JPS63111263U - - Google Patents
Info
- Publication number
- JPS63111263U JPS63111263U JP1987001659U JP165987U JPS63111263U JP S63111263 U JPS63111263 U JP S63111263U JP 1987001659 U JP1987001659 U JP 1987001659U JP 165987 U JP165987 U JP 165987U JP S63111263 U JPS63111263 U JP S63111263U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldered
- soldering iron
- solder
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 24
- 238000005476 soldering Methods 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001659U JPS63111263U (sl) | 1987-01-09 | 1987-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001659U JPS63111263U (sl) | 1987-01-09 | 1987-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63111263U true JPS63111263U (sl) | 1988-07-16 |
Family
ID=30779777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987001659U Pending JPS63111263U (sl) | 1987-01-09 | 1987-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63111263U (sl) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124860A (en) * | 1977-04-08 | 1978-10-31 | Hitachi Ltd | Pincette in use of magnet |
| JPS582548A (ja) * | 1981-06-29 | 1983-01-08 | Toshiba Corp | 空気調和機 |
| JPS582548U (ja) * | 1981-06-26 | 1983-01-08 | 松下電器産業株式会社 | 太陽熱温水器 |
-
1987
- 1987-01-09 JP JP1987001659U patent/JPS63111263U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53124860A (en) * | 1977-04-08 | 1978-10-31 | Hitachi Ltd | Pincette in use of magnet |
| JPS582548U (ja) * | 1981-06-26 | 1983-01-08 | 松下電器産業株式会社 | 太陽熱温水器 |
| JPS582548A (ja) * | 1981-06-29 | 1983-01-08 | Toshiba Corp | 空気調和機 |