JPS63109977A - Automatic grinding wheel dimension measuring device for numerically controlled grinder - Google Patents

Automatic grinding wheel dimension measuring device for numerically controlled grinder

Info

Publication number
JPS63109977A
JPS63109977A JP25317186A JP25317186A JPS63109977A JP S63109977 A JPS63109977 A JP S63109977A JP 25317186 A JP25317186 A JP 25317186A JP 25317186 A JP25317186 A JP 25317186A JP S63109977 A JPS63109977 A JP S63109977A
Authority
JP
Japan
Prior art keywords
tool
grinding wheel
grindstone
contact
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25317186A
Other languages
Japanese (ja)
Other versions
JPH0521708B2 (en
Inventor
Yusuke Kosuge
小菅 祐輔
Hitoshi Komori
小森 斉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niigata Engineering Co Ltd
Original Assignee
Niigata Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Niigata Engineering Co Ltd filed Critical Niigata Engineering Co Ltd
Priority to JP25317186A priority Critical patent/JPS63109977A/en
Publication of JPS63109977A publication Critical patent/JPS63109977A/en
Publication of JPH0521708B2 publication Critical patent/JPH0521708B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To rapidly measure the dimension of a grinding wheel even when the range of measuring object dimensions are large by providing a position detecting means which detects the arrival of said grinding wheel at a position at a certain distance apart from a contact member and which switches over the feed speed of said grinding wheel from a high speed to a low speed. CONSTITUTION:When it is necessary to measure the dimension of the grinding wheel 1a of a tool 1 to be measured, a reference tool 12 having a grinding wheel 12a the dimension of which is previously known is installed on the main spindle 2 of a numerically controlled grinder A and the main spindle 2 is rotated, moving the reference tool 12 from a starting point toward a contact member 10 at a rapid feed speed. Then, when the grinding wheel 12a arrives at a position a certain distance apart from the contact member 10, a position detecting means 20 detects this and switches over the feed speed of the reference tool 12 by means of a driving motor 5 to a low speed, and the position of the main spindle 2 when the grinding wheel 12a is brought into contact with the contact member 10, is detected by a detecting means 22. And, by installing the tool 1 to be measured on the spindle 2, the position of the main spindle 2 at the time of the contact of the grinding wheel 1a of the tool 1 to be measured with the contact member 10 is equally detected by the detecting means 22. And, the dimension of the grinding wheel 1a is calculated from those positions of the main spindle 2 by an operating means 8.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、数値制御研削盤において砥石の径や長さ等を
自動的に測定する寸法測定装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a dimension measuring device that automatically measures the diameter, length, etc. of a grinding wheel in a numerically controlled grinding machine.

〔従来の技術〕[Conventional technology]

数値制御研削盤において、工作物の研削や自動トルーイ
ング、あるいは自動ドレッシング等により小さくなった
砥石の径や長さを測定し直す必要がある場合、従来にお
いては、その砥石(工具)を数値制御研削盤の主軸から
取り外して行っていた。しかしこの方法は、測定対象と
なる被測定工具を、数値制御研削盤の主軸かられざわざ
取り外し、研削盤外(ど運んで実測する関係上、時間が
掛かるほか、自動運転を中断する必要があるため、研削
作業の能率が低下するとと乙に、砥石の寸法を頻繁に測
定できないため、研削精度が低下するという問題点があ
る。
In a numerically controlled grinding machine, when it is necessary to remeasure the diameter or length of a grinding wheel that has become smaller due to workpiece grinding, automatic truing, or automatic dressing, conventionally, the grinding wheel (tool) is numerically controlled grinding. It was removed from the main shaft of the board. However, with this method, the tool to be measured must be removed from the main shaft of the numerically controlled grinding machine, transported outside the grinding machine, and then measured, which is time-consuming and requires interruption of automatic operation. Therefore, there is a problem in that the efficiency of the grinding work is reduced and the grinding accuracy is reduced because the dimensions of the grindstone cannot be measured frequently.

このため本発明の発明者らは、砥石を¥fする工具を装
着した主軸を回転させながら起点から基準プレートに向
かって移動させ、基錦プレートに対する砥石の接触を検
出して、その移動距離を計測し、予め寸法が知られた基
孕工具と彼fl+定工具の移動量の差から被測定工具の
寸法を算出する方法を開発した(昭和61年10月7日
特許出願)。
For this reason, the inventors of the present invention moved the grinding wheel from the starting point toward the reference plate while rotating the main shaft equipped with the tool for ¥f, detected the contact of the grinding wheel with the reference plate, and calculated the distance traveled. We have developed a method for calculating the dimensions of a tool to be measured from the difference in the amount of movement between a basic tool whose dimensions are known in advance and a fixed tool (patent application filed on October 7, 1988).

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところが、測定対象寸法が狭い範囲に集中している場合
はよいが、工具が大小様々で寸法が広範囲にわたってい
るような場合、小さい砥石を測定するときに長時間を要
するという問題がある。すなわち、砥石は少なからず偏
心しており、そのため砥石寸法としては、回転軸に対し
て最も離れた砥石外周部が採用される。したがって、こ
れを測定するために、砥石を回転させて測定する必要が
あり、また高精度に測定するためには、1回転当たりの
送り量は必要とされる分解能以下でなければならない。
However, although this is fine when the dimensions to be measured are concentrated in a narrow range, there is a problem in that it takes a long time to measure a small grindstone when the tools are of various sizes and have a wide range of dimensions. That is, the grindstone is eccentric to some extent, and therefore, the grindstone's outer periphery that is farthest from the rotation axis is adopted as the size of the grindstone. Therefore, in order to measure this, it is necessary to rotate the grindstone and measure it, and in order to measure with high precision, the amount of feed per revolution must be less than or equal to the required resolution.

