JPS6310537B2 - - Google Patents

Description

[Detailed description of the invention] (Technical field) The present invention relates to a sheet heating element.

(Background Art) Conventionally, as shown in FIG. 3, a heater electrode 2 and a heat-sensitive electrode 3 are formed on the surface of an organic semiconductor 1 made of nylon or the like using a pattern of metal foil, and the heater electrode 2 and the heat-sensitive electrode 3 are connected to each other via a reflective electrode 4 on the back surface. Various planar heating elements A' are provided which perform temperature control by detecting changes in impedance with the heat-sensitive electrode 3 due to temperature.

In this type of planar heating element A', as shown in FIG.
Ra' is connected, and the current flowing from the heater electrode 2 according to the impedance between the heater electrode 2 and the heat-sensitive electrode 3 is detected as a temperature detection voltage Va by this resistor Ra'. Here, organic semiconductor 1
Since the impedance-temperature characteristic of is a negative characteristic as shown in FIG. 5, the temperature detection voltage-temperature characteristic is a positive characteristic as shown in FIG.

By the way, from a safety point of view, the sheet heating element
In order to detect the temperature of A', it is necessary that the organic semiconductor 1 exists over the entire surface thereof, and therefore the impedance between the heater electrode 2 and the heat-sensitive electrode 3 is relatively small.

Therefore, as the temperature of the planar heating element A' rises, the current flowing from the heater electrode 2 increases, and the amount of power consumed by the temperature detection resistor Ra' increases accordingly, causing local abnormal heat generation. It was hot. In particular, when a commercially available resistor component is used as the temperature detection resistor Ra′, the heat dissipation efficiency is poor and it adversely affects the temperature control circuit, etc., and it also increases the cost, complicates the resistor connection work, and increases the installation space, resulting in surface heat generation. This method had drawbacks such as increasing the size of the body A'.

(Object of the Invention) The present invention has been proposed in view of the above points, and its purpose is to improve the heat dissipation effect by patterning a temperature detection resistor together with a heater electrode and a heat-sensitive electrode on the surface of an organic semiconductor. It is an object of the present invention to provide a planar heating element which is high in height, eliminates the need for separate resistance components, reduces costs and eliminates the work of connecting resistors, and also allows the planar heating element to be made thinner and smaller.

(Disclosure of invention) The present invention will be explained below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, and shows the vicinity of an electrode lead-out portion _A1 formed at an end of a planar heating element A. In the figure, 1 is an organic semiconductor made of nylon or the like, and has negative impedance-temperature characteristics as in the conventional case. On almost the entire surface of the organic semiconductor 1, a heater electrode 2 and a heat-sensitive electrode 3 are arranged in parallel with each other by etching a metal foil such as copper.

Between one end of the heater electrode 2 connected to the power source and one end of the heat-sensitive electrode 3, there is a substantially zigzag-shaped temperature detection resistor Ra that is patterned at the same time as forming these electrodes 2 and 3. is connected. Note that although a reflective electrode is provided on the back surface of the organic semiconductor 1, illustration thereof is omitted for convenience.

The connection method of this planar heating element A is substantially the same as the conventional one as shown in Fig. 2, and the temperature detection resistor Ra
Detect the voltage across as the temperature detection voltage Va,
The temperature is controlled by controlling the supply of electricity to the heater electrode 2 by a temperature control circuit (not shown).

(Effects of the Invention) As described above, according to the present invention, a heater electrode and a heat-sensitive electrode are formed on the surface of an organic semiconductor, and changes in the impedance of the organic semiconductor between the heater electrode and the heat-sensitive electrode due to temperature changes are In the planar heating element, in which the temperature detection resistor connected between the electrodes is used to detect and control the energization to the heater electrode, the temperature detection resistor is connected to the surface of the organic semiconductor together with the heater electrode and the heat-sensitive electrode. Since the pattern is formed on the surface of the organic semiconductor, it is expected that the heat dissipation effect through the surface of the organic semiconductor will be more effective than when a commercially available resistor component is used separately as a temperature detection resistor.
This has the effect of preventing localized abnormal heat generation, ensuring accurate operation of temperature control circuits, etc., and increasing safety.

Further, since the temperature detection resistor is formed at the same time as the heater electrode and the heat-sensitive electrode, it has the advantage that the cost required for resistor parts can be reduced and the complicated connection work can be eliminated.

Furthermore, since the temperature detection resistor can be built within the thickness of the planar heating element, the space occupied by the temperature detection resistor can be reduced, making the planar heating element thinner and
There are effects such as miniaturization.

[Brief explanation of the drawing]

FIG. 1 is a plan view of essential parts showing an embodiment of the present invention;
Figure 2 is a configuration diagram of a temperature detection circuit, Figure 3 shows a conventional example, where A is a partial sectional view, B is a partially omitted plan view, and Figure 4 is a conventional temperature detection circuit. The circuit configuration diagram, FIGS. 5 and 6, are characteristic diagrams, respectively. 1...Organic semiconductor, 2...Heater electrode, 3...Thermosensitive electrode, Ra...Temperature detection resistor, A...Planar heating element.

Claims (1)

[Claims] 1 A heater electrode and a heat-sensitive electrode are formed on the surface of an organic semiconductor, and a change in impedance of the organic semiconductor between the heater electrode and the heat-sensitive electrode due to temperature change is detected by a temperature detection resistor connected between each of the electrodes. 1. A planar heating element configured to control energization to the heater electrode, characterized in that the temperature detection resistor is patterned on the surface of the organic semiconductor together with the heater electrode and the heat-sensitive electrode.