JPS63104814A - Resin temperature control device for extruder - Google Patents

Resin temperature control device for extruder

Info

Publication number
JPS63104814A
JPS63104814A JP61252629A JP25262986A JPS63104814A JP S63104814 A JPS63104814 A JP S63104814A JP 61252629 A JP61252629 A JP 61252629A JP 25262986 A JP25262986 A JP 25262986A JP S63104814 A JPS63104814 A JP S63104814A
Authority
JP
Japan
Prior art keywords
temperature
cylinder
resin
resin temperature
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61252629A
Other languages
Japanese (ja)
Inventor
Tetsuya Yoda
余田 哲也
Akihiko Kuroda
昭彦 黒田
Hisao Shintani
新谷 久雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP61252629A priority Critical patent/JPS63104814A/en
Publication of JPS63104814A publication Critical patent/JPS63104814A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/78Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling
    • B29C48/80Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling at the plasticising zone, e.g. by heating cylinders
    • B29C48/83Heating or cooling the cylinders
    • B29C48/832Heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/78Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling
    • B29C48/80Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling at the plasticising zone, e.g. by heating cylinders
    • B29C48/83Heating or cooling the cylinders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/92Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92009Measured parameter
    • B29C2948/92209Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92504Controlled parameter
    • B29C2948/92704Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92819Location or phase of control
    • B29C2948/92857Extrusion unit
    • B29C2948/92876Feeding, melting, plasticising or pumping zones, e.g. the melt itself
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92819Location or phase of control
    • B29C2948/92857Extrusion unit
    • B29C2948/92876Feeding, melting, plasticising or pumping zones, e.g. the melt itself
    • B29C2948/92895Barrel or housing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Control Of Temperature (AREA)

Abstract

PURPOSE:To enhance safety of control by providing cylinder control blocks equipped with a heater and temperature sensing components and a sensing section of temperature of extruded resin, and utilizing the temperature of a cylinder control block selected optionally as the controlled variable of a resin temperature control loop. CONSTITUTION:A cylinder section 1 is divided into a plurality of cylinder control blocks 3a-3e, and said blocks are equipped with block heaters 4a-4e and temperature sensing components 5a-5e respectively, and at an outlet 1a of the cylinder section 1, a resin temperature sensing section 6 sensing directly the temperature of extruded resin is provided. When a control instruction of resin temperature is issued from a keyboard 13, the block heater 4a-4c are ON, and when the resin temperature is confirmed to have risen up to within starting deviation DELTART, a specified resin tempera ture control loop is selected and a given temperature control loop is formed up. The same judges whether the cylinder temperature after forming the control loop is within the range of given upper and lower limit values, and if not, an alarm for the abnormal situation is issued to an indicating section corresponding to said temperature control loop, or if it is within said range, abnormal output is turned OFF and the cycle is completed.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、押出機における樹脂温度制御装置に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a resin temperature control device in an extruder.

(従来の技術) 従来、例えば特開昭49−11952号公報に記載され
ているように、押出機のシリンダ部先端に設けた加熱器
の制御を押出機の運転中と休止中とで異なる温度制御ル
ープを形成する温度制御方法が提案されている。すなわ
ち、この温度制御方法によれば、押出機の運転時には押
出された樹脂の温度値によって温度制御ループを形成し
、押出機の休止中にはシリンダ部先端の検出温度値によ
って温度制御ループを形成している。
(Prior Art) Conventionally, as described in, for example, Japanese Unexamined Patent Application Publication No. 49-11952, a heater provided at the tip of the cylinder of an extruder is controlled at different temperatures when the extruder is in operation and when the extruder is at rest. Temperature control methods have been proposed that form control loops. In other words, according to this temperature control method, when the extruder is operating, a temperature control loop is formed based on the temperature value of the extruded resin, and when the extruder is not operating, a temperature control loop is formed based on the temperature value detected at the tip of the cylinder part. are doing.

