JPS6292652U - - Google Patents

Info

Publication number
JPS6292652U
JPS6292652U JP1985185837U JP18583785U JPS6292652U JP S6292652 U JPS6292652 U JP S6292652U JP 1985185837 U JP1985185837 U JP 1985185837U JP 18583785 U JP18583785 U JP 18583785U JP S6292652 U JPS6292652 U JP S6292652U
Authority
JP
Japan
Prior art keywords
package
heat
conductor
conductive sheet
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985185837U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985185837U priority Critical patent/JPS6292652U/ja
Publication of JPS6292652U publication Critical patent/JPS6292652U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1985185837U 1985-12-02 1985-12-02 Pending JPS6292652U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985185837U JPS6292652U (enExample) 1985-12-02 1985-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985185837U JPS6292652U (enExample) 1985-12-02 1985-12-02

Publications (1)

Publication Number Publication Date
JPS6292652U true JPS6292652U (enExample) 1987-06-13

Family

ID=31134838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985185837U Pending JPS6292652U (enExample) 1985-12-02 1985-12-02

Country Status (1)

Country Link
JP (1) JPS6292652U (enExample)

Similar Documents

Publication Publication Date Title
JPS6292652U (enExample)
JPS6410676U (enExample)
JPH0381640U (enExample)
JPH01174993U (enExample)
JPS6359339U (enExample)
JPS6448095U (enExample)
JPS6255395U (enExample)
JPH01108943U (enExample)
JPH0334292U (enExample)
JPH01136828U (enExample)
JPS61174775U (enExample)
JPH0179846U (enExample)
JPS605840U (ja) 熱印字ヘツド
JPH0178040U (enExample)
JPS5858348U (ja) 電子冷却装置
JPS61151392U (enExample)
JPS6161894U (enExample)
JPS624191U (enExample)
JPS6312845U (enExample)
JPS6214794U (enExample)
JPS63187344U (enExample)
JPH0330440U (enExample)
JPS61190143U (enExample)
JPS62204396U (enExample)
JPH0181512U (enExample)