JPS63114192A - Method of applying jumper wire - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for attaching jumper wires on a printed circuit board.

<Prior art> A typical example in which one side is used as a mounting surface for various electric circuit components, and the other side is a predetermined conductive pattern surface for establishing electrical continuity with the lead wires of those circuit components. On printed circuit boards, it is often necessary to connect certain areas on the surface of a conductive pattern using jumper wires such as flat cables, passing over specific circuit components.

For example, as shown in Figure 3 (A) and (B),
When a light emitting diode array 3 used as a bar graph or the like is arranged on the component mounting surface 2 side of the printed circuit board 1 so as to cross the width of the printed circuit board,
The light emitting diode array 3 may become an obstacle to wiring using a conductive pattern on the back surface of a printed circuit board.

In such a case, the conductive pattern portions 51, 51 in the left and right areas sandwiching the light emitting diode array 3 on the conductive pattern surface on the back side will eventually pass the light emitting diode array 3, which is the obstacle, using the jumper wire 4 such as a flat cable. The connection must be made while passing the cable.

However, in the past, the flat cable or jumper wire 4 could not be installed by passing it over the light emitting diode array 3, so as shown in FIG. Both conductive pattern portions 51, 51 sandwiching the obstacle 3 on the conductive pattern surface 5 side of the substrate 1, each terminal wire 4 of the jumper wire is connected to each other.
1 and 41 were soldered together, resulting in a suspended structure.

<Problems to be Solved by the Invention> As is well known, when using a typical printed circuit board in which one side is a component mounting surface and the other side is a conductive pattern surface, various kinds of components mounted on the component mounting surface side are used. These days, it has become common knowledge that an automatic soldering machine is used to connect a lead wire extending from a circuit component and penetrating the printed circuit board to a corresponding conductive pattern on the other conductive pattern surface.

However, if the jumper wire 4 is required, as is the case here, as long as the conventional method shown in Figure 3 is used,
At least for this jumper wire 4, it is impossible to use an automatic soldering machine.

This is because the jumper wire itself gets in the way of the automatic soldering machine, and in practice, the work of soldering each terminal wire 41 41 of the jumper wire to the corresponding conductive pattern portion 51 , 51 has conventionally been done manually. It became.

However, being forced to do such manual work is not inherently desirable, and not only does it significantly reduce work efficiency, but it also affects product yield.
This was also a factor that led to a decrease in reliability.

The present invention has been made from this point of view, and is not limited to the above-mentioned light emitting diode array. If there is an obstacle and the conductive pattern parts on the left and right sides of the obstacle must be connected to each other with a jumper wire, the terminal wire of the jumper wire must be soldered to the corresponding conductive pattern part. However, along with other circuit components, it is possible to use an automatic soldering machine,
It is an object of the present invention to provide a jumper wire attachment method that can improve work efficiency and reliability.

Means for Solving the Problems> In order to achieve the above object, the present invention provides a jumper wire attachment method having the following configuration.

Connect the conductive pattern portions located on the left and right sides of the obstacle on the conductive pattern surface facing the component mounting surface with a jumper wire so as to cross the obstacle provided on the component mounting surface of the printed circuit board. The method for attaching jumper wires according to the present invention includes: forming one cut on each side of the printed circuit board on the left and right of the obstacle, opening on one side of the printed circuit board and extending inward along the obstacle. After forming a total of one pair of each in advance; Pass a jumper wire above the obstacle, make the terminal wires at both ends of the jumper wire protrude to the conductive pattern surface opposite to the component mounting surface, and connect the corresponding conductive patterns. Thereafter, solder the jumper wire portions that have passed over the obstacle to each of the pair of notches formed in the printed circuit board through the openings. A method for attaching a jumper wire, characterized in that the jumper wire is inserted through the pair of notches, and the jumper wire passes under the obstacle with a printed circuit board sandwiched between the pair of notched portions.

<Operations and Effects> According to the method of the present invention, the work itself of soldering each terminal wire of a jumper wire to a corresponding conductive pattern portion on the conductive pattern surface on the back side of a printed circuit board itself is similar to the usual process for other circuit components. Soldering is the same as processing, with the jumper wire facing the component mounting surface, and passing each terminal wire of the jumper wire through a hole drilled in the printed circuit board from the component mounting surface to the other conductive pattern surface. The process may be such that the protruding end is made to protrude from the back surface and the protruding end is soldered to the corresponding conductive pattern part.

Therefore, together with other circuit components mounted on the component mounting surface of the printed circuit board, the terminal wire of the jumper wire can be desirably soldered to the corresponding conductive pattern portion using an automatic soldering machine.

Therefore, it does not take as much time as manual soldering, and since uniform soldering can be performed, reliability can be improved.

At the end of this soldering, the jumper wire section that passes over the obstacle is connected to the conductive pattern on the back side of the printed circuit board through the notch in the printed circuit board provided on both sides of the obstacle. It can be turned to the side. Therefore, the jumper wire does not get in the way of obstacles, and if the obstacle is a light emitting diode array, for example, it does not interfere with light emission at its upper end surface.

Of course, the present invention is equally effective in reducing the size of the case even in the case where an obstacle does not cause a functional problem even if the upper part is covered.