(発明が解決しようとする問題点) しかるに、この種の温度制御方法では、シリンダ部は複
数の加熱器が設けられているにも係わらず、シリンダ出
口の先端部の加熱器に対してのみ温度制御ループを形成
するので、押出機価々の構造や特性によってはシリンダ
出口の先端部の加熱器に対するよりも他の加熱器に対す
る温度制御ループを形成した方がより好ましい場合もあ
って、汎用性に欠けるという問題があった。
(Problem to be Solved by the Invention) However, in this type of temperature control method, although the cylinder section is provided with a plurality of heaters, the temperature is controlled only for the heater at the tip of the cylinder outlet. Since a control loop is formed, depending on the structure and characteristics of the extruder, it may be more preferable to form a temperature control loop for other heaters than for the heater at the tip of the cylinder outlet, which increases versatility. There was a problem that there was a lack of

また、樹脂の温度値による温度制御ループが形成されて
いない場合、溶融樹脂が樹脂温度を通過後、一定時間を
経過するまではこの検出部の熱容量の影響を受けて、検
出温度は本来検出されるべき樹脂温度よりも低いため、
押出開始直後はシリ 、ンダ部先端の温度が異常に高く
なり、押出開始直後の製品歩留りが悪くなることがあっ
た。
In addition, if a temperature control loop based on the resin temperature value is not formed, the detected temperature will not be detected until a certain period of time has passed after the molten resin passes through the resin temperature due to the influence of the heat capacity of this detection part. Because the resin temperature is lower than the desired temperature,
Immediately after the start of extrusion, the temperature at the tip of the cylindrical part became abnormally high, which sometimes resulted in poor product yield immediately after the start of extrusion.

さらに、従来の温度制御方法では加熱器に対する温度制
御ループの制御偏差が大きくなったときの対処がなされ
ていないので、シリンダ部の温度が異常に高くなること
があった。
Further, in the conventional temperature control method, no measures are taken when the control deviation of the temperature control loop for the heater becomes large, so that the temperature of the cylinder section sometimes becomes abnormally high.

(問題点を解決するための手段) 本発明に係わる押出機における樹脂温度制御装置は、押
出機のシリンダ部を長さ方向に沿って複数箇所に区分し
て設けられるもので、加熱器と温度検出体を備えたシリ
ンダ制御ブロックと、押出された樹脂の温度を直接検出
する樹脂温度検出部とが設けられ、任意に選択したシリ
ンダ制御ブロックの温度検出体で検出された温度が前記
樹脂温度を制御する樹脂温度制御ループの制御量となさ
れるものである。また、前記樹脂温度制御ループは前記
樹脂温度検出部で検出された樹脂温度が所定の偏差内に
入ってから形成され、さらに前記シリンダ制御ブロック
の温度検出体で検出される温度は所定の上下限閾値と比
較され、比較結果が外部出力される構成である。
(Means for Solving the Problems) The resin temperature control device in the extruder according to the present invention is provided by dividing the cylinder section of the extruder into a plurality of locations along the length direction, and is provided with a heater and a temperature control device. A cylinder control block equipped with a detection body and a resin temperature detection section that directly detects the temperature of the extruded resin are provided, and the temperature detected by the temperature detection body of an arbitrarily selected cylinder control block is the temperature of the resin. This is the control amount of the resin temperature control loop. Further, the resin temperature control loop is formed after the resin temperature detected by the resin temperature detection section falls within a predetermined deviation, and furthermore, the temperature detected by the temperature detection element of the cylinder control block falls within a predetermined upper and lower limit. The configuration is such that it is compared with a threshold value and the comparison result is output to the outside.

(作用) 樹脂温度制御ループは、シリンダ部の出口先端の加熱器
に対するだけでなく任意に選択したシリンダ制御ブロッ
クの加熱器に対して形成し、押出機の構造や特性によっ
て適宜に変更して汎用性を持たせる。また、前記樹脂温
度制御ループは前記樹脂温度検出部で検出された樹脂温
度が所定の偏差内に入ってから形成し、これにより樹脂
温度検出部の熱容量の影響を減少し、さらに前記シリン
ダ制御ブロックの温度検出体で検出される温度が所定の
上下限閾値を越えると警報等による外部出力をなし、制
御の安全性を向上させる。
(Function) The resin temperature control loop is formed not only for the heater at the end of the outlet of the cylinder section but also for the heater of an arbitrarily selected cylinder control block, and can be changed as appropriate depending on the structure and characteristics of the extruder to make it universal. Give it sex. Further, the resin temperature control loop is formed after the resin temperature detected by the resin temperature detection section falls within a predetermined deviation, thereby reducing the influence of the heat capacity of the resin temperature detection section, and furthermore, the cylinder control loop is formed after the resin temperature detected by the resin temperature detection section is within a predetermined deviation. When the temperature detected by the temperature detector exceeds the predetermined upper and lower thresholds, an external output such as an alarm is issued, improving control safety.

