JPS6292498A - Semiconductor device container board - Google Patents

Semiconductor device container board

Info

Publication number
JPS6292498A
JPS6292498A JP60232613A JP23261385A JPS6292498A JP S6292498 A JPS6292498 A JP S6292498A JP 60232613 A JP60232613 A JP 60232613A JP 23261385 A JP23261385 A JP 23261385A JP S6292498 A JPS6292498 A JP S6292498A
Authority
JP
Japan
Prior art keywords
semiconductor device
air
fixed
casters
storage board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60232613A
Other languages
Japanese (ja)
Inventor
中嶋 享一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP60232613A priority Critical patent/JPS6292498A/en
Publication of JPS6292498A publication Critical patent/JPS6292498A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 本発明は大容量の半導体装置の収納盤に関する。[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a storage board for large-capacity semiconductor devices.

〔従来技術とその問題点〕[Prior art and its problems]

大容量の半導体装置は枠体に組込んで盤に収納されるの
が普通であるが、装置の重量が大となるので搬送および
盤内への収納作業ができるだけ容易に行えるものである
ことがのぞましい。
Large-capacity semiconductor devices are usually assembled into a frame and stored in a panel, but since the weight of the device is large, it is important to make transportation and storage into the panel as easy as possible. Delicious.

従来枠体に組込んだ半導体装置はフォークリフト、クレ
ーン等により盤前面まで運ばれるが、盤内への組込み作
業は雑種と装置枠体との隙間が僅かであるのでフォーク
リフトによる搬入は無理であり、人力によって盤内で装
置を移動させて所定位置に固定するようにしていた。盤
内の狭いスペースで重い装置を前後左右に移動させるの
は容易でなく多大の労力を要し、また危険を伴うといっ
た欠点があった。
Conventionally, semiconductor devices assembled in a frame are carried to the front of the panel by a forklift, crane, etc., but when it comes to assembling them into the panel, the gap between the hybrid and the device frame is so small that it is impossible to carry them in by a forklift. The device had to be manually moved within the panel and fixed in place. Moving heavy equipment back and forth and left and right in a narrow space inside a panel is not easy, requires a lot of effort, and is also dangerous.

〔発明の目的〕[Purpose of the invention]

本発明は前記の欠点を除去し、重量の大なる半導体装置
を人力によって容易に盤内で移動させて固定することが
できるようにした半導体装置の収納盤を提供することを
目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a storage board for semiconductor devices which eliminates the above-mentioned drawbacks and allows heavy semiconductor devices to be easily moved and fixed within the board by manual effort.

〔発明の要点〕[Key points of the invention]

本発明は半導体装置の枠体底面に設けた溝状上げ底部の
下部にエアー浮上式ボールキャスタを挿入し、キャスタ
に圧縮空気を吹込んで装置を浮上させて盤内所定位置に
移動させた後空気を抜いて装置を固定するようにしよう
とする本のである。
The present invention involves inserting air floating ball casters into the lower part of a groove-like raised bottom provided on the bottom of the frame of a semiconductor device, and blowing compressed air into the casters to levitate the device and move it to a predetermined position in the panel. This is a book about trying to fix the device by pulling it out.

〔発明の実施例〕[Embodiments of the invention]

第1図は本発明の実施例の半導体装置の収納盤を示す。 FIG. 1 shows a storage board for semiconductor devices according to an embodiment of the present invention.

収納盤1の固定台2に半導体装置3が収納されるが、半
導体装置3の枠体下面の両端部に設けた溝状上げ底部に
エアー浮上式ボールキャスタ4が挿入されている。半導
体装置3はフォークリフトまたはクレーンによって運ん
で盤前面に設けた組立用台5に載置されたうえエアー浮
上式ボールキャスタに圧縮空気を吹込んで装置を浮上さ
せ盤内定位置まで人力によって移動され、その位置で空
気を抜いて装置を下降させて固定するようにしている。
A semiconductor device 3 is housed in a fixed base 2 of a storage board 1, and air floating ball casters 4 are inserted into groove-like raised bottoms provided at both ends of the lower surface of the frame of the semiconductor device 3. The semiconductor device 3 is carried by a forklift or a crane and placed on an assembly table 5 provided on the front of the panel. Compressed air is blown into air floating ball casters to levitate the device and it is moved by hand to a fixed position inside the panel. At this point, the air is removed and the device is lowered and fixed.

