JPS63116168U - - Google Patents
Info
- Publication number
- JPS63116168U JPS63116168U JP767087U JP767087U JPS63116168U JP S63116168 U JPS63116168 U JP S63116168U JP 767087 U JP767087 U JP 767087U JP 767087 U JP767087 U JP 767087U JP S63116168 U JPS63116168 U JP S63116168U
- Authority
- JP
- Japan
- Prior art keywords
- supplying
- pasty solder
- section
- pasty
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000011837 pasties Nutrition 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP767087U JPS63116168U (US06724976-20040420-M00002.png) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP767087U JPS63116168U (US06724976-20040420-M00002.png) | 1987-01-21 | 1987-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63116168U true JPS63116168U (US06724976-20040420-M00002.png) | 1988-07-27 |
Family
ID=30791340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP767087U Pending JPS63116168U (US06724976-20040420-M00002.png) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63116168U (US06724976-20040420-M00002.png) |
-
1987
- 1987-01-21 JP JP767087U patent/JPS63116168U/ja active Pending
