JPS63116487A - Semiconductor laser device - Google Patents

Semiconductor laser device

Info

Publication number
JPS63116487A
JPS63116487A JP26316386A JP26316386A JPS63116487A JP S63116487 A JPS63116487 A JP S63116487A JP 26316386 A JP26316386 A JP 26316386A JP 26316386 A JP26316386 A JP 26316386A JP S63116487 A JPS63116487 A JP S63116487A
Authority
JP
Japan
Prior art keywords
chip
semiconductor laser
monitor
light
receiving surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26316386A
Other languages
Japanese (ja)
Inventor
Shigeki Horiuchi
堀内 茂樹
Toshio Sogo
十河 敏雄
Saburo Takamiya
高宮 三郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP26316386A priority Critical patent/JPS63116487A/en
Publication of JPS63116487A publication Critical patent/JPS63116487A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a sufficient monitor current of a laser device by a method wherein a concave reflecting plate is provided as to condense monitor light emitted from a semiconductor laser chip onto the light receiving surface of a photo diode chip. CONSTITUTION:A photo diode chip 2 receives monitor light and converts it into a monitor current proportional to the intensity of radiation. The monitor current thereof is led out to be amplified, fed back to the driving current of the semiconductor laser chip 1, and can control the output beam from the semiconductor laser chip 1. A concave reflecting plate 10 reflects and condenses efficiently the monitor beam, and guides to the light receiving surface of the photo diode chip 2. Because the concave reflecting plate to condense to the light receiving surface of the chip 2 is provided, a sufficient monitor current can be obtained with the chip mount structure having superior mass productivity.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、光情報処理、光通化等の光源として用いら
れろ光出力をモニタずろホトダイオードを備えた半導体
レーザ装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor laser device equipped with a photodiode that monitors optical output and is used as a light source for optical information processing, optical communication, etc.

〔従来0〕技術〕 第2図は従来より市販されているこの種の半導体レーザ
装置の断1f17図であり、この図において、1ば半導
体し・−ザチ・・ノブ、2はこの半導体レーデチップ1
の光出力をモニタずろためのホトダイオードデツプであ
る。3はv11記ホトダイオードチップ2および半導体
レーザチップ1がダイボンドされた金属ブロック4が固
着されろステムベースである。5はキャップ、6は前記
キャップ5の天面に形成された光出力取出窓、7は前記
ステムベース3と電気的に接続された溶接リード、8(
よ前記ステムベース3と絶縁された封着リードである。
[Conventional 0] Technology] Fig. 2 is a cross-sectional view 1F17 of this type of semiconductor laser device that has been conventionally commercially available. 1
This is a photodiode depth for monitoring the light output of the device. 3 is a stem base to which a metal block 4 to which the photodiode chip 2 and semiconductor laser chip 1 described in v11 are die-bonded is fixed. 5 is a cap, 6 is a light output extraction window formed on the top surface of the cap 5, 7 is a welding lead electrically connected to the stem base 3, and 8 (
This is a sealed lead insulated from the stem base 3.

また、半導体1/−ザチップ1より出ている実、腺。Also, fruit and glands coming out from semiconductor 1/-the chip 1.

破線の矢印は、それぞれ゛1′導体レー書アヂップ1か
らの出力光とモニタ光を示している。ホトりf:イ−ト
チツブ2は破線の矢印で示(ツなモニタ光を受けて、光
量に比例したモニタ電流に変換する。このモニタ電流を
取り出し、増幅して半導体し・−すチ・フプ1の駆動電
流にフィードバックして半導体レーザチップ1からの出
力光を制御ずろことができる。
Broken arrows indicate the output light and monitor light from the ``1'' conductor array add-up 1, respectively. Photo chip 2 (indicated by the dashed arrow) receives the monitor light and converts it into a monitor current proportional to the amount of light. This monitor current is taken out, amplified, and converted into a semiconductor. The output light from the semiconductor laser chip 1 can be controlled by feeding back to the drive current of the semiconductor laser chip 1.