この理由から測定スピードは非常に遅いものとなる。一
方、測定のために、起点から測定基準位置まで移動させ
るとき、最短でも対象寸法の寸法範囲内では測定スピー
ドになっていてどの時点で基準位置に到達しても良いよ
うにしておく必要がある。そして、対象寸法の小さいも
の程、長い距離を低速のスピードで移動しなければなら
ず、多数の測定対象工具がある場合には、総じて測定時
間が非常に長いものとなる。
For this reason, the measurement speed is very slow. On the other hand, when moving from the starting point to the measurement reference position for measurement, it is necessary to maintain the measurement speed at least within the range of the target dimension so that the reference position can be reached at any point. . The smaller the target size, the longer the distance the tool must be moved at a slower speed, and if there are a large number of tools to be measured, the overall measurement time will be very long.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、砥石を有する工具が装着される主軸を備え、
かつ該主軸はX軸、Y軸、およびZ軸の少なくとも一方
向に駆動モータによって動かされるように構成された数
値制御研削盤において、工具の砥石を接触させる接触部
材と、この接触部材に対する砥石の接触を検出する接触
検知手段と、接触部材から一定距離離れた位置に砥石が
到達したことを検出して上記駆動モータによる主軸の送
り速度を遅(する位置検出手段と、接触部材に対して砥
石が接触した際の主軸の位置から砥石の寸法を算出する
演算手段とを具備することにより、上記従来の問題点を
解決したものである。
The present invention includes a main shaft on which a tool having a grindstone is attached,
In a numerically controlled grinding machine, the main shaft is configured to be moved by a drive motor in at least one direction of the X-axis, Y-axis, and Z-axis. contact detection means for detecting contact; position detection means for detecting when the grindstone has arrived at a position a certain distance away from the contact member and slowing down the feed speed of the spindle by the drive motor; The above-mentioned conventional problems are solved by providing calculation means for calculating the dimensions of the grindstone from the position of the main spindle when the wheels come into contact with each other.

〔作用〕[Effect]

被測定工具の寸法を測定する必要が生じた場合には、寸
法が予め知られている砥石を有する基準工具を数値制御
研削盤の主軸に装着して該主軸を回転し、その基準工具
を起点から数値制御研削盤に付設された接触部材に向け
て早い送り速度で主軸により移動させる。基準工具の砥
石が接触部材から一定距離離れた位置に到達すると、位
置検出手段がこれを検出して駆動モータによる基準工具
の送り速度を低速にする。このようにして送り速度が低
下せしめられた基準工具が接触部材に接触すると、接触
信号が生じるので、その接触信号を検出することによっ
て接触部材に対する基準工具の接触位置を知る。
When it becomes necessary to measure the dimensions of a tool to be measured, a reference tool with a grindstone whose dimensions are known in advance is attached to the main shaft of a numerically controlled grinder, the main shaft is rotated, and the reference tool is used as a starting point. From there, the spindle moves at a high feed rate toward a contact member attached to a numerically controlled grinder. When the grindstone of the reference tool reaches a position a certain distance away from the contact member, the position detection means detects this and reduces the feed speed of the reference tool by the drive motor. When the reference tool whose feed speed has been reduced in this manner comes into contact with the contact member, a contact signal is generated, and by detecting the contact signal, the contact position of the reference tool with respect to the contact member is known.

また、主軸に被測定工具を装着して該主軸を回転し、上
記同様にして被測定工具を起点から接触部材に向けて早
い送り速度で移動させ、基準工具の砥石が接触部材から
一定距離離れた位置に到達したことを位置検出手段によ
り検出して送り速度を低速にし、接触部材に被測定工具
の砥石を接触させてその時の主軸の位置を知る。上記基
準工具と、被測定工具の、接触部材に対する接触位置を
演算して被測定工具の寸法を測定する。
In addition, the tool to be measured is attached to the main shaft, the main shaft is rotated, and the tool to be measured is moved from the starting point toward the contact member at a high feed rate in the same manner as described above, so that the grindstone of the reference tool is moved a certain distance from the contact member. The position detection means detects that the tool has reached the desired position, reduces the feed speed, and brings the grindstone of the tool to be measured into contact with the contact member to determine the position of the main shaft at that time. The dimensions of the tool to be measured are measured by calculating the contact positions of the reference tool and the tool to be measured with respect to the contact member.

被測定工具を測定毎に接触部材の新しい部分に接触させ
て何回か寸法を測定し、接触部材に被測定工具の未接触
部分かなくなったら、新しい接触部材に付は換える。
The dimension is measured several times by bringing the tool to be measured into contact with a new portion of the contact member for each measurement, and when there is no uncontacted portion of the tool to be measured on the contact member, the contact member is replaced with a new contact member.

〔実施例〕〔Example〕

以下本発明を図面に基づいて説明する。 The present invention will be explained below based on the drawings.

第1図ないし第3図は、砥石の径を測定する場合の本発
明の自動砥石寸法測定装置の一例を示すもので、図中A
は自動工具交換装置(図示せず)を有する数値制御研削
盤(以下、NG研削盤と称する)である。このNC研削
盤Aは、いわゆる、グラインディングセンターと同様の
基本構造を有するしのであり、砥石1aを有する工具[
が図示しない工具マガジンから取り出されて主軸2に装
着されるとともに、NO制御装置3により、X軸、Y軸
、Z軸の各駆動モータ4,5.6がそれぞれ制御される
ようになっている。
Figures 1 to 3 show an example of an automatic grindstone size measuring device of the present invention for measuring the diameter of a grindstone.
is a numerically controlled grinding machine (hereinafter referred to as NG grinding machine) having an automatic tool changer (not shown). This NC grinding machine A has the same basic structure as a so-called grinding center, and has a grinding wheel 1a [
is taken out from a tool magazine (not shown) and mounted on the main shaft 2, and the NO control device 3 controls the drive motors 4, 5.6 for the X, Y, and Z axes, respectively. .

