JPS6298230U - - Google Patents
Info
- Publication number
- JPS6298230U JPS6298230U JP19115385U JP19115385U JPS6298230U JP S6298230 U JPS6298230 U JP S6298230U JP 19115385 U JP19115385 U JP 19115385U JP 19115385 U JP19115385 U JP 19115385U JP S6298230 U JPS6298230 U JP S6298230U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- movable
- movable platen
- fixed
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図乃至第３図は、いずれも本考案型締装置
を備えた半導体素子の樹脂封止成形機の要部を示
すものであり、第１図は本考案装置の第１実施例
を示す一部切欠正面図、第２図はその第２実施例
を示す一部切欠正面図、第３図はその第３実施例
を示す一部切欠正面図である。第４図は従来の型
締装置例を示す一部切欠正面図である。
６…上型（固定側金型）、７…型締装置、７１
，７３，７４…支持往復動機構部、７２…往復動
機構部、８…可動プラテン、１３…下型（可動側
金型）、３８，３８ａ，３８ｂ…支受部材、４１
…オイルシリンダ、４２…ピストンロツド。
1 to 3 each show the main parts of a resin encapsulation molding machine for semiconductor devices equipped with the mold clamping device of the present invention, and FIG. 1 shows the first embodiment of the device of the present invention. FIG. 2 is a partially cutaway front view showing the second embodiment, and FIG. 3 is a partially cutaway front view showing the third embodiment. FIG. 4 is a partially cutaway front view showing an example of a conventional mold clamping device. 6... Upper mold (fixed side mold), 7... Mold clamping device, 7 1
, 7 3 , 7 4 ... Support reciprocating mechanism section, 7 2 ... Reciprocating mechanism section, 8... Movable platen, 13... Lower mold (movable side mold), 38, 38a, 38b... Supporting member, 41
...Oil cylinder, 42...Piston rod.
Claims (1)
の固着用可動プラテンと、該可動プラテンの支受
部材と、上記両金型の型締機構とから成り、上記
型締機構は、上記可動プラテンの支受部材を支持
すると共に、該支受部材を上記固定金型に対して
往復動させる該支受部材の支持往復動機構部と、
上記可動プラテンに固着した可動金型を上記固定
金型に対して型締めさせる該可動金型の往復動機
構部とから構成されていることを特徴とする半導
体素子の樹脂封止成形機における金型型締装置。 (2) 可動金型の往復動機構部が、可動プラテン
の支受部材の中央部に設けた大径状のオイルシリ
ンダと、該オイルシリンダに嵌装させた大径状の
ピストンロツド、及び、該ピストンロツドを往復
動させる油圧源とから成り、且つ、上記ピストン
ロツドと上記可動プラテンとを固着して構成した
ことを特徴とする実用新案登録請求の範囲第(1)
項に記載の半導体素子の樹脂封止成形機における
金型型締装置。[Scope of Claim for Utility Model Registration] (1) A movable platen for fixing a movable mold disposed opposite to a fixed mold, a support member for the movable platen, and a mold clamping mechanism for both molds. The mold clamping mechanism includes a support reciprocating mechanism section for supporting the support member of the movable platen and reciprocating the support member with respect to the fixed mold;
and a reciprocating mechanism for the movable mold that clamps the movable mold fixed to the movable platen against the fixed mold. Mold clamping device. (2) The reciprocating mechanism of the movable mold includes a large diameter oil cylinder provided in the center of the support member of the movable platen, a large diameter piston rod fitted in the oil cylinder, and and a hydraulic power source for reciprocating a piston rod, and the piston rod and the movable platen are fixed to each other.Claim No. (1)
A mold clamping device for a resin encapsulation molding machine for semiconductor devices as described in 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985191153U JPH0432756Y2 (en) | 1985-12-12 | 1985-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985191153U JPH0432756Y2 (en) | 1985-12-12 | 1985-12-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6298230U true JPS6298230U (en) | 1987-06-23 |
| JPH0432756Y2 JPH0432756Y2 (en) | 1992-08-06 |
Family
ID=31145029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985191153U Expired JPH0432756Y2 (en) | 1985-12-12 | 1985-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432756Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235692A (en) * | 2011-10-13 | 2012-11-29 | Mitsui High Tec Inc | Resin sealing device of permanent magnets |
| US8728375B2 (en) | 2005-01-24 | 2014-05-20 | Mitsui High-Tec, Inc. | Method of resin sealing permanent magnets in laminated rotor core |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225888U (en) * | 1985-07-30 | 1987-02-17 |
-
1985
- 1985-12-12 JP JP1985191153U patent/JPH0432756Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225888U (en) * | 1985-07-30 | 1987-02-17 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8728375B2 (en) | 2005-01-24 | 2014-05-20 | Mitsui High-Tec, Inc. | Method of resin sealing permanent magnets in laminated rotor core |
| US10498203B2 (en) | 2005-01-24 | 2019-12-03 | Mitsui High-Tec, Inc. | Method of resin sealing permanent magnets in laminated rotor core |
| JP2012235692A (en) * | 2011-10-13 | 2012-11-29 | Mitsui High Tec Inc | Resin sealing device of permanent magnets |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432756Y2 (en) | 1992-08-06 |
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