JPS63100407U - - Google Patents

Info

Publication number
JPS63100407U
JPS63100407U JP19507486U JP19507486U JPS63100407U JP S63100407 U JPS63100407 U JP S63100407U JP 19507486 U JP19507486 U JP 19507486U JP 19507486 U JP19507486 U JP 19507486U JP S63100407 U JPS63100407 U JP S63100407U
Authority
JP
Japan
Prior art keywords
guide
transport mechanism
package type
line package
rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19507486U
Other languages
Japanese (ja)
Other versions
JPH0512167Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986195074U priority Critical patent/JPH0512167Y2/ja
Publication of JPS63100407U publication Critical patent/JPS63100407U/ja
Application granted granted Critical
Publication of JPH0512167Y2 publication Critical patent/JPH0512167Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Chutes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案による実施例の構成図、第2
図はZIPの外観図、第3図はレール2にZIP
を入れた状態説明図。 1a……ケース、1b……リード、1c……厚
さ、1d……深さ、2……レール、2a……溝、
2b……幅、2c……開口部、3……ガイド、3
a……先端、3b……取り付け部。
Figure 1 is a configuration diagram of an embodiment according to this invention, Figure 2
The figure is an external view of the ZIP, and the third figure shows the ZIP on rail 2.
State explanatory diagram with . 1a...Case, 1b...Lead, 1c...Thickness, 1d...Depth, 2...Rail, 2a...Groove,
2b...width, 2c...opening, 3...guide, 3
a...Tip, 3b...Attachment part.

Claims (1)

【実用新案登録請求の範囲】 インラインパツケージ型ICをレールにより搬
送するICの搬送機構において、 段面をコ字状に曲げ、先端が前記ICのリード
部分に達するように形成したガイドを設け、前記
ガイドによりケースの深さが異なる前記ICを保
持することを特徴とするインラインパツケージ型
ICの搬送機構。
[Scope of Claim for Utility Model Registration] In an IC transport mechanism for transporting an in-line package type IC by a rail, a guide is provided with a step surface bent in a U-shape and a tip thereof reaching a lead portion of the IC. A transport mechanism for an in-line package type IC, characterized in that the ICs having different case depths are held by a guide.
JP1986195074U 1986-12-18 1986-12-18 Expired - Lifetime JPH0512167Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986195074U JPH0512167Y2 (en) 1986-12-18 1986-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986195074U JPH0512167Y2 (en) 1986-12-18 1986-12-18

Publications (2)

Publication Number Publication Date
JPS63100407U true JPS63100407U (en) 1988-06-29
JPH0512167Y2 JPH0512167Y2 (en) 1993-03-29

Family

ID=31152631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986195074U Expired - Lifetime JPH0512167Y2 (en) 1986-12-18 1986-12-18

Country Status (1)

Country Link
JP (1) JPH0512167Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180210U (en) * 1984-05-11 1985-11-29 九州日本電気株式会社 Semiconductor element moving device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180210U (en) * 1984-05-11 1985-11-29 九州日本電気株式会社 Semiconductor element moving device

Also Published As

Publication number Publication date
JPH0512167Y2 (en) 1993-03-29

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