第3図は他の従来例を示す半導体レーザ装置の断面図で
、第2図のギヤ・ツブ5に代えて平面反射板9を設けた
ものであり、他は第2図と同(7ものを示している。平
面反射板9ばモニタ光を効率しく反射してホトダイオー
ドデツプ2に導< 、1うに設けられたものであり、第
3図の構成でもホトダイオードチップ2は、破線の矢印
で示したモニタ・光を受けて光景に比例したモニタ電流
に変換することが−Cき、半導体レーザチップ1からの
出力光を制御できる。また、第3図の構成では半導体レ
ーザチップ1とホトダイオードチップ2とが平行な面上
にマウンI・されており、第2図のように互いに垂直な
面にマウントされた構成よりも組立てを一力向、−平面
で行うことができ、量産性の面で慢fじζいる。
FIG. 3 is a sectional view of another conventional semiconductor laser device, in which a plane reflector 9 is provided in place of the gear knob 5 in FIG. 2, and the other parts are the same as in FIG. The planar reflector 9 is provided to efficiently reflect the monitor light and guide it to the photodiode depth 2. Even in the configuration shown in FIG. It is possible to receive the monitor light shown and convert it into a monitor current proportional to the scene, thereby controlling the output light from the semiconductor laser chip 1. In addition, in the configuration shown in FIG. 3, the semiconductor laser chip 1 and the photodiode chip 2 are mounted on parallel surfaces, and assembly can be performed in one direction and on a plane rather than the configuration in which they are mounted on mutually perpendicular surfaces as shown in Fig. 2, which facilitates mass production. I'm so arrogant.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しか()ながら、この第3図の+A¥成の半導体1/−
ザ装置は、第2図の構成の装置に比べて、図からも明ら
かなように半導体し・−ザヂッゾ1.Lリポ)・ダイオ
ードヂ・ツブ2にモニタ光が達するまでの距離が反射系
いV曲反射板9)が入るため速くなって冒、よう。ぞれ
ゆえ、半導体レーザチップ1からのモニタ光は、通常広
い方では30〜40’の半値全角を持つ程度に拡がるた
め、第3図の構成では第2図の構成に比べて、ホトダイ
オードチップ2が受けろモニタ光量が大幅に低下すると
いう問題点があった。
However, the semiconductor 1/- of +A\ in this figure 3
As is clear from the figure, the device is a semiconductor compared to the device having the configuration shown in FIG. 2. The distance it takes for the monitor light to reach L lipo), diode, and tube 2 becomes faster due to the inclusion of the reflective V-curve reflector plate 9). Therefore, since the monitor light from the semiconductor laser chip 1 normally spreads to a full width at half maximum of 30 to 40' in the widest direction, the configuration shown in FIG. However, there was a problem in that the amount of monitor light received by the monitor was significantly reduced.

この発明は、上記のような間;頂点を解消するためにな
されたもので、ホトダイオ−トチツブが十分なモニタ光
量を受けることができる半導体レーザ装置を得ろことを
口約とJる。
This invention was made to eliminate the above-mentioned peak, and aims to provide a semiconductor laser device in which a photodiode chip can receive a sufficient amount of monitoring light.

〔問題点をIW決するための手段〕[Means for IW resolution of issues]

この発明に係る半導体レーザ装置は、半導体17−ザチ
ツプからのモニタ光がホトダイオ−トチツブの受光面に
効率良く集光されるように凹面反射板を設けたものであ
る。
The semiconductor laser device according to the present invention is provided with a concave reflector so that the monitor light from the semiconductor chip 17 is efficiently focused on the light receiving surface of the photodiode chip.

〔作用] この発明においては、凹面反射板を設けたことから半導
体レーザチ・ツブからのモニタ光を効率良くホトダイオ
ードチップの受光面に集光する。
[Function] In this invention, since the concave reflector is provided, the monitor light from the semiconductor laser chip is efficiently focused on the light receiving surface of the photodiode chip.

〔実施例〕〔Example〕

この発明の一実施例を第[図につい゛C説明する。 An embodiment of the present invention will be described with reference to FIG.

この図において、第2図、第3図と同−付写は同じもの
を示し、10はモニタ光を効率良く反射。
In this figure, the same parts as in FIGS. 2 and 3 are shown, and 10 reflects the monitor light efficiently.

集光1)てホトダイオードデツプ2の受光向に導くよう
に設けられた凹面反射板である。
This is a concave reflecting plate provided to condense light 1) and guide it to the receiving direction of the photodiode depth 2.

次に動作に・ついて説明する。Next, the operation will be explained.

第1図において、破線で示した半導体レーザチップの片
面より出射されたモニタ光は、この凹面反射板10に当
たり、ホトダイオードデツプ2のイボ効な受光面にほと
んどか入射ずろことになる。
In FIG. 1, the monitor light emitted from one side of the semiconductor laser chip indicated by the broken line hits this concave reflector 10, and almost all of it is incident on the wart-like light receiving surface of the photodiode depth 2.