本発明の自動砥石寸法測定装置は、このNC@削盤Aに
付設されるもので、主軸2によりY軸方向に移動せしめ
られる上記工具lの砥石1aが測定のための定点より一
定距tlli離れた位置に到達したことを検出する位置
検出手段20と、砥石1aが定点である基準プレート(
接触部材)10に接触したことを検知する接触検知手段
22と、この接触検知手段22で得られた検知信号に基
づき後述の所定の演算を行って工具lの砥石1aの径を
求める演算手段8とから構成されている。
The automatic grindstone dimension measuring device of the present invention is attached to this NC@grinding machine A, in which the grindstone 1a of the tool I, which is moved in the Y-axis direction by the main shaft 2, is spaced a certain distance tlli from a fixed point for measurement. a position detection means 20 for detecting that the grinding wheel 1a has reached a fixed position, and a reference plate (
a contact detection means 22 for detecting contact with the contact member) 10; and a calculation means 8 for calculating the diameter of the grindstone 1a of the tool l by performing a predetermined calculation described later based on the detection signal obtained by the contact detection means 22. It is composed of.

上記位置検出手段20として、本実施例では、接触式の
センサでは回転する砥石によってその接触部が損傷を受
けることから、非接触式のセンサを使用している。具体
的には、光電スイッチであり、第2図において、基準プ
レートlOを挟んで投光器20aと受光器20bとが対
峙して配設されている。また、この光電スイッチ20は
、その検出領域が、スリット20cの形状に見られるよ
うに長形状のものである。これによって砥石1aのZ軸
方向のどの個所の外周部がこの検出領域を遮っても検出
できるものである。また、光電スイッチ20から出力さ
れた信号は、信号処理部21へ入力され、受光量が設定
値以下になったとき、信号処理部21から接点信号が出
力されるものである。
In this embodiment, as the position detecting means 20, a non-contact type sensor is used since the contact portion of a contact type sensor is damaged by the rotating grindstone. Specifically, it is a photoelectric switch, and in FIG. 2, a light emitter 20a and a light receiver 20b are disposed facing each other with a reference plate IO in between. Moreover, the detection area of this photoelectric switch 20 is elongated as seen in the shape of the slit 20c. As a result, detection is possible no matter where the outer circumference of the grindstone 1a in the Z-axis direction blocks this detection area. Further, the signal output from the photoelectric switch 20 is input to the signal processing section 21, and when the amount of received light becomes equal to or less than a set value, the signal processing section 21 outputs a contact signal.

また、上記接触検知手段22としては、工具lの砥石1
aが基準プレートIOに接触したときに発生する検知信
号(アコースティック・エミッション信号、以下AE倍
信号いう)を利用している。
Further, as the contact detection means 22, the grindstone 1 of the tool l
A detection signal (acoustic emission signal, hereinafter referred to as AE multiplied signal) generated when a contacts the reference plate IO is used.

すなわち、この接触によって発生したAE倍信号、基準
プレートlOを固定している治具11を経てこの治具1
1に固定されている接触検知手段(AEセンサ)22で
検出される。接触検知手段22で検出された検知信号は
、信号処理部23で接点信号に変換されてNC制御装置
3へ導かれる構成とされている。信号処理部23は第4
図のように、AE倍信号、ローパスフィルタおよびバイ
パスフィルタで特定周波数成分のみ抽出すると同時に増
幅し、検波処理部で処理後、比較器で設定されたしきい
値と比較して検波信号レベルがしきい値以上であれば、
接点をONさせるものである。
That is, the AE multiplied signal generated by this contact passes through the jig 11 that fixes the reference plate lO, and is transmitted to this jig 1.
It is detected by a contact detection means (AE sensor) 22 fixed at 1. The detection signal detected by the contact detection means 22 is converted into a contact signal by the signal processing section 23 and guided to the NC control device 3. The signal processing section 23 is the fourth
As shown in the figure, only specific frequency components are extracted and simultaneously amplified using the AE multiplied signal, a low-pass filter, and a bypass filter. After processing in the detection processing section, the detected signal level is compared with the threshold set by the comparator. If it is above the threshold,
This turns on the contact.

なお、上記AE倍信号、物質が完全に破壊する前に、徐
々に進行するクラック等から発生するもので、−iの弾
性波である。
Note that the above AE multiplied signal is generated from cracks, etc. that gradually progress before the material is completely destroyed, and is an elastic wave of −i.