(実施例) 以下、本発明の実施例について図面を参照して説明する
(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

第1図は、押出機のシリンダ部1を示す概略図である。FIG. 1 is a schematic diagram showing a cylinder section 1 of an extruder.

このシリンダ部1内には、押出用モータ(図示省略)に
よって回転駆動されるメインスクリュー2が設けられて
いる。シリンダ部1は、長さ方向に沿って複数のシリン
ダ制御ブロック3a〜3eに区分されている。このシリ
ンダM4Ilブロック3a〜3eはそれぞれシリンダ部
lの外壁に沿って配したブロックヒータ4a〜4eと、
例えばシリンダ部l内に嵌入して設けられる温度検出体
5a〜5eを備えている。前記ブロックヒータ4a〜4
eの各々はリレー73及び電源8aに接続され、このリ
レー7aが後述するCPU・メモリボード12の指令に
基づいてデジタル入出力ボード17から出力される制御
信号によって0N10FFデユーテイ制御される。図面
上ではシリンダ制御ブロック3aに対するリレー73及
び電源8aを例示しているが、他のシリンダ制御ブロッ
ク3b〜3eに対してもリレー7b〜7eが設けられて
いる。
A main screw 2 is provided within the cylinder portion 1 and is rotationally driven by an extrusion motor (not shown). The cylinder section 1 is divided into a plurality of cylinder control blocks 3a to 3e along the length direction. The cylinder M4Il blocks 3a to 3e each have block heaters 4a to 4e arranged along the outer wall of the cylinder part l,
For example, it includes temperature sensing bodies 5a to 5e that are fitted into the cylinder portion l. The block heaters 4a to 4
Each of e is connected to a relay 73 and a power supply 8a, and this relay 7a is 0N10FF duty-controlled by a control signal output from a digital input/output board 17 based on a command from a CPU/memory board 12, which will be described later. In the drawing, a relay 73 and a power supply 8a are illustrated for the cylinder control block 3a, but relays 7b to 7e are also provided for the other cylinder control blocks 3b to 3e.

そして、このシリンダ部1へ原料ホッパ(図示省略)か
ら投入されたチップ状の成形材料は、前記ブロックヒー
タ4a〜4eの作動によって所定温度で溶融されて押出
される。また、このシリンダ部1の出口1aには、押出
された樹脂温度YRを直接検出する樹脂温度検出部6が
設けられ、この樹脂温度検出部6で検出される樹脂温度
YIIを予め設定した設定値R(1)になるように制御
されている。
Chip-shaped molding material introduced into the cylinder portion 1 from a raw material hopper (not shown) is melted at a predetermined temperature and extruded by the operation of the block heaters 4a to 4e. Further, a resin temperature detection section 6 that directly detects the extruded resin temperature YR is provided at the outlet 1a of the cylinder section 1, and the resin temperature YII detected by the resin temperature detection section 6 is set to a preset value. It is controlled to be R(1).

第2図は本発明に係わる樹脂温度制御装置のブロック線
図を示している。
FIG. 2 shows a block diagram of a resin temperature control device according to the present invention.