そのため、モニタ光量の大半が効率良くボI・ダイオー
ドデツプ2によりモニタ電流に変換される。
Therefore, most of the amount of monitor light is efficiently converted into a monitor current by the voltage diode depth 2.

このモニタ電流は半導体1/−ザチップ1からの出力光
と比例関係にあるため、これを増幅(7て半導体1/−
ザヂップ1の駆動電流にフィードバック17て、半導体
L−−−ザチップ1からの出力光を制御ずろことができ
ろ1.特に、゛ト導体レーザは周囲温度の変化によ−、
て出力光が変動し易く、一定出力を維持するためにも、
このモニタ回路は必要不可欠である。凹面反射板1oの
作用により1・分な量のモニタ電流が確保でき、モニタ
電流の増幅度が低くずむため、半導体レーIア装置ど1
7ての出力制御回路が簡単で、安定度の高いものですむ
ことになろ、。
Since this monitor current is proportional to the output light from semiconductor 1/- the chip 1, it is amplified (7)
It is possible to control and shift the output light from the semiconductor L---the chip 1 by feedback 17 to the drive current of the ZADIP 1.1. In particular, conductor lasers suffer from changes in ambient temperature.
The output light tends to fluctuate, and in order to maintain a constant output,
This monitor circuit is essential. The effect of the concave reflector 1o makes it possible to secure a monitor current of 1.0 cm, and since the amplification of the monitor current is low, the semiconductor
7. All output control circuits should be simple and highly stable.

〔発明の効果〕〔Effect of the invention〕

この発明は以上説明したとおり、市導体レーデチップと
、ホトダイオ−トチツブとを備え、半導体し ヂブップ
からのモニタ光をホトダイオードザ・ツブの受光面に集
光する凹面反射板を設けたので、量産性に簡れたデツプ
マウント構造で1゛分なモニタ電流の1”Jられる半導
体し ザ装置を構成できろ。このため、安価で、周辺回
路構成も筒中な1:業的に有用な半導体レーザ装置が得
られろ効果がある。
As explained above, this invention is equipped with a city conductor radar chip and a photodiode chip, and is equipped with a concave reflector that focuses the monitor light from the semiconductor chip onto the light receiving surface of the photodiode chip, making it easy to mass-produce. It is possible to construct a semiconductor laser device that can handle a monitor current of 1" with a simple depth mount structure. Therefore, it is possible to construct a semiconductor laser device that is inexpensive and has a peripheral circuit configuration that is useful in industry. It's effective.

【図面の簡単な説明】 第[図は乙の発明の半導体レーザ装置の一実施例を示す
側面図、第2図は従来の半導体し・−ザ装置の断面図、
第3図は他の従来例を示す半導体レーザ装置の断面図で
ある。 図において、1は半導体し・−ザヂップ、2は1−トダ
イオード千ソゴ、6は光出力取出窓、10は凹面反射板
である。 なお、各図中の同一符号は同一または相当部分を示1゜ 第2図 1図 第3図
[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 2 is a side view showing an embodiment of the semiconductor laser device of the invention of B, FIG. 2 is a sectional view of a conventional semiconductor laser device,
FIG. 3 is a sectional view of another conventional semiconductor laser device. In the figure, 1 is a semiconductor chip, 2 is a one-dimensional diode, 6 is a light output window, and 10 is a concave reflector. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 半導体レーザチップと、ホトダイオードチップとを備え
、前記半導体レーザチップからのモニタ光を前記ホトダ
イオードチップの受光面に集光する凹面反射板を設けた
ことを特徴とする半導体レーザ装置。
1. A semiconductor laser device comprising a semiconductor laser chip and a photodiode chip, and further comprising a concave reflector that focuses monitor light from the semiconductor laser chip onto a light receiving surface of the photodiode chip.
JP26316386A 1986-11-05 1986-11-05 Semiconductor laser device Pending JPS63116487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26316386A JPS63116487A (en) 1986-11-05 1986-11-05 Semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26316386A JPS63116487A (en) 1986-11-05 1986-11-05 Semiconductor laser device

Publications (1)

Publication Number Publication Date
JPS63116487A true JPS63116487A (en) 1988-05-20

Family

ID=17385654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26316386A Pending JPS63116487A (en) 1986-11-05 1986-11-05 Semiconductor laser device

Country Status (1)

Country Link
JP (1) JPS63116487A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6865197B2 (en) 2002-02-04 2005-03-08 Mitsubishi Denki Kabushiki Kaisha Laser diode module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6865197B2 (en) 2002-02-04 2005-03-08 Mitsubishi Denki Kabushiki Kaisha Laser diode module

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