JPS63110064U - - Google Patents
Info
- Publication number
- JPS63110064U JPS63110064U JP174787U JP174787U JPS63110064U JP S63110064 U JPS63110064 U JP S63110064U JP 174787 U JP174787 U JP 174787U JP 174787 U JP174787 U JP 174787U JP S63110064 U JPS63110064 U JP S63110064U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- liquid crystal
- circuit board
- printed circuit
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001747U JPH0533023Y2 (is) | 1987-01-08 | 1987-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001747U JPH0533023Y2 (is) | 1987-01-08 | 1987-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63110064U true JPS63110064U (is) | 1988-07-15 |
| JPH0533023Y2 JPH0533023Y2 (is) | 1993-08-23 |
Family
ID=30779944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987001747U Expired - Lifetime JPH0533023Y2 (is) | 1987-01-08 | 1987-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0533023Y2 (is) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006192903A (ja) * | 1998-04-09 | 2006-07-27 | Kuraray Co Ltd | 金属箔積層体の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236892A (ja) * | 1985-08-09 | 1987-02-17 | 住友化学工業株式会社 | 積層板 |
| JPS6236891A (ja) * | 1985-08-09 | 1987-02-17 | 住友化学工業株式会社 | 回路基板 |
-
1987
- 1987-01-08 JP JP1987001747U patent/JPH0533023Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236892A (ja) * | 1985-08-09 | 1987-02-17 | 住友化学工業株式会社 | 積層板 |
| JPS6236891A (ja) * | 1985-08-09 | 1987-02-17 | 住友化学工業株式会社 | 回路基板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006192903A (ja) * | 1998-04-09 | 2006-07-27 | Kuraray Co Ltd | 金属箔積層体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0533023Y2 (is) | 1993-08-23 |
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