JPS63106615U - - Google Patents
Info
- Publication number
- JPS63106615U JPS63106615U JP20341386U JP20341386U JPS63106615U JP S63106615 U JPS63106615 U JP S63106615U JP 20341386 U JP20341386 U JP 20341386U JP 20341386 U JP20341386 U JP 20341386U JP S63106615 U JPS63106615 U JP S63106615U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- detection device
- pressure
- screws
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 3
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20341386U JPS63106615U (es) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20341386U JPS63106615U (es) | 1986-12-26 | 1986-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106615U true JPS63106615U (es) | 1988-07-09 |
Family
ID=31168720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20341386U Pending JPS63106615U (es) | 1986-12-26 | 1986-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106615U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006150831A (ja) * | 2004-11-30 | 2006-06-15 | Towa Corp | 電子部品の樹脂成形用金型装置 |
-
1986
- 1986-12-26 JP JP20341386U patent/JPS63106615U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006150831A (ja) * | 2004-11-30 | 2006-06-15 | Towa Corp | 電子部品の樹脂成形用金型装置 |
| JP4486708B2 (ja) * | 2004-11-30 | 2010-06-23 | Ｔｏｗａ株式会社 | 電子部品用の樹脂成形装置 |