第2図において、設定値R(R)はソフトウェアスイッ
チ10a〜10eの切換によって、PID演算部9a〜
9eに入力され、演算結果によって前記シリンダ制御ブ
ロック33〜3eの各プロックヒータ4a〜4eを制御
対象とするPID演算制御を行う。各シリンダ制御ブロ
ック3a〜3eの温度検出体5a〜5eで検出された温
度YC,〜YcSは加算されて、シリンダプロセス11
を動作させる。そして、このシリンダプロセス11の動
作によって得られるのが樹脂温度Yllである。この樹
脂温度Y、は前記設定値R(11から減算され、樹脂温
度偏差が求められる。このソフトウェアスイッチ10a
〜10eの内1つのソフトウェアスイッチ(図面上では
10bのソフトウェアスイッチ)がCPU・メモリボー
ド12からの切換指定によって端子aから端子す側へ切
換えられ、各温度検出体5a〜5eで検出された温度R
CI〜Rcsを制御量とする樹脂温度制御ループが形成
される。
In FIG. 2, the set value R (R) is changed by switching the software switches 10a to 10e to the PID calculation units 9a to 10e.
9e, and based on the calculation results, PID calculation control is performed to control the block heaters 4a to 4e of the cylinder control blocks 33 to 3e. The temperatures YC and -YcS detected by the temperature detectors 5a to 5e of each cylinder control block 3a to 3e are added and the cylinder process 11
make it work. What is obtained by the operation of this cylinder process 11 is the resin temperature Yll. This resin temperature Y is subtracted from the set value R (11) to obtain the resin temperature deviation.
One of the software switches 10e to 10e (software switch 10b in the drawing) is switched from terminal a to the terminal side according to a switching instruction from the CPU/memory board 12, and the temperature detected by each temperature detector 5a to 5e is R
A resin temperature control loop is formed with CI to Rcs as control variables.

この樹脂温度制御ループが形成されると、このループで
は前記樹脂温度偏差を入力としてPID演算を行い、前
記デジタル入出力ボード17から選択されたブロックヒ
ータ4a〜4eに制御信号を出力する。なお、この樹脂
温度制御ループは前記樹脂温度検出部6で検出された樹
脂温度が所定の開始偏差ΔRT内に入ったときに指定さ
れる。さらに、各シリンダ制御ブロック3a〜3eの温
度検出体5a〜5eで検出された温度値は所定の上下限
閾値と比較され、この上下限閾値の範囲外となったとき
には、前記デジタル入出力ボード17により警報が出力
される。
When this resin temperature control loop is formed, this loop performs PID calculation using the resin temperature deviation as input, and outputs a control signal from the digital input/output board 17 to the selected block heaters 4a to 4e. Note that this resin temperature control loop is designated when the resin temperature detected by the resin temperature detection section 6 falls within a predetermined starting deviation ΔRT. Further, the temperature values detected by the temperature detectors 5a to 5e of each cylinder control block 3a to 3e are compared with predetermined upper and lower thresholds, and when the temperature values are outside the range of the upper and lower thresholds, the digital input/output board 17 An alarm will be output.

第3図は、本発明に係る押出機における樹脂温度制御装
置のハードウェアを各種基本ボードによって構成した場
合を示す。
FIG. 3 shows a case where the hardware of the resin temperature control device in the extruder according to the present invention is constituted by various basic boards.

CPU・メモリボード12は、各種入出力インターフェ
ース回路の制御の中心となるボードで、樹脂温度制御プ
ログラムを内蔵し、CPUの他にCRTコントローラ、
キーコントローラなどのLSIを収納している。このC
PU・メモリボード12は各種のキーを装備したキーボ
ード13及びCRTディスプレイ14の制御をするとと
もにマザーボード15を介して、アナログ信号を入力す
るアナログ入力ボード16とデジタル信号の入出力を行
うデジタル入出力ボード17を制御している。樹脂温度
の設定値と開始偏差ΔRTの値は前記キーボード13に
よって設定入力される。また、前記温度検出体5a〜5
e及び樹脂温度検出部6で検出された温度は前記アナロ
グ入力ボード16から入力される。さらに、このデジタ
ル入出力ボード17からは、前記ブロックヒータ4a〜
4eの0N10FFを制御する制御信号及び温度検出体
5a〜5eで検出された値が所定の上下限閾値の範囲を
越えるときの警報信号が出力される。
The CPU/memory board 12 is a board that plays a central role in controlling various input/output interface circuits, and has a built-in resin temperature control program.
It houses LSIs such as key controllers. This C
The PU/memory board 12 controls a keyboard 13 equipped with various keys and a CRT display 14, as well as an analog input board 16 that inputs analog signals and a digital input/output board that inputs and outputs digital signals via the motherboard 15. It controls 17. The set value of the resin temperature and the value of the starting deviation ΔRT are set and input using the keyboard 13. Further, the temperature detection bodies 5a to 5
e and the temperature detected by the resin temperature detection section 6 are input from the analog input board 16. Furthermore, from this digital input/output board 17, the block heaters 4a to
A control signal for controlling the 0N10FF of 4e and an alarm signal are output when the values detected by the temperature detectors 5a to 5e exceed a predetermined upper and lower threshold range.

