JPS6296880U - - Google Patents
Info
- Publication number
- JPS6296880U JPS6296880U JP18726385U JP18726385U JPS6296880U JP S6296880 U JPS6296880 U JP S6296880U JP 18726385 U JP18726385 U JP 18726385U JP 18726385 U JP18726385 U JP 18726385U JP S6296880 U JPS6296880 U JP S6296880U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- mounting surface
- wiring board
- printed wiring
- foil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18726385U JPS6296880U (zh) | 1985-12-06 | 1985-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18726385U JPS6296880U (zh) | 1985-12-06 | 1985-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296880U true JPS6296880U (zh) | 1987-06-20 |
Family
ID=31137583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18726385U Pending JPS6296880U (zh) | 1985-12-06 | 1985-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296880U (zh) |
-
1985
- 1985-12-06 JP JP18726385U patent/JPS6296880U/ja active Pending