JPS63100842U - - Google Patents
Info
- Publication number
- JPS63100842U JPS63100842U JP19447086U JP19447086U JPS63100842U JP S63100842 U JPS63100842 U JP S63100842U JP 19447086 U JP19447086 U JP 19447086U JP 19447086 U JP19447086 U JP 19447086U JP S63100842 U JPS63100842 U JP S63100842U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- filler
- base
- electrical signal
- gauge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19447086U JPS63100842U (en:Method) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19447086U JPS63100842U (en:Method) | 1986-12-19 | 1986-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100842U true JPS63100842U (en:Method) | 1988-06-30 |
Family
ID=31151473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19447086U Pending JPS63100842U (en:Method) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100842U (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470752U (en:Method) * | 1990-10-30 | 1992-06-23 | ||
| WO2018055667A1 (ja) * | 2016-09-20 | 2018-03-29 | 三菱電機株式会社 | 半導体装置 |
| WO2021106114A1 (ja) * | 2019-11-27 | 2021-06-03 | 三菱電機株式会社 | 半導体モジュール |
-
1986
- 1986-12-19 JP JP19447086U patent/JPS63100842U/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470752U (en:Method) * | 1990-10-30 | 1992-06-23 | ||
| WO2018055667A1 (ja) * | 2016-09-20 | 2018-03-29 | 三菱電機株式会社 | 半導体装置 |
| JPWO2018055667A1 (ja) * | 2016-09-20 | 2019-02-28 | 三菱電機株式会社 | 半導体装置 |
| WO2021106114A1 (ja) * | 2019-11-27 | 2021-06-03 | 三菱電機株式会社 | 半導体モジュール |
| JPWO2021106114A1 (en:Method) * | 2019-11-27 | 2021-06-03 | ||
| CN114730745A (zh) * | 2019-11-27 | 2022-07-08 | 三菱电机株式会社 | 半导体模块 |
| US12131969B2 (en) | 2019-11-27 | 2024-10-29 | Mitsubishi Electric Corporation | Semiconductor module |
| CN114730745B (zh) * | 2019-11-27 | 2025-09-05 | 三菱电机株式会社 | 半导体模块 |