第4図は、前記CPU・メモリボード12に内蔵してい
る樹脂温度制御プログラムの制御手順を示す流れ図であ
る。この流れ図は、前記樹脂温度制御ループを1つ形成
する場合を例示している。
FIG. 4 is a flowchart showing the control procedure of the resin temperature control program built into the CPU/memory board 12. This flowchart exemplifies the case where one resin temperature control loop is formed.

ステップ■で前記キーボード13から樹脂温度の制御指
令が操作されると、前記シリンダ制御ブロック3a〜3
eのブロックヒータ4a〜4eはそれぞれONされる。
When the resin temperature control command is operated from the keyboard 13 in step (2), the cylinder control blocks 3a to 3
The block heaters 4a to 4e of e are respectively turned on.

そして、樹脂温度は開始偏差ΔRT内まで上昇したのが
確認されると(ステ・ノブ■)、指定された樹脂温度制
御ループをステップ■で選択し、ステップ■で所定の樹
脂温度制御ループを形成する。ステップ■では制御ルー
プ形成後のシリンダ温度が所定の上下限閾値の範囲内に
存在するかを判断し、存在しなければ当該温度制御ルー
プに対応する表示部分(図示省略)に対して警報を発し
異常を知らせる(ステップ■)。
When it is confirmed that the resin temperature has risen to within the starting deviation ΔRT (step knob ■), the designated resin temperature control loop is selected in step ■, and a predetermined resin temperature control loop is formed in step ■. do. In step (2), it is determined whether the cylinder temperature after the control loop is formed is within the predetermined upper and lower thresholds, and if it is not, an alarm is issued on the display section (not shown) corresponding to the temperature control loop. Notify of abnormality (step ■).

上下限閾値の範囲内に存在すれば異常出力がOFFとな
り終了する(ステップ■)。また、ステップ■で樹脂温
度の制御指令がない場合と、ステップ■で樹脂温度が開
始偏差ΔRT内に入らない場合は、ステップ■で樹脂温
度制御ループを解除して終了する。
If it is within the range of the upper and lower thresholds, the abnormal output is turned off and the process ends (step ■). Furthermore, if there is no resin temperature control command in step (2) and if the resin temperature does not fall within the starting deviation ΔRT in step (2), the resin temperature control loop is canceled and the process ends in step (2).

なお、上述した実施例ではシリンダ制御ブロックの点数
を5点の場合を例示しているが、もちろんこれに限定さ
れるものでな(、また樹脂温度制御ループは1つ形成す
る場合の他に2つ以上同時に形成してもよい。これらの
組合せは前記温度制御プログラムによって任意に行うこ
とができる。
In addition, in the above-mentioned embodiment, the case where the number of cylinder control blocks is five is illustrated, but of course the number is not limited to this. More than one may be formed at the same time.The combination of these may be arbitrarily determined by the temperature control program.

なお、前記上下限閾値は各シリンダ制御ブロック3a〜
3eに対して同じ値を設定してもよいし、また異なる値
を設定してもよい。
Note that the upper and lower thresholds are determined by each cylinder control block 3a to
The same value or different values may be set for 3e.