また、演算手段8は、上記NC制御装置3の内部に設け
られているもので、フィードパルスfを伝送するアンド
ゲート81と、このアンドゲート8aからのフィードパ
ルスfにより上記YIlilffi動モータ5のサーボ
装置を制御するための出カバターンを発生する補間器8
bと、上記位置検出手段20または接触検知手段22か
らのAE倍信号人力により、捕間器8bの内部のカウン
タから工具1の砥石1aが基準プレート10より一定距
離離れた位置に到達したとき、または砥石1aが基準プ
レートlOに接触した時の工具1の位置Y(Y軸上の座
標値)を取り込むとともに、上記アンドゲート8aをO
FF状態として主軸2つまり工具lのY軸方向の移動を
停止させ、また後述の原理に基づき工具lの砥石径を演
算するCPU(中央演算処理装置)8cと、このCPU
8cに接続された記憶装置8dとから成る。この記憶装
置8dには、NC制御装置3および砥石の寸法測定をな
す前記装置の制御を行う制御プログラムが登録されてい
る。なお、第1図において9はNCテープである。
The calculation means 8 is provided inside the NC control device 3, and includes an AND gate 81 that transmits a feed pulse f, and a servo control of the YIlilffi motor 5 by the feed pulse f from the AND gate 8a. Interpolator 8 that generates output turns for controlling the device
b and the AE multiplied signal from the position detection means 20 or the contact detection means 22, when the grindstone 1a of the tool 1 reaches a position a certain distance away from the reference plate 10 from the counter inside the spacer 8b, Alternatively, the position Y (coordinate value on the Y axis) of the tool 1 when the grinding wheel 1a contacts the reference plate IO is taken in, and the AND gate 8a is
A CPU (central processing unit) 8c that stops the movement of the main spindle 2, that is, the tool l, in the Y-axis direction in the FF state, and calculates the grinding wheel diameter of the tool l based on the principle described later;
and a storage device 8d connected to the storage device 8c. A control program for controlling the NC control device 3 and the device that measures the dimensions of the grindstone is registered in the storage device 8d. In addition, in FIG. 1, 9 is an NC tape.

次に、本発明のNC研削盤における自動砥石寸法測定装
置の作用を説明する。
Next, the operation of the automatic grindstone dimension measuring device for the NC grinding machine of the present invention will be explained.

第5図と第6図は、砥石1aの径を測定する場合の、本
発明の詳細な説明するもので、第6図において、主軸2
が起点にあるとき、主軸2と基準プレート10との距離
(以下、基準距離という)をLoとすると、工具1の砥
石1aの径dは、次式%式% ここで、aは被測定工具lの砥石1aの移動距離を示す
。すなわち、起点に有るときの位置をYo、また砥石1
aが基準プレート10に接触したときの主軸2の位置を
Yとすると、 ユ=ly−Yol  ・・・・・・・・・・・・(2)
により求められる。この動作を、第1図ないし第3図を
参照して説明する。
5 and 6 are detailed explanations of the present invention when measuring the diameter of the grinding wheel 1a.
is at the starting point, and the distance between the spindle 2 and the reference plate 10 (hereinafter referred to as reference distance) is Lo, then the diameter d of the grinding wheel 1a of the tool 1 is calculated by the following formula % formula % Here, a is the tool to be measured The moving distance of the grinding wheel 1a of 1 is shown. In other words, the position when it is at the starting point is Yo, and the position of whetstone 1 is
If the position of the main shaft 2 when a contacts the reference plate 10 is Y, then Y = ly - Yol (2)
It is determined by This operation will be explained with reference to FIGS. 1 to 3.

まず、被測定工具1の起点における位置Yoを記憶装置
8d内に記憶させておき、次に、被測定工具lをY軸に
沿って移動させると、被測定工具Iの砥石1aが基準プ
レート10に接触し、そのときの位置YがCPU8cに
取り込まれ、同時に、軸移動を停止する。このCPU8
 cは、これら検出位置Yo、Yから上記被測定工具1
の移動距離aを算出する。
First, the position Yo at the starting point of the tool to be measured 1 is stored in the storage device 8d. Next, when the tool to be measured I is moved along the Y axis, the grinding wheel 1a of the tool to be measured I is moved to the reference plate 10. The position Y at that time is taken into the CPU 8c, and at the same time, the axis movement is stopped. This CPU8
c is the measured tool 1 from these detection positions Yo, Y.
Calculate the moving distance a.

また、(1)式における基準圧ILoは、次式によって
求められる。
Further, the reference pressure ILo in equation (1) is determined by the following equation.

Lo=do/2+ao  +++・−・++++++(
:3)ここで、doは、基準工具12の砥石12aの既
知の径であり、aOは、基準工具12を被測定工具lの
代わりに主軸2に装着し、かつ被測定工具lと同様に移
動させて得られる基準工具I2の移動距離で、移動距離
aと同様にして求められる。
Lo=do/2+ao +++・−・++++++(
:3) Here, do is the known diameter of the grinding wheel 12a of the reference tool 12, and aO is the diameter when the reference tool 12 is mounted on the spindle 2 instead of the tool to be measured l, and in the same way as the tool to be measured l. This is the moving distance of the reference tool I2 obtained by moving it, and is obtained in the same manner as the moving distance a.

このように、径寸法が知られた砥石12aを有する基準
工具12を用いて基準距離Loを予め測定しておき、そ
の後、被測定工具lを主軸2に装着して、工具移動距離
aを求め、(1)式に従って砥石径dを演算する。
In this way, the reference distance Lo is measured in advance using the reference tool 12 having the grindstone 12a with a known diameter, and then the tool to be measured l is mounted on the spindle 2 and the tool movement distance a is determined. , calculate the grindstone diameter d according to equation (1).

上記原理に基づいて前記記憶装置3内の制御プログラム
により、砥石径dの測定をなす際の装置の作動を第7図
のフローチャートに従って説明する。
The operation of the apparatus when measuring the grinding wheel diameter d using the control program in the storage device 3 based on the above principle will be explained with reference to the flowchart shown in FIG.

