JPS63114027U - - Google Patents

Info

Publication number
JPS63114027U
JPS63114027U JP1987006113U JP611387U JPS63114027U JP S63114027 U JPS63114027 U JP S63114027U JP 1987006113 U JP1987006113 U JP 1987006113U JP 611387 U JP611387 U JP 611387U JP S63114027 U JPS63114027 U JP S63114027U
Authority
JP
Japan
Prior art keywords
lead frame
brazing material
exposed portion
wettability
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987006113U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987006113U priority Critical patent/JPS63114027U/ja
Publication of JPS63114027U publication Critical patent/JPS63114027U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/387—
    • H10W72/5449—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987006113U 1987-01-20 1987-01-20 Pending JPS63114027U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987006113U JPS63114027U (cg-RX-API-DMAC10.html) 1987-01-20 1987-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987006113U JPS63114027U (cg-RX-API-DMAC10.html) 1987-01-20 1987-01-20

Publications (1)

Publication Number Publication Date
JPS63114027U true JPS63114027U (cg-RX-API-DMAC10.html) 1988-07-22

Family

ID=30788323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987006113U Pending JPS63114027U (cg-RX-API-DMAC10.html) 1987-01-20 1987-01-20

Country Status (1)

Country Link
JP (1) JPS63114027U (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067755A (ja) * 2008-09-10 2010-03-25 Renesas Technology Corp 半導体装置
JP2016058612A (ja) * 2014-09-11 2016-04-21 株式会社デンソー 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067755A (ja) * 2008-09-10 2010-03-25 Renesas Technology Corp 半導体装置
JP2016058612A (ja) * 2014-09-11 2016-04-21 株式会社デンソー 半導体装置

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