JPS6294648U - - Google Patents
Info
- Publication number
- JPS6294648U JPS6294648U JP18754385U JP18754385U JPS6294648U JP S6294648 U JPS6294648 U JP S6294648U JP 18754385 U JP18754385 U JP 18754385U JP 18754385 U JP18754385 U JP 18754385U JP S6294648 U JPS6294648 U JP S6294648U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- bump
- tip
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18754385U JPS6294648U (de) | 1985-12-05 | 1985-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18754385U JPS6294648U (de) | 1985-12-05 | 1985-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6294648U true JPS6294648U (de) | 1987-06-17 |
Family
ID=31138099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18754385U Pending JPS6294648U (de) | 1985-12-05 | 1985-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6294648U (de) |
-
1985
- 1985-12-05 JP JP18754385U patent/JPS6294648U/ja active Pending