まず、主軸2を起点位置Yoに戻した状態で、自動工具
交換装置を作動して図示しない工具マガジンから既知の
径d。の砥石122Lを有する基準工具12を取り出し
主軸2に装着するとともに、基準工具12の起点におけ
る位置Y0を演算手段8の記憶装置8dに記憶させてお
く(ステップSt)。
First, with the main spindle 2 returned to the starting position Yo, the automatic tool changer is operated to obtain a known diameter d from a tool magazine (not shown). The reference tool 12 having the grindstone 122L is taken out and mounted on the spindle 2, and the position Y0 at the starting point of the reference tool 12 is stored in the storage device 8d of the calculation means 8 (step St).

次いで、主軸2を回転させる(ステップS2)。そして
主軸2をY軸方向に移動させ、基準工具12を第1図に
おいて下方に早い送り速度で移動させる(ステップS3
)。すると、演算手段8のアンドゲート8aのゲート信
号がON状態となり、フィードパルスfがこのアンドゲ
ート8aを通って補間器8bに入る。補間器8bはこの
フィードパルスfによってY軸駆動モータ5の制御信号
を出力し、Y軸駆動モータ5は作動を続ける。そして、
基準工具12の砥石12aが光電スイッチ20の検出領
域に侵入すると、光電スイッチ20は受光量の減少を検
出し、その信号は信号処理部21で接点信号に変換出力
され(ステップS4)、演算手段8のCPU’8cに入
る。
Next, the main shaft 2 is rotated (step S2). Then, the main spindle 2 is moved in the Y-axis direction, and the reference tool 12 is moved downward in FIG. 1 at a fast feed rate (step S3
). Then, the gate signal of the AND gate 8a of the calculation means 8 becomes ON, and the feed pulse f passes through the AND gate 8a and enters the interpolator 8b. The interpolator 8b outputs a control signal for the Y-axis drive motor 5 based on this feed pulse f, and the Y-axis drive motor 5 continues to operate. and,
When the grindstone 12a of the reference tool 12 enters the detection area of the photoelectric switch 20, the photoelectric switch 20 detects a decrease in the amount of received light, and the signal is converted into a contact signal by the signal processing unit 21 and output (step S4), and the calculation means 8's CPU'8c.

CPU8 cは、この検出信号が入力されると、アンド
ゲート8aのゲート信号をOFF状態にしてフィードパ
ルスfの補間器8bへの入力を止め、Y軸駆動モータ5
を停止させる。その後、再びY軸駆動モータ5が作動し
遅い送り速度で主軸2をY軸方向へ移動させる(ステッ
プS5)。そして基準工具12の砥石12aが基準プレ
ートlOに接触すると、接触検知手段22はAE倍信号
出力し、その信号は信号処理部23で検出され(ステッ
プS6)、演算手段8のCPU8 cに入る。
When this detection signal is input, the CPU 8c turns off the gate signal of the AND gate 8a, stops inputting the feed pulse f to the interpolator 8b, and turns off the Y-axis drive motor 5.
to stop. Thereafter, the Y-axis drive motor 5 operates again to move the main shaft 2 in the Y-axis direction at a slow feed rate (step S5). When the grindstone 12a of the reference tool 12 comes into contact with the reference plate IO, the contact detection means 22 outputs an AE multiplied signal, which is detected by the signal processing section 23 (step S6) and input to the CPU 8c of the calculation means 8.

CPU8 cは、この接触信号が入力されると、補間器
8bの内部のカウンタからフィードパルスfのパルス数
を基準工具12の位置Yとして取り込み、記憶装置8d
内に登録するとともに(ステップS7)、アンドゲート
8aのゲート信号をOFF状態にしてフィードパルスf
の捕間器8bへの入力を止め、Y軸駆動モータ5を停止
させ、また、基準工具12を起点へ復帰させる(ステッ
プS8)。
When this contact signal is input, the CPU 8c takes in the number of pulses of the feed pulse f from the counter inside the interpolator 8b as the position Y of the reference tool 12, and stores it in the storage device 8d.
(step S7), and turns off the gate signal of the AND gate 8a to input the feed pulse f.
The input to the spacer 8b is stopped, the Y-axis drive motor 5 is stopped, and the reference tool 12 is returned to the starting point (step S8).

さらに、CPU8cは、記憶装置8dに登録されている
制御プログラムに基づき移動距離を算定しくステップS
9)、主軸2に挿着されている工具が基準工具であるこ
とを確認するとともに(ステップ5IO)、記憶装置8
d内に登録されている基準工具12の砥石径doと制御
プログラムによって基準圧MLoを算出しくステップ5
ll)、これを記憶装置8dに登録する(ステップ51
2)。 そして、次に自動工具交換装置を作動して主軸
2の基準工具12を被測定工具lと交換し、上記基準工
具12の場合とほぼ同様な手順により、被測定工具1の
砥石径を測定する。すなわち、被測定工具1の起点にお
ける位置Yoを記憶装置8d内に記憶さけておく(ステ
ップSl)。次いで、主軸2を回転させる(ステップS
2)。そして主軸2を作動して上記被測定工具1を回転
させるとともに、第1図において下方に早い送り速度で
移動させる(ステップS3)。このとき、フィードパル
スfはアンドゲート8aを通って補間器8bに入り、補
間器8bからY軸駆動モータ5の制御信号が出力される
。被測定工具1の砥石1aが光電スイッチ20の検出領
域に侵入すると、光電スイッチ20によりその光量の減
少を信号処理部21が検出しCP1J8cに接点信号を
送る(ステップS4)。
Furthermore, the CPU 8c calculates the moving distance based on the control program registered in the storage device 8d.
9), confirm that the tool inserted in the spindle 2 is the reference tool (step 5IO), and
Calculate the standard pressure MLo using the grindstone diameter do of the standard tool 12 registered in d and the control program.Step 5
ll), and register this in the storage device 8d (step 51
2). Then, the automatic tool changer is operated to exchange the reference tool 12 of the spindle 2 with the tool to be measured 1, and the grindstone diameter of the tool to be measured 1 is measured by almost the same procedure as in the case of the reference tool 12 described above. . That is, the position Yo at the starting point of the tool to be measured 1 is stored in the storage device 8d (step Sl). Next, the main shaft 2 is rotated (step S
2). Then, the main shaft 2 is operated to rotate the tool 1 to be measured and move it downward at a high feed rate in FIG. 1 (step S3). At this time, the feed pulse f passes through the AND gate 8a and enters the interpolator 8b, and a control signal for the Y-axis drive motor 5 is output from the interpolator 8b. When the grindstone 1a of the tool to be measured 1 enters the detection area of the photoelectric switch 20, the signal processing section 21 detects a decrease in the amount of light caused by the photoelectric switch 20 and sends a contact signal to the CP1J8c (step S4).

