JPS63101549U - - Google Patents

Info

Publication number
JPS63101549U
JPS63101549U JP1986203213U JP20321386U JPS63101549U JP S63101549 U JPS63101549 U JP S63101549U JP 1986203213 U JP1986203213 U JP 1986203213U JP 20321386 U JP20321386 U JP 20321386U JP S63101549 U JPS63101549 U JP S63101549U
Authority
JP
Japan
Prior art keywords
insulating substrate
metal base
printer head
optical printer
holding members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986203213U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986203213U priority Critical patent/JPS63101549U/ja
Publication of JPS63101549U publication Critical patent/JPS63101549U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5445Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
JP1986203213U 1986-12-23 1986-12-23 Pending JPS63101549U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986203213U JPS63101549U (enExample) 1986-12-23 1986-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986203213U JPS63101549U (enExample) 1986-12-23 1986-12-23

Publications (1)

Publication Number Publication Date
JPS63101549U true JPS63101549U (enExample) 1988-07-01

Family

ID=31168332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986203213U Pending JPS63101549U (enExample) 1986-12-23 1986-12-23

Country Status (1)

Country Link
JP (1) JPS63101549U (enExample)

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