第2〜4図はエアー浮上式ボールキャスタを示す。エア
ー浮上式ボールキャスタ4は空気層41よシ複数のボー
ル42が突出しており、エアーホース接続口43よシ圧
縮空気を吹込むとボール42が第3図の如く突出し、こ
の状態でボールを下部して荷重を支えて床上を転動する
ことができる。空気を抜けば第4図の如くボールは沈む
Figures 2 to 4 show an air floating ball caster. The air floating ball caster 4 has a plurality of balls 42 protruding from the air layer 41. When compressed air is blown through the air hose connection port 43, the balls 42 protrude as shown in Fig. 3. It can roll on the floor while supporting the load. When the air is released, the ball sinks as shown in Figure 4.

第5図は本発明の実施例の盤に収納する半導体装置を示
すもので半導体素子および部品を組込んだ枠体の底面3
1の両側端に溝状上げ底32が設けられ、これらの上底
にエアー浮上式ボールキャスタ4が嵌め込み固着されて
いる。第6図および第7図はキャスタ取付部詳細を示す
もので、キャスタ4は接着剤で溝状上げ底に接着したう
え爪状止め金6で溝の端部に固定されている。キャスタ
4に圧縮空気を吹込むと第6図に示すごとくボール42
が突出して半導体装置3はボールに支えられて浮上し、
人力で押して移動可能となるので盤内の所定位置に搬入
し、そこで空気を抜くと第7図に示すごとく半導体装置
3は下降して固定台2に装置底面に設けた取付穴33を
通してボルト7によって固定される。
FIG. 5 shows a semiconductor device housed in a board according to an embodiment of the present invention, and shows the bottom surface 3 of a frame body in which semiconductor elements and parts are incorporated.
Groove-shaped raised bottoms 32 are provided at both ends of the ball caster 1, and air floating ball casters 4 are fitted and fixed to these upper bottoms. FIGS. 6 and 7 show details of the caster attachment part, in which the casters 4 are bonded to the grooved raised bottom with adhesive and are fixed to the ends of the groove with claw-shaped clasps 6. When compressed air is blown into the caster 4, the ball 42 is released as shown in FIG.
protrudes and the semiconductor device 3 floats supported by the ball,
Since it can be moved by pushing manually, it is carried into a predetermined position in the panel, and when the air is removed there, the semiconductor device 3 is lowered as shown in FIG. Fixed by

第8図は本発明の他の実施例の盤に収納する半導体装置
を示す。半導体素子および部品を組込んだ枠体の底面3
1の両側端に溝状上げ底32が設けられ、これらの上げ
底に着脱自在のエアー浮上式ボールキャスタが挿入され
る。第9〜11図はキャスタ挿入部の詳細を示すもので
、キャスタ4は空気を抜いた状態で溝状上げ底に軽く挿
入できるようになっておシ、挿入したキャスタに圧縮空
気を吹き込むと半導体装置3は第9図に示すようにキャ
スタのボールに支えられて浮上する。この状態でキャス
タ4は溝状上げ底32に圧接され、摩擦係数によって固
定されるので人力によって移動可能となる。半導体装置
を盤内定位置に移動させてキャスタの空気を抜くと第1
0図に示すごとく、半導体装置3は下降して底板31が
固定台2に密着してキャスタ4け上げ底より抜き出せる
ようになる。第11図に示すごとくキャスタを抜き出し
、取付穴33を通してボルト7によって半導体装置3は
固定台2に固定される。このようにすればキャスタは装
置の搬出入時のみに用いるので、多くの盤に共用するこ
とができる。
FIG. 8 shows a semiconductor device housed in a board according to another embodiment of the present invention. Bottom surface 3 of the frame incorporating semiconductor elements and parts
Groove-shaped raised bottoms 32 are provided at both ends of 1, and removable air floating ball casters are inserted into these raised bottoms. Figures 9 to 11 show the details of the caster insertion part, and the caster 4 can be lightly inserted into the grooved raised bottom with the air removed. When compressed air is blown into the inserted caster, the semiconductor device 3 floats supported by the balls of the casters as shown in FIG. In this state, the casters 4 are pressed against the raised grooved bottom 32 and fixed by the coefficient of friction, so that they can be moved by human power. When the semiconductor device is moved to the position inside the panel and the air is removed from the casters, the first
As shown in FIG. 0, the semiconductor device 3 is lowered, the bottom plate 31 comes into close contact with the fixing base 2, and the semiconductor device 3 can be pulled out from the bottom by raising the casters 4. As shown in FIG. 11, the casters are taken out, and the semiconductor device 3 is fixed to the fixing base 2 with bolts 7 through the mounting holes 33. In this way, the casters are used only when loading and unloading the device, so they can be shared by many panels.

