JPS63110037U - - Google Patents

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Publication number
JPS63110037U
JPS63110037U JP199487U JP199487U JPS63110037U JP S63110037 U JPS63110037 U JP S63110037U JP 199487 U JP199487 U JP 199487U JP 199487 U JP199487 U JP 199487U JP S63110037 U JPS63110037 U JP S63110037U
Authority
JP
Japan
Prior art keywords
wafer
cassette
support
frame
rotated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP199487U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP199487U priority Critical patent/JPS63110037U/ja
Publication of JPS63110037U publication Critical patent/JPS63110037U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図はこの考案によるウエーハの
位置決め揃え装置の一実施例の正面図及び側面図
、第3図は第1図の支持ローラ部の正面図、第4
図は第3図の支持ローラの側面断面図、第5図及
び第6図は第1図の位置決めローラ手段部の正面
図及び側面図、第7図はカセツトの斜視図、第8
図はウエーハの正面図、第9図及び第10図は従
来のウエーハの位置決め揃え装置の平面図及び正
面図である。 1……半導体ウエーハ、1a……オリエンテー
シヨンフラツト、2……カセツト、2a……収容
溝、10……受台、11……枠体、13……押上
げ体、14……上下動駆動源、15……支持枠、
16,17……支持ローラ、20……レバー、2
2……位置決めローラ手段、23……回動枠、2
4……支持軸、25……位置決めローラ。なお、
図中同一符号は同一又は相当部分を示す。
1 and 2 are front and side views of an embodiment of the wafer positioning and alignment device according to this invention, FIG. 3 is a front view of the support roller section of FIG. 1, and FIG.
5 and 6 are front and side views of the positioning roller means shown in FIG. 1, FIG. 7 is a perspective view of the cassette, and FIG.
This figure is a front view of a wafer, and FIGS. 9 and 10 are a plan view and a front view of a conventional wafer positioning and alignment apparatus. DESCRIPTION OF SYMBOLS 1...Semiconductor wafer, 1a...Orientation flat, 2...Cassette, 2a...Accommodating groove, 10...Scraper, 11...Frame, 13...Pushing body, 14...Vertical movement Drive source, 15... Support frame,
16, 17...Support roller, 20...Lever, 2
2... Positioning roller means, 23... Rotating frame, 2
4...Support shaft, 25...Positioning roller. In addition,
The same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両側壁の内面に対向して立て方向の多数の収容
溝が設けられ、これらの収容溝にそれぞれ半導体
ウエーハを立て姿勢で収容したカセツト、このカ
セツトを所定位置に載せた受台、この受台に対し
上記収容溝1ピツチ宛相対的に水平移動される枠
体、この枠体の下部側に上下動可能に支持され、
上部が円弧面にされ支持溝が設けられており、上
記カセツト内のウエーハの下方にされ、上下動駆
動手段により上昇され、ウエーハ1枚を支持しカ
セツトの上方に押上げる押上げ体、上記枠体の上
部側に固定された支持枠、この支持枠の前面の上
部に回転自在に支持され、上記押上げられたウエ
ーハの外円周を上方から回転自在に受ける上部の
支持ローラ、上記支持枠の前面の下部両側に、そ
れぞれ回動されるレバーの下端に回転自在に支持
されており、常時は双方のレバーの外方への開き
回動により双方の間隔が大きくされ、上記押上げ
られたウエーハが通過上昇できるようにし、ウエ
ーハの通過後は上記双方のレバーの内方への閉じ
回動により、ウエーハを外円周の下部両側から回
転自在に支持する両側一対の支持ローラ、上記支
持枠内の下方に配置され、回動駆動源により常時
は先端部を下方にした位置に回動されており、上
記各支持ローラに上記ウエーハが支持されると、
前方に回動され先端部が上記支持枠の前面下方か
ら突出する可動枠、この可動枠の端部に回転可能
に支持されており、可動枠の前方への回動により
上記ウエーハの下端に接し、回転駆動源により回
転され、ウエーハを回転させてオリエンテーシヨ
ンフラツトが下方に至ると接触が離れ、ウエーハ
をこの姿勢に位置決めする位置決めローラを備え
、上記カセツト内のウエーハを順次1枚宛押上げ
て位置決めして下降し、カセツト内に収納してい
くようにした半導体ウエーハの位置揃え装置。
A large number of storage grooves in the vertical direction are provided facing the inner surfaces of both side walls, and each of these storage grooves accommodates a cassette in which a semiconductor wafer is stored in an upright position, a pedestal on which the cassette is placed in a predetermined position, and a pedestal in which the cassette is placed in a predetermined position. On the other hand, a frame body that is horizontally moved relative to the one pitch of the housing groove, supported vertically movably on the lower side of this frame body,
The upper part has an arcuate surface and a support groove is provided, and the push-up body is placed below the wafers in the cassette and is raised by a vertical drive means to support one wafer and push it upwards into the cassette, and the frame. a support frame fixed to the upper side of the body; an upper support roller rotatably supported at the upper part of the front surface of the support frame to rotatably receive the outer circumference of the pushed-up wafer from above; and the support frame. The levers are rotatably supported at the lower ends of the levers that are rotated on both sides of the front of the lower part of the lever. A pair of support rollers on both sides that allow the wafer to pass and rise, and that rotatably support the wafer from both sides of the lower part of the outer circumference by closing and rotating both of the levers inward after the wafer has passed, and the support frame. The wafer is disposed at the bottom of the roller, and is normally rotated by a rotational drive source to a position with the tip facing downward, and when the wafer is supported by each of the support rollers,
A movable frame that rotates forward and whose tip protrudes from below the front surface of the support frame, is rotatably supported by the end of the movable frame, and as the movable frame rotates forward, it comes into contact with the lower end of the wafer. The wafer is rotated by a rotational drive source, and when the wafer is rotated and the orientation flat reaches the bottom, the contact is separated, and the wafer is equipped with a positioning roller that positions the wafer in this position and pushes the wafers in the cassette one by one. A semiconductor wafer positioning device that raises, positions, lowers, and stores semiconductor wafers in a cassette.
JP199487U 1987-01-09 1987-01-09 Pending JPS63110037U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP199487U JPS63110037U (en) 1987-01-09 1987-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP199487U JPS63110037U (en) 1987-01-09 1987-01-09

Publications (1)

Publication Number Publication Date
JPS63110037U true JPS63110037U (en) 1988-07-15

Family

ID=30780418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP199487U Pending JPS63110037U (en) 1987-01-09 1987-01-09

Country Status (1)

Country Link
JP (1) JPS63110037U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003000472A1 (en) * 2001-06-25 2003-01-03 Takehide Hayashi System for conveying and transferring semiconductor or liquid crystal wafer one by one
WO2003024673A1 (en) * 2001-09-12 2003-03-27 Takehide Hayashi Robot hand with positioning function for semiconductor wafer and liquid crystal glass substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003000472A1 (en) * 2001-06-25 2003-01-03 Takehide Hayashi System for conveying and transferring semiconductor or liquid crystal wafer one by one
WO2003024673A1 (en) * 2001-09-12 2003-03-27 Takehide Hayashi Robot hand with positioning function for semiconductor wafer and liquid crystal glass substrate

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