JPS63104459A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To perform surface mounting of materials on a hybrid integrated circuit device in an extremely simple and reliable manner by a method wherein a plurality of external electrode terminals, provided on the side end part of a hybrid integrated circuit substrate, are formed into L-shape by bending the other end of the substrate which is extendingly provided in the thickness direction of the substrate along the side end part toward the outside in the direction of the substrate surface. CONSTITUTION:A plurality of external connecting terminals 6, to be provided on the side end part of a hybrid integrated circuit substrate 5 leaving the prescribed intervals, are connected in such a manner that one end 6a of the terminal 6 is connected to the side of the hybrid integrated circuit substrate 5, and the other end 6b which is provided in extended form in the thickness direction of the substrate along the side end part of said hybrid integrated circuit substrate 5 is formed in L-shape by bending the other end 6b toward the outside in the direction of the substrate surface. Then, the hybrid integrated circuit device 1 is placed on the conductive jointed part of the printed wiring board consisting of a printed paste and the like in advance, and the section between the other end 6b of the external electrode terminal 6 and the conductive jointed part are heated up, aud said solder paste is fused and then solidified.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a hybrid integrated circuit device equipped with an external electrode terminal structure suitable for surface mounting on a printed wiring board or the like.

[Conventional technology]

Conventional DIP
ckage) type hybrid integrated circuit device had a structure as schematically shown in FIGS. 4 and 5. To briefly explain this, the hybrid integrated circuit device shown by reference numeral 1 in the figure includes a hybrid integrated circuit board 5 having active elements 3 and passive elements 4 mounted on a wiring film 2 on the surface thereof, and A plurality of external electrode terminals 6 are provided at predetermined intervals on the side end portion of the circuit board 5 by soldering or the like.

The hybrid integrated circuit device 1 having such a configuration is as follows:
For installation, the tip extending in the board thickness direction along the side edge of the hybrid integrated circuit board 5 is drilled into a mounting board (not shown) such as a printed wiring board on the main equipment side. In the case of in-depth soldering, the components were mounted on the mounting board by joining with a method such as soldering.

[Problem that the invention seeks to solve]

However, according to the hybrid integrated circuit device 1 using such an insertion mounting method, the mounting of the external electrode terminals 6 and the receiving board side requires troublesome positioning work with holes and insertion work, so automatic manufacturing is not possible. There are also problems such as difficulty in processing and inability to increase the mounting density on the mounting board I-, and it is necessary to take some measures to eliminate these problems.

The present invention has been made in view of the above-mentioned circumstances, and aims to provide a hybrid integrated circuit device that can be easily and appropriately mounted on a printed wiring board, etc. (=I board) using a surface mounting method. There is.

[Means for solving problems]

A hybrid integrated circuit device according to the present invention has a plurality of external electrode terminals provided at a side end of a hybrid integrated circuit board, one end of which is bonded to the side of the hybrid integrated circuit board, and a side end of the hybrid integrated circuit board. The other end extending in the thickness direction of the board is bent outward in the direction of the board surface to form an L-shape.

[Function] According to the present invention, a hybrid integrated circuit device can be manufactured by an extremely simple operation of placing an L-shaped external electrode terminal on the surface of a mounting board such as a printed wiring board and joining it to a conductor joint. surface mounting can be carried out extremely easily and reliably.

〔Example〕

Hereinafter, the present invention will be explained in detail using embodiments shown in the drawings.

Figures 1 to 3 show an embodiment of the hybrid integrated circuit device according to the present invention, and in these figures, the same or corresponding parts as in Figures 4 and 5 described above are designated by the same numbers. The explanation will be omitted.

Now, according to the present invention, a plurality of external connection terminals 6 provided at predetermined intervals on the side end portion of the hybrid integrated circuit board 5 are connected at one end 6a to the side of the hybrid integrated circuit board 5, and The feature is that the other end 6b extending in the board thickness direction along the side edge of the integrated circuit board 5 is bent outward in the board surface direction to form an L-shape. have.

In such a configuration, the hybrid integrated circuit device l is placed on a conductor joint portion (not shown) of a printed wiring board on which solder paste or the like is printed in advance, and the external electrode terminals 6 and other By performing a very simple operation of heating (reflowing) the solder paste between the end 6b and the corresponding conductor joint to melt and solidify the solder paste, this hybrid integrated circuit device ff1l can be assembled into a printed wiring board. It can be mounted very reliably in the cylinder at the mounting position.

It should be noted that the present invention is not limited to the structure of the embodiment described above, and it will be easily understood that the shape, structure, etc. of each part of the hybrid integrated circuit device 1 can be modified and changed as appropriate. Furthermore, the board on which such a hybrid integrated circuit device 1 is mounted is not limited to the above-mentioned printed wiring board, and various other boards may be used.

〔Effect of the invention〕

As explained above, according to the hybrid integrated circuit device according to No. 11, the external electrode terminal provided at the side end of the hybrid integrated circuit board is connected at one end to the hybrid integrated circuit board side, and The other end of the hybrid integrated circuit board, which extends in the board thickness direction along the side edge, is bent outward in the board surface direction to form an L-shape. Despite its low cost structure, it can be mounted on a mounting board such as a printed wiring board extremely easily and reliably using the surface mounting method. There are various excellent effects such as being able to increase the mounting density on the board.

[Brief explanation of the drawing]

FIG. 1 is a schematic side sectional view showing one embodiment of a hybrid integrated circuit device according to the present invention, FIG. 2 is a schematic perspective view thereof, FIG. 3 is an enlarged perspective view of main parts, and FIGS. 4 and 5 are FIG. 2 is a schematic cross-sectional view and a schematic perspective view of a conventional example. 1. Hybrid integrated circuit device, 2. Wiring film, 3.
...active element, 4...passive element, 5...hybrid integrated circuit board, 6...external electrode terminal.

Claims (1)

[Claims] A hybrid integrated circuit comprising a hybrid integrated circuit board on which an active element and a passive element connected to the active element are mounted, and a plurality of external electrode terminals provided at a predetermined interval on the side edge of this hybrid integrated circuit board. In the circuit device, one end of the external electrode terminal is bonded to the hybrid integrated circuit board, and the other end extends in the thickness direction of the board along the end of the hybrid integrated circuit board. A hybrid integrated circuit device, characterized in that the substrate is bent outward in the surface direction to form an L-shape.