〔発明の効果〕〔Effect of the invention〕

 5一 本発明によれば大容量の半導体装置が人力によって容易
に収納盤へ搬入出できるようになるので労力軽減と保守
性向上の効果がある。
51 According to the present invention, large-capacity semiconductor devices can be easily carried in and out of the storage board by human power, which has the effect of reducing labor and improving maintainability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例の半導体装置の収納盤の斜視図
、第2図はエアー浮上式ボールキャスタの斜視図、第3
図および第4図は第2図の側面図、j45図は本発明の
実施例の盤に収納する半導体装置の斜視図、第6図およ
び第7図は第5図のP部詳細正面図、第8図は本発明の
他の実施例の盤に収納する半導体装置の斜視図、第9〜
11図は第8図のP部詳細正面図である。 1・・・収納盤、2・・・固定台、3・・・半導体装置
、4・・・エアー浮上式ボールキャスタ、5・・・組立
用台、6・・・止め金、7・・・ボルト、31・・・枠
体底面、32・・・溝状上げ底、33・・・取付穴、4
1・・・空気層、42・・・ボール、43・・・エアー
ホース接続口。
FIG. 1 is a perspective view of a storage board for semiconductor devices according to an embodiment of the present invention, FIG. 2 is a perspective view of an air floating ball caster, and FIG.
4 is a side view of FIG. 2, FIG. FIG. 8 is a perspective view of a semiconductor device housed in a board according to another embodiment of the present invention;
FIG. 11 is a detailed front view of section P in FIG. 8. DESCRIPTION OF SYMBOLS 1... Storage board, 2... Fixing stand, 3... Semiconductor device, 4... Air floating ball caster, 5... Assembly stand, 6... Stopper, 7... Bolt, 31...Bottom surface of frame body, 32...Groove raised bottom, 33...Mounting hole, 4
1...Air layer, 42...Ball, 43...Air hose connection port.

Claims (1)

【特許請求の範囲】 1)底面に設けた溝状上げ底の下部に空気圧浮上装置を
設け、浮上させて移動可能とした半導体装置を、その内
部に引入れその固定台の所定位置で前記空気圧浮上装置
の空気を抜いて固定するようにしたことを特徴とする半
導体装置の収納盤。 2)特許請求の範囲第1項記載の半導体装置の収納盤に
おいて、空気圧浮上装置が前記溝状上げ底に挿入して固
着するエアー浮上式ボールキャスタである半導体装置の
収納盤。 3)特許請求の範囲第1項記載の半導体装置の収納盤に
おいて空気圧浮上装置が前記溝状上げ底に着脱自在とす
るエアー浮上式ボールキャスタである半導体装置の収納
盤。
[Claims] 1) A pneumatic levitation device is provided at the lower part of the groove-shaped raised bottom provided on the bottom surface, and the semiconductor device, which is made levitated and movable, is pulled into the device and the pneumatic levitation device is placed at a predetermined position on the fixed base. A storage board for semiconductor devices, characterized in that the device is fixed by removing air from the device. 2) The semiconductor device storage board according to claim 1, wherein the pneumatic levitation device is an air levitation ball caster that is inserted into and fixed to the grooved raised bottom. 3) A semiconductor device storage board according to claim 1, wherein the pneumatic levitation device is an air floating ball caster that can be attached to and removed from the grooved raised bottom.
JP60232613A 1985-10-18 1985-10-18 Semiconductor device container board Pending JPS6292498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60232613A JPS6292498A (en) 1985-10-18 1985-10-18 Semiconductor device container board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60232613A JPS6292498A (en) 1985-10-18 1985-10-18 Semiconductor device container board

Publications (1)

Publication Number Publication Date
JPS6292498A true JPS6292498A (en) 1987-04-27

Family

ID=16942083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60232613A Pending JPS6292498A (en) 1985-10-18 1985-10-18 Semiconductor device container board

Country Status (1)

Country Link
JP (1) JPS6292498A (en)

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