(発明の効果) 以上述べたように、本発明によれば、樹脂温度制御ルー
プを任意に選択できるので、押出機の構造や特性に汎用
的に対応できる。また、樹脂温度が所定の開始偏差内に
入るまでは樹脂温度制御ループを形成しないので、樹脂
温度検出部の熱容量による検出誤差を減少することがで
きる。さらに、各シリンダ制御ブロック毎に上下限閾値
を設けているので制御の安全性が向上する。
(Effects of the Invention) As described above, according to the present invention, since the resin temperature control loop can be arbitrarily selected, it can be universally adapted to the structure and characteristics of the extruder. Furthermore, since the resin temperature control loop is not formed until the resin temperature falls within a predetermined starting deviation, detection errors due to the heat capacity of the resin temperature detection section can be reduced. Furthermore, since upper and lower thresholds are provided for each cylinder control block, control safety is improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は押出機のシリンダ部を示す概略図、第2図は本
発明に係る樹脂温度制御装置において樹脂温度制御ルー
プを説明するブロック線図、第3図はハードウェアを各
種基本ボードによって構成した場合を示すブロック図、
第4図は樹脂温度制御プログラムの流れを示す流れ図で
ある。 1・・・シリンダ部 3a〜3e・・・シリンダ制御ブロック42〜4e・・
・ブロックヒータ 5a〜5e・・・温度検出体 108〜10e・・・ソフトウェアスイッチ特許出願人
 積水化学工業株式会社 代表者 廣1)馨 第1図 1¥2図 13図
Fig. 1 is a schematic diagram showing the cylinder section of an extruder, Fig. 2 is a block diagram illustrating the resin temperature control loop in the resin temperature control device according to the present invention, and Fig. 3 shows the hardware configured by various basic boards. A block diagram showing the case where
FIG. 4 is a flowchart showing the flow of the resin temperature control program. 1... Cylinder parts 3a to 3e... Cylinder control blocks 42 to 4e...
・Block heaters 5a to 5e...Temperature detectors 108 to 10e...Software switch Patent applicant Representative of Sekisui Chemical Co., Ltd. Hiroshi 1) Kaoru Figure 1 1 ¥ 2 Figure 13

Claims (1)

【特許請求の範囲】 1)押出機のシリンダ部を長さ方向に沿って複数箇所に
区分して設けられるもので、加熱器と温度検出体を備え
たシリンダ制御ブロックと、押出された樹脂の温度を直
接検出する樹脂温度検出部とが設けられ、任意に選択し
たシリンダ制御ブロックの温度検出体で検出された温度
が前記樹脂温度を制御する樹脂温度制御ループの制御量
となされることを特徴とする押出機における樹脂温度制
御装置。 2)前記樹脂温度制御ループは前記樹脂温度検出部で検
出された樹脂温度が所定の偏差内に入ってから形成され
る特許請求の範囲第1項記載の押出機における樹脂温度
制御装置。 3)前記シリンダ制御ブロックの温度検出体で検出され
る温度は所定の上下限閾値と比較され、比較結果が外部
出力される特許請求の範囲第1項記載の押出機における
樹脂温度制御装置。
[Claims] 1) The cylinder section of the extruder is divided into a plurality of sections along the length, and includes a cylinder control block equipped with a heater and a temperature sensor, and a cylinder control block equipped with a heater and a temperature sensor, and A resin temperature detection section that directly detects the temperature is provided, and the temperature detected by the temperature detection element of the arbitrarily selected cylinder control block is used as the control amount of the resin temperature control loop that controls the resin temperature. Resin temperature control device for extruder. 2) The resin temperature control device for an extruder according to claim 1, wherein the resin temperature control loop is formed after the resin temperature detected by the resin temperature detection section falls within a predetermined deviation. 3) The resin temperature control device for an extruder according to claim 1, wherein the temperature detected by the temperature detector of the cylinder control block is compared with predetermined upper and lower thresholds, and the comparison result is outputted to the outside.
JP61252629A 1986-10-22 1986-10-22 Resin temperature control device for extruder Pending JPS63104814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61252629A JPS63104814A (en) 1986-10-22 1986-10-22 Resin temperature control device for extruder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61252629A JPS63104814A (en) 1986-10-22 1986-10-22 Resin temperature control device for extruder

Publications (1)

Publication Number Publication Date
JPS63104814A true JPS63104814A (en) 1988-05-10

Family

ID=17240017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61252629A Pending JPS63104814A (en) 1986-10-22 1986-10-22 Resin temperature control device for extruder

Country Status (1)

Country Link
JP (1) JPS63104814A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015002035A1 (en) * 2013-07-02 2015-01-08 富士フイルム株式会社 Twin-screw extrusion device and method for manufacturing film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015002035A1 (en) * 2013-07-02 2015-01-08 富士フイルム株式会社 Twin-screw extrusion device and method for manufacturing film
JP2015027785A (en) * 2013-07-02 2015-02-12 富士フイルム株式会社 Biaxial extrusion apparatus, and method for producing film

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