination or R_1, R_2, R_3 and R
_4 represents hydrogen, a lower alkyl group, a lower alkoxy group, or a halogen, and these may be the same or different, -X- represents ▲There are mathematical formulas, chemical formulas, tables, etc.▼, where R_5 and R_6 are It represents a trifluoromethyl group or a phenyl group, which may be the same or different, and Ar represents a m-phenylene group, a p-phenylene group,
Claim 3 is an aromatic polyetheramide resin having a repeating unit represented by a combination of diphenylene ether group or diphenylene sulfone group.
The conductive paste composition described in 1. 5. Aromatic polyamideimide has the general formula (II) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ...... (II) (However, in the formula, R_1, R_2, R_3 and R_4
represents hydrogen, a lower alkyl group, a lower alkoxy group, or a halogen, and these may be the same or different.
-SO_2-, ▲There are mathematical formulas, chemical formulas, tables, etc.▼▲There are mathematical formulas, chemical formulas, tables, etc.▼ or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, where R_5 and R_6
represents hydrogen, a lower alkyl group, a trifluoromethyl group, or a phenyl group, which may be the same or different. The conductive paste composition according to item 3. 6. Aromatic polyamideimide has the general formula (III) ▲There are mathematical formulas, chemical formulas, tables, etc.▼……(III) (However, in the formula, R'_1 and R'_3 are lower alkyl groups, and these are May be the same or different, R'
_2 represents a lower alkyl group or a halogen, m, m' and m'' respectively represent the number of substituents of R'_1, R'_2 and R'_3, and are 0 or an integer of 1 to 4, and m, m ′
and m″ are each 2 or more, a plurality of R′_
1, R'_2 and R'_3 may be the same or different, and -X'- represents -O- or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, and the two X' may be the same or different. R'_4 and R'_5 represent hydrogen, a lower alkyl group, a trifluoromethyl group, or a phenyl group, and these may be the same or different). 4. The conductive paste composition according to claim 3, which is an aromatic polyamide-imide resin having the repeating unit shown below. 7. Aromatic polyamideimide has the general formula (IV) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ...... (IV) (However, in the formula, R″_1, R″_2, R″_3 and R″_4 are Indicates a lower alkyl group, lower alkoxy group or halogen, which may be the same or different,
X is -O-, -S-, -▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ -, -SO_2, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ or ▲ Mathematical formulas ,
There are chemical formulas, tables, etc. ▼, where R'_5 and R_6 represent hydrogen, a lower alkyl group, a trifluoromethyl group, or a phenyl group. The conductive paste composition according to claim 3. 8. Aromatic polyesterimide has the general formula (V) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ...... (V) (However, in the formula, R_1, R_2, R_3 and R_4
represents hydrogen, a lower alkyl group, a lower alkoxy group, or a halogen;
There are tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼
or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, where R_5 and R_6 each independently represent hydrogen, a lower alkyl group, a trifluoromethyl group, or a phenyl group, and R'''_1, R_2, R_3 and R_4 is R_1,
R_2, R_3 and R_4 are the same groups, X'' is the same group as X, and R_1, R_2, R_3, R_
4, R′″_1, R′″_2, R′″_3 and R′″
_4 may be the same or different, and X and X'' may be the same or different. Conductive paste composition. 9. Polyimide has the general formula (VI) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ...... (VI) (However, in the formula, A resin selected from polyimides having a repeating unit represented by (representing a divalent residue, Y represents a tetravalent residue excluding a carboxyl group of an aliphatic or alicyclic tetracarboxylic acid) The conductive paste composition according to scope 3. 10. Aromatic polyester has the general formula (VII) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ...... (VII) (However, in the formula, R_1, R_2, R_3 and R_4
represents hydrogen, a lower alkyl group, a lower alkoxy group, or a halogen, and these may be the same or different.
-SO_2-, ▲There are mathematical formulas, chemical formulas, tables, etc.▼, ▲
There are mathematical formulas, chemical formulas, tables, etc. ▼ or ▲ mathematical formulas, chemical formulas,
There is a table etc. ▼, where R_5 and R_
6 represents hydrogen, a lower alkyl group, a trifluoromethyl group, or a phenyl group, which may be the same or different; A'r represents a p-phenylene group, a m-phenylene group,
4. The conductive paste composition according to claim 3, wherein the conductive paste composition is a resin selected from aromatic polyester resins having a repeating unit represented by a diphenylene ether group or a diphenylene sulfone group. 11. Aromatic polyether has the general formula (VIII) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ...... (VIII) (However, in the formula, R_1, R_2, R_3 and R_4
represents hydrogen, a lower alkyl group, a lower alkoxy group, or a halogen; , ▲There are mathematical formulas, chemical formulas, tables, etc.▼ or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, where,
R_5 and R_6 represent hydrogen, a lower alkyl group, a trifluoromethyl group, or a phenyl group, and these may be the same or different, R″_1, R″_2, R″3 and R″_4, R_1, R_2, R_3 and R_4 are the same groups, X'' is the same group as X, and R_1
, R_2, R_3, R_4, R_1, R_2, R_3 and R_4 may be the same or different, and X and
The conductive paste composition according to claim 3, which is a resin selected from aromatic polyether resins having a repeating unit represented by "" may be the same or different. 12, a boiling point of 180 13. The conductive paste composition according to claim 1, wherein the ether compound is tetrahydrofuran, dioxane, or diethylene glycol dimethyl ether alone or in a mixture. 13. Claim 1, wherein the conductive filler is Ag. The conductive paste composition described.