CPU8cは、この検出信号が入力されると、アンドゲ
ート81のゲート信号をOFF状懇にしてフィードパル
スfの補間器8bへの入力を止め、Y軸駆動モータ5を
停止させる。その後、再びY軸駆動モータ5が作動し遅
い送り速度で主軸2をY軸方向へ移動させる(ステップ
S5)。そして基準工具12の砥石が基準プレートIO
に接触すると、接触検知手段22はAE倍信号出力し、
その信号は信号処理部23で検出され(ステップSS)
、演算手段8のCPL78cに入る。CPU8 cは、
この接触信号が入力されると、記憶装置8dの内部のカ
ウンタからフィードパルスfのパルス数を被測定工具1
の位置Yとして取り込み、記憶装置8d内に登録すると
ともに(ステップS7)、アンドゲート8aをOFFに
してフィードパルスfの補間器8bへの入力を止め、Y
軸駆動モータ5を停止させ被測定工具lを起点へ復帰さ
せる(ステップS8)。また、CPU8cは、記憶装置
8d内の制御プログラムによ・り移動距離を算定して主
軸2に挿着されている工具が被測定工具であることを確
認するととらに(ステップS9,5IO)、記憶装置8
d内に記憶されている基準距1flLoと制御プログラ
ムによって被測定工具lの砥石径dを算出しくステップ
513)、その算出値を測定した砥石径dとして記憶装
置8d内に登録して終了する(ステップS 14)。
When this detection signal is input, the CPU 8c turns the gate signal of the AND gate 81 into an OFF state, stops inputting the feed pulse f to the interpolator 8b, and stops the Y-axis drive motor 5. Thereafter, the Y-axis drive motor 5 operates again to move the main shaft 2 in the Y-axis direction at a slow feed rate (step S5). The grindstone of the reference tool 12 is the reference plate IO.
When contacted, the contact detection means 22 outputs an AE multiplied signal,
The signal is detected by the signal processing unit 23 (step SS)
, enters the CPL 78c of the calculation means 8. CPU8c is
When this contact signal is input, the number of pulses of the feed pulse f is counted from the counter inside the storage device 8d to the tool to be measured.
is captured as position Y and registered in the storage device 8d (step S7), and the AND gate 8a is turned OFF to stop inputting the feed pulse f to the interpolator 8b.
The shaft drive motor 5 is stopped and the tool to be measured 1 is returned to the starting point (step S8). Further, the CPU 8c calculates the movement distance using the control program in the storage device 8d and confirms that the tool inserted in the spindle 2 is the tool to be measured (steps S9, 5IO). Storage device 8
The grindstone diameter d of the tool to be measured l is calculated using the reference distance 1flLo stored in d and the control program (step 513), and the calculated value is registered in the storage device 8d as the measured grindstone diameter d, and the process ends (step 513). Step S14).

上記において、砥石の移動が位置検出手段20により検
出されてから、砥石が基準プレートIOに接触するまで
の間の、主軸2の送り速度は、4[IRIIl/min
]、回転数は、4000[rpm]、に設定され、主軸
2の1回転当たりの送り量は、1μmとなっているが、
このように、主軸2を回転させて砥石を基準プレート1
0に接触させるため、砥石が偏心していても、その影響
が完全に取り除かれる。なお、測定時における主軸2の
1回転当たりの送り量は、必要とする精度から導かれる
分解能以下となるように定められる。また、起点から砥
石の移動が位置検出手段20によって検出されるまでの
主軸2の送り速度は、15 [m/min]に設定され
ている。
In the above, the feed rate of the main shaft 2 from when the movement of the grinding wheel is detected by the position detection means 20 until the grinding wheel contacts the reference plate IO is 4 [IRIIl/min].
], the rotation speed is set to 4000 [rpm], and the feed amount per rotation of the spindle 2 is 1 μm,
In this way, by rotating the main shaft 2, the grindstone is placed on the reference plate 1.
Since the grinding wheel is brought into contact with zero, even if the grinding wheel is eccentric, its influence is completely removed. Note that the amount of feed per revolution of the main shaft 2 during measurement is determined to be less than or equal to the resolution derived from the required accuracy. Further, the feed speed of the main spindle 2 from the starting point until the movement of the grindstone is detected by the position detection means 20 is set to 15 [m/min].

対象工具の寸法が、半径にして、30[mm]の範囲に
わたっているとき、4 [++v/min]の送り速度
で基準プレートIOに向けて移動させた場合、最も小さ
い砥石が、基準プレートIOに接する時間T、は、 T  I=  3 0  [mm] ÷ 4  [mm
/minコ ×60=450 [sec] となる。
When the target tool has a radius of 30 [mm] and is moved toward the reference plate IO at a feed rate of 4 [++v/min], the smallest grinding wheel will move toward the reference plate IO. The contact time T is: T I = 3 0 [mm] ÷ 4 [mm
/min×60=450 [sec].

