JPS6294592U - - Google Patents
Info
- Publication number
- JPS6294592U JPS6294592U JP18602185U JP18602185U JPS6294592U JP S6294592 U JPS6294592 U JP S6294592U JP 18602185 U JP18602185 U JP 18602185U JP 18602185 U JP18602185 U JP 18602185U JP S6294592 U JPS6294592 U JP S6294592U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- contact electrode
- contacts
- socket
- dropping guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000035939 shock Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第1図は本考案の1実施例を示し、垂直断面を
模式化して描いた説明図である。第2図は薄形I
Cの斜視図、第3図は従来のICソケツトの説明
図である。
1……パツケージ、2……リード、3……ソケ
ツト本体、3a……凹部、4……コンタクト電極
、5……落下ガイド、5a……テーパ状斜面、6
……薄形IC、7……ハンマ、7a……枢支軸、
7b……アーム、A……ICの所定の位置、D…
…ハンマ駆動装置。
FIG. 1 shows one embodiment of the present invention, and is an explanatory diagram schematically depicting a vertical cross section. Figure 2 shows thin type I
A perspective view of C and FIG. 3 are explanatory diagrams of a conventional IC socket. DESCRIPTION OF SYMBOLS 1... Package cage, 2... Lead, 3... Socket body, 3a... Recessed part, 4... Contact electrode, 5... Drop guide, 5a... Tapered slope, 6
... Thin IC, 7 ... Hammer, 7a ... Pivot shaft,
7b...Arm, A...Predetermined position of IC, D...
...Hammer drive device.
Claims (1)
クト電極と、ICのパツケージに摺触して該IC
を所定の位置に誘導するテーパ状斜面とを設けた
ワーク落下ガイドとを備えたICソケツトにおい
て、上記のワーク落下ガイドに対して衝撃および
振動の少なくとも何れか一方を与える手段を設け
たことを特徴とする、ICの挿入を容易にならし
めたICソケツト。 A contact electrode that faces and contacts the leads of an IC and is electrically conductive, and a contact electrode that contacts the IC package and connects the IC.
An IC socket equipped with a workpiece dropping guide provided with a tapered slope for guiding the workpiece to a predetermined position, characterized in that means is provided for applying at least one of shock and vibration to the workpiece dropping guide. An IC socket that makes it easy to insert an IC.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18602185U JPS6294592U (en) | 1985-12-04 | 1985-12-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18602185U JPS6294592U (en) | 1985-12-04 | 1985-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6294592U true JPS6294592U (en) | 1987-06-16 |
Family
ID=31135196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18602185U Pending JPS6294592U (en) | 1985-12-04 | 1985-12-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6294592U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005339894A (en) * | 2004-05-25 | 2005-12-08 | Three M Innovative Properties Co | Socket for testing ball grid array integrated circuit |
JP2015072158A (en) * | 2013-10-02 | 2015-04-16 | 三菱電機株式会社 | Semiconductor test jig, transportation jig thereof, and foreign substance removing method using the same |
-
1985
- 1985-12-04 JP JP18602185U patent/JPS6294592U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005339894A (en) * | 2004-05-25 | 2005-12-08 | Three M Innovative Properties Co | Socket for testing ball grid array integrated circuit |
JP2015072158A (en) * | 2013-10-02 | 2015-04-16 | 三菱電機株式会社 | Semiconductor test jig, transportation jig thereof, and foreign substance removing method using the same |
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