<Example> FIGS. 1 and 2 show an example of application of the method of the present invention. However, in order to contrast with the conventional example previously explained with reference to FIG. 3, this embodiment is shown as an improvement over the case shown in FIG. The corresponding constructor is shown. Also, the first
The figure shows the final result of applying the method of the present invention, and FIG. 2 shows the intermediate process.

First, as shown in FIG. 2, when the present invention is applied, a light emitting diode array, etc., which is mounted on the component mounting surface 2 of the printed circuit board 1 and which obstructs the wiring on the conductive pattern surface 5 on the back surface, etc. On both sides of the portion where the obstacle 3 is provided, a pair of notches 6, 6 are formed which are open on one side of the printed circuit board and extend inward of the board along the obstacle.

This notch 6.6 is located closer to the corresponding conductive pattern portions 51 and 51 on the conductive pattern surface side of the back side of the printed circuit board, where the connection is to be made with a jumper wire.
and the depth of the cut is such that when the jumper wire 4 to be used is inserted into the cut 6, 6 by twisting from the opening, the width of the jumper wire is just accommodated, as will be described later. It has been done to a certain extent.

Conductive pattern portion 51 to be connected with jumper wire 4
, 51 have through holes 52 , 5 that pass from the component mounting surface 2 of the printed circuit board 1 to the conductive pattern surface 5 where the conductive pattern portion is located at the portion where the jumper wire terminal is soldered.
2 is formed. This has the same meaning as a through hole drilled for the lead wire of a normal circuit component, and the terminal wires 41 and 41 of the jumper wire 4 are passed through from the component mounting surface 2 side to the conductive pattern surface 5 side, and the corresponding hole is opened for the lead wire of a circuit component. Conductive pattern portion 51
, 51.

Using such a cut 6.6, the jumper wire attachment according to the invention is carried out as follows.

First, both terminal wires 41 and 41 of the jumper wire 4 are inserted into the corresponding through holes 52 and 5 from the side of the component mounting surface 2 of the printed circuit board l.
2 and exposes the conductive pattern portions 51, 51 to be soldered on the side of the conductive pattern surface 5.

Therefore, under this condition, as shown in FIG. 2, the jumper wire 4 is pushed to the side of the component mounting surface 2 and passes over the obstacle 3, and is connected to other circuit components (not shown). Similarly, only the terminal wires 41, 41 of the jumper wire do not protrude from the conductive pattern surface 5 of the printed circuit board 1.

Therefore, not only the obstacle 3 but also other circuit components (not shown) can be hung in this state on an automatic soldering machine, thereby making it possible to solder the jumper wire terminals 41 , 41 to the corresponding conductive pattern portions 51 , 51 . .

However, if the soldering is continued in this way, as in the case where the obstacle 3 is a light emitting diode array, for example,
It may be undesirable for the jumper wire 4 to remain covering its top. Depending on the type of obstacle, even if covering the top of the obstacle does not cause any particular functional inconvenience, it may be inconvenient in that it increases the internal dimensions of the obstacle when it is housed in a case or the like.

Therefore, in the present invention, once the soldering is preferably completed using an automatic soldering machine as described above, as shown in FIG.
As shown by arrow F in the figure, connect the part of the jumper wire 4 that straddles above the obstacle 3 to the obstacle 3.
As a result, as shown in FIG. It is made to wrap around the conductive pattern surface 5 side of the printed circuit board 1.

In this way, while making the work simple and reliable,
The conductive pattern portions on both sides of the obstacle can be electrically connected to each other.

In the illustrated case, the jumper wire 4 is shown as a flat cable type, but the present invention is of course not limited to this, and the present invention can also be applied to a single wire type. Although the depth was set to such an extent that the jumper wire 4 to be used could be accommodated over its entire width, this is also not a limiting requirement. There may be cases where it is okay to just protrude a little.

Further, although the ability to use an automatic soldering machine is one of the important effects of the present invention, it is not obligatory to use it. Even if this is not the case, the effect of being able to connect the predetermined conductive pattern portions on both sides of the obstacle without passing over the obstacle is still satisfied.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of the results obtained in an example in which the jumper wire attachment method of the present invention is applied, Fig. 2 is an explanatory diagram of the process leading to Fig. 1, and Fig. 3 is an explanatory diagram of the conventional jumper wire attachment method. This is an explanatory diagram. In the figure, 1 is a printed circuit board, 2 is its component mounting surface, 3 is an obstacle such as a light emitting diode array, 4 is a jumper wire, 41
5 is the terminal line, 5 is the conductive pattern surface, 51 is the conductive pattern portion on the conductive pattern surface, and 6 is the notch.

Claims (1)

[Claims] In order to pass over an obstacle provided on the component mounting surface of the printed circuit board, the conductive pattern portions located on the left and right sides of the obstacle on the conductive pattern surface facing the component mounting surface are mutually connected. A method for attaching jumper wires when connecting with jumper wires;
After forming in advance a pair of notches, one each opening on one side of the printed circuit board and extending inward along the obstacle; passing a jumper wire above the obstacle; The terminal wires at both ends are made to protrude toward the conductive pattern surface opposite to the component mounting surface, and are soldered to the corresponding conductive pattern portions; then, the jumper wire is passed over the obstacle. The jumper wire is inserted from the side through the opening into each of the pair of notches formed and placed on the printed circuit board, and between the pair of notches, the jumper wire is inserted between the printed circuit board and the obstruction. A method for attaching a jumper wire, characterized by: crossing over the lower part;