これに対して、位置検出手段20を基準プレートIOの
前方、1mmの位置に設けた本発明の場合であると、起
点から砥石が基準プレートIOにより検出されるまでに
かかる時間taは、t  a  =  2 9  [m
m] +  (15[m/minコ XIO3)X60
=Q  、l  l  6  [secコまた、砥石の
移動が位置検出手段20により検出されてから、砥石が
基準プレートIOに接触するまでの時間tbは、 し b  =  I  [mmi+4  [mm/mi
n]X  6 0  =  1 5  [sec]とな
る。結局、それらの合計時間T、は、Tz=1 5+0
.1 16=1 5.1 1 6  [sec]となり
、測定時間が大幅に減少することになる。
On the other hand, in the case of the present invention in which the position detection means 20 is provided at a position 1 mm in front of the reference plate IO, the time ta required for the grindstone to be detected by the reference plate IO from the starting point is ta = 2 9 [m
m] + (15 [m/min XIO3)X60
= Q , l l 6 [sec] Also, the time tb from when the movement of the grinding wheel is detected by the position detection means 20 until the grinding wheel contacts the reference plate IO is: b = I [mmi+4 [mm/mi
n]X 6 0 = 1 5 [sec]. After all, their total time T, is Tz=1 5+0
.. 1 16 = 1 5.1 1 6 [sec], and the measurement time is significantly reduced.

2回目の測定に際しては、基準プレートIOを、X軸方
向、若しくはI11方向に移動させ、被測定工具の砥石
が基準プレート10の未接触部分に接触するようにする
。さらに測定が繰り返されて基“準プレートlOの測定
面が上記各砥石で研磨され、未接触部分が無くなったと
きは、別の砥石で該測定面自動研磨を行い、再度基準プ
レートlOを使用し得るようにする。
For the second measurement, the reference plate IO is moved in the X-axis direction or the I11 direction so that the grindstone of the tool to be measured comes into contact with the uncontacted portion of the reference plate 10. Further measurements are repeated, and when the measurement surface of the reference plate IO is polished with each of the above grindstones and there are no uncontacted areas, the measurement surface is automatically polished with another grindstone, and the reference plate IO is used again. Try to get it.

なお、上記では、工具をY軸方向に移動させて砥石の径
を測定する場合について説明したが、工具をX軸方向(
第1図で紙面に垂直な方向)に動かして砥石の径を測定
することら、また、工具をZI[11方向(第1図で左
右方向)に移動させて砥石の長さを測定することもでき
る。この場合は、基準プレート10と位置検出手段2o
が、工具の移動方向に配置替えされることは言うまでも
ない。
In addition, although the case where the diameter of the grindstone is measured by moving the tool in the Y-axis direction is explained above, the tool is moved in the X-axis direction (
The diameter of the whetstone can be measured by moving the tool in the direction perpendicular to the paper in Figure 1), and the length of the whetstone can be measured by moving the tool in the ZI direction (direction perpendicular to the paper in Figure 1). You can also do it. In this case, the reference plate 10 and the position detection means 2o
Needless to say, the positions are rearranged in the direction of movement of the tool.

また、実験によれば、砥石が基準プレート10に分解能
程度(1μm)のごくわずかな1だけ接触しても、検出
されるAE倍信号レベルは高く、速い応答速度が得られ
たが、本発明において、接触信号はAE倍信号限定する
ものではない。
Furthermore, according to experiments, even when the grinding wheel contacts the reference plate 10 by a very small amount of 1 at the resolution level (1 μm), the detected AE multiplied signal level is high and a fast response speed is obtained. In this case, the contact signal is not limited to the AE multiplied signal.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は、砥石を有する工具が装
着される主軸を備え、かつ該主軸はX軸、Y軸、および
Z軸の少なくとも一方向に駆動モータによって動かされ
るように構成された数値制御研削盤において、工具の砥
石を接触させる接触部材と、この接触部材に対する砥石
の接触を検出する接触検知手段と、接触部材から一定距
離離れた位置に砥石が到達したことを検出して上記駆動
モータによる主軸の送り速度を遅くする位置検出手段と
、接触部材に対して砥石が接触した際の主軸の位置から
砥石の寸法を算出する演算手段とを具備し、位置検出手
段により砥石の移動を検出して、砥石の送り速度を高速
から低速に切り替えて接触部材に接触させる構成とされ
ているので、測定対象寸法の範囲は広いような場合でも
、砥石の寸法測定を迅速になすことができる。また、N
C研削盤においてNC研削盤の機能を有効に活用して砥
石寸法を測定し得るので、NC研削盤の自動運転を中断
することなく、迅速に測定することができる。従って、
高精度な研削作業を能率よくなすことができる。その上
、面積が広く新しい接触部分を何回分でも自由に取るこ
とができる基準プレートを使用した場合、工具を回転さ
せてその偏心を無くした状態で正確に、かつ何回でも測
定することができる長所がある。
As explained above, the present invention includes a main shaft to which a tool having a grindstone is mounted, and the main shaft is configured to be moved by a drive motor in at least one direction of the X-axis, Y-axis, and Z-axis. In a numerically controlled grinding machine, a contact member that contacts a grindstone of a tool, a contact detection means that detects contact of the grindstone with this contact member, and a contact detection means that detects that the grindstone has arrived at a position a certain distance away from the contact member, and It is equipped with a position detection means that slows down the feed speed of the spindle by the drive motor, and a calculation means that calculates the dimensions of the grindstone from the position of the spindle when the grindstone comes into contact with the contact member, and the position detection means moves the grindstone. The grindstone is configured to detect this, switch the feed speed of the grindstone from high speed to low speed, and bring it into contact with the contact member, so even when the range of dimensions to be measured is wide, it is possible to quickly measure the dimensions of the grindstone. can. Also, N
Since the grindstone dimensions can be measured by effectively utilizing the functions of the NC grinder in the C grinder, measurements can be made quickly without interrupting the automatic operation of the NC grinder. Therefore,
High precision grinding work can be done efficiently. Furthermore, if a reference plate with a large surface area and a new contact area can be freely taken as many times as desired, measurements can be made accurately and many times with the tool rotated to eliminate its eccentricity. It has its advantages.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の装置を実施するための装置の一例を
示す概略図、第2図は第1図のW矢視図、第3図は本装
置のブロック図、第4図は信号処理部の一例を示すブロ
ック図、第5図と第6図は寸法の測定原理を説明するた
めの図、第7図は本発明のフローチャートである。 l・・・被測定工具、1a・・・砥石、2・・・主軸、
8・・・演算手段、IO・・・接触部材(基準プレート
)、12・・・括準工具、12a・・・砥石、20・・
・位置検出手段(光電スイッチ)、22・・・接触検知
手段(AEセンサ)。
FIG. 1 is a schematic diagram showing an example of a device for implementing the device of the present invention, FIG. 2 is a view taken along arrow W in FIG. 1, FIG. 3 is a block diagram of the device, and FIG. 4 is a signal A block diagram showing an example of a processing section, FIGS. 5 and 6 are diagrams for explaining the principle of measuring dimensions, and FIG. 7 is a flowchart of the present invention. l...Tool to be measured, 1a...Wheelstone, 2...Spindle,
8... Calculating means, IO... Contact member (reference plate), 12... Bracket semi-tool, 12a... Grindstone, 20...
- Position detection means (photoelectric switch), 22... Contact detection means (AE sensor).

Claims (1)

【特許請求の範囲】[Claims] 砥石を有する工具が装着される主軸を備え、かつ該主軸
はX軸、Y軸、およびZ軸の少なくとも一方向に駆動モ
ータによって動かされるように構成された数値制御研削
盤において、工具の砥石を接触させる接触部材と、この
接触部材に対する砥石の接触を検出する接触検知手段と
、接触部材から一定距離離れた位置に砥石が到達したこ
とを検出して上記駆動モータによる主軸の送り速度を遅
くする位置検出手段と、接触部材に対して砥石が接触し
た際の主軸の位置から砥石の寸法を算出する演算手段と
を具備したことを特徴とする数値制御研削盤における自
動砥石寸法測定装置。
In a numerically controlled grinding machine comprising a main shaft on which a tool having a grinding wheel is attached, and the main shaft is configured to be moved by a drive motor in at least one direction of the X-axis, Y-axis, and Z-axis, the grinding wheel of the tool is A contact member to be brought into contact, a contact detection means for detecting contact of a grindstone with the contact member, and a detection means for detecting that the grindstone has reached a position a certain distance away from the contact member and slowing down the feed speed of the main shaft by the drive motor. An automatic grindstone dimension measuring device for a numerically controlled grinding machine, comprising: a position detection means; and a calculation means for calculating the dimensions of the grindstone from the position of the spindle when the grindstone contacts the contact member.
JP25317186A 1986-10-24 1986-10-24 Automatic grinding wheel dimension measuring device for numerically controlled grinder Granted JPS63109977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25317186A JPS63109977A (en) 1986-10-24 1986-10-24 Automatic grinding wheel dimension measuring device for numerically controlled grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25317186A JPS63109977A (en) 1986-10-24 1986-10-24 Automatic grinding wheel dimension measuring device for numerically controlled grinder

Publications (2)

Publication Number Publication Date
JPS63109977A true JPS63109977A (en) 1988-05-14
JPH0521708B2 JPH0521708B2 (en) 1993-03-25

Family

ID=17247521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25317186A Granted JPS63109977A (en) 1986-10-24 1986-10-24 Automatic grinding wheel dimension measuring device for numerically controlled grinder

Country Status (1)

Country Link
JP (1) JPS63109977A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004255504A (en) * 2003-02-25 2004-09-16 Koyo Seiko Co Ltd Grinder and its control method
WO2007080699A1 (en) * 2006-01-12 2007-07-19 Tokyo Seimitsu Co., Ltd. Working system, contact detecting method, and ae contact detecting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845845A (en) * 1981-09-11 1983-03-17 Ricoh Co Ltd Controller of grinder
JPS60249573A (en) * 1984-05-23 1985-12-10 Toyoda Mach Works Ltd Grinding wheel diameter measuring device for numerical control grinding machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845845A (en) * 1981-09-11 1983-03-17 Ricoh Co Ltd Controller of grinder
JPS60249573A (en) * 1984-05-23 1985-12-10 Toyoda Mach Works Ltd Grinding wheel diameter measuring device for numerical control grinding machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004255504A (en) * 2003-02-25 2004-09-16 Koyo Seiko Co Ltd Grinder and its control method
WO2007080699A1 (en) * 2006-01-12 2007-07-19 Tokyo Seimitsu Co., Ltd. Working system, contact detecting method, and ae contact detecting device
US7787982B2 (en) 2006-01-12 2010-08-31 Tokyo Seimitsu Co., Ltd. Working system, method for detecting contact, and acoustic emission contact detection device

Also Published As

Publication number Publication date
JPH0521708B2 (en) 1993-03-25

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