JPS6292604U - - Google Patents
Info
- Publication number
- JPS6292604U JPS6292604U JP18592885U JP18592885U JPS6292604U JP S6292604 U JPS6292604 U JP S6292604U JP 18592885 U JP18592885 U JP 18592885U JP 18592885 U JP18592885 U JP 18592885U JP S6292604 U JPS6292604 U JP S6292604U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- right ends
- component body
- chip
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18592885U JPS6292604U (da) | 1985-12-02 | 1985-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18592885U JPS6292604U (da) | 1985-12-02 | 1985-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6292604U true JPS6292604U (da) | 1987-06-13 |
Family
ID=31135014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18592885U Pending JPS6292604U (da) | 1985-12-02 | 1985-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6292604U (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014185010A1 (ja) * | 2013-05-13 | 2014-11-20 | パナソニックＩｐマネジメント株式会社 | 半導体素子およびその製造方法、半導体モジュールおよびその製造方法、並びに、半導体パッケージ |
-
1985
- 1985-12-02 JP JP18592885U patent/JPS6292604U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014185010A1 (ja) * | 2013-05-13 | 2014-11-20 | パナソニックＩｐマネジメント株式会社 | 半導体素子およびその製造方法、半導体モジュールおよびその製造方法、並びに、半導体パッケージ |
| US9362366B2 (en) | 2013-05-13 | 2016-06-07 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor package |
| JP5942212B2 (ja) * | 2013-05-13 | 2016-06-29 | パナソニックＩｐマネジメント株式会社 | 半導体素子およびその製造方法、半導体モジュールおよびその製造方法、並びに